公开(公告)号：US20150214456A1

公开(公告)日：2015-07-30

申请号：US14607217

申请日：2015-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Gon KIM ,  Sook Hyun Kim ,  Jong Bae Shin ,  Boone Won ,  Yong Sang Cho ,  Hyung Eui Lee

IPC: H01L35/16 ,  H01L35/22 ,  H01L35/18

CPC classification number: H01L35/16 ,  C22C1/0483 ,  C22C32/0015 ,  C22C32/0089 ,  H01L35/00 ,  H01L35/18 ,  H01L35/22

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Abstract translation: 提供了包括金属氧化物粉末和热电粉末的热电材料。 因此，内部填充率提高，从而可以根据导电率和塞贝克系数的增加以及热导率的降低来最大化珀尔帖效应，从而能够提高热电元件的品质因数（ZT） 。

公开(公告)号：US10903410B2

公开(公告)日：2021-01-26

申请号：US16402582

申请日：2019-05-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/32 ,  H01L35/30

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US09947854B2

公开(公告)日：2018-04-17

申请号：US14913220

申请日：2014-08-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/26 ,  H01L35/32 ,  H01L35/30

CPC classification number: H01L35/325 ,  H01L35/30 ,  H01L35/32

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US11227987B2

公开(公告)日：2022-01-18

申请号：US16618533

申请日：2018-06-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Sook Hyun Kim ,  Yong Joo Lee ,  Jun Lee

IPC: H01L35/30 ,  H01L23/367 ,  H01L35/10 ,  H01L35/32

Abstract: A heat conversion device according to an embodiment of the present invention comprises: a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs which are electrically connected and arranged in an array; an insulating part disposed on one surface of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a heat sink disposed on the insulating part; a fan disposed spaced a predetermined distance from the heat sink; and a plurality of fastening members having moduli of elasticity of 1*103 kgf/cm2 to 30*103 kgf/cm2 and fixing the heat sink and the fan. Each one of the fastening members comprises: a shaft part; a first fixed part which is disposed at one end of the shaft part and fixed to the heat sink; a second fixed part which protrudes from an outer circumferential surface of the shaft part and is fixed to the fan; and a separating part which protrudes from the outer circumferential surface of the shaft part and is disposed between the heat sink and the fan to separate the heat sink and the fan, wherein the width of the second fixed part increases toward the first fixed part, and the shaft part, the first fixed part, the second fixed part, and the separating part are integrally formed.

公开(公告)号：US10326070B2

公开(公告)日：2019-06-18

申请号：US15914116

申请日：2018-03-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/32 ,  H01L35/30

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US09595652B2

公开(公告)日：2017-03-14

申请号：US14607217

申请日：2015-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Gon Kim ,  Sook Hyun Kim ,  Jong Bae Shin ,  Boone Won ,  Yong Sang Cho ,  Hyung Eui Lee

IPC: H01L35/16 ,  H01L35/18 ,  H01L35/22 ,  C22C32/00 ,  H01L35/00 ,  C22C1/04

CPC classification number: H01L35/16 ,  C22C1/0483 ,  C22C32/0015 ,  C22C32/0089 ,  H01L35/00 ,  H01L35/18 ,  H01L35/22

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Abstract translation: 提供了包括金属氧化物粉末和热电粉末的热电材料。 因此，内部填充率提高，从而可以根据导电率和塞贝克系数的增加以及热导率的降低来最大化珀尔帖效应，从而能够提高热电元件的品质因数（ZT） 。

公开(公告)号：US20160204325A1

公开(公告)日：2016-07-14

申请号：US14913530

申请日：2014-08-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang Cho ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Jong Bae Shin ,  Boone Won ,  Jong Min Lee

IPC: H01L35/04 ,  H01L35/16 ,  H01L35/30

CPC classification number: H01L35/04 ,  H01L35/16 ,  H01L35/30

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.

Abstract translation: 本发明的实施例涉及一种热电元件和热电模块，并且可以提供一种热电元件和热电模块，其具有明显提高的冷却能力（Qc）和温度变化率（AT），其通过构造热电元件 通过堆叠单元构件，每个单元构件在衬底上包括半导体层，从而降低导热性并提高导电性。

公开(公告)号：US20150333246A1

公开(公告)日：2015-11-19

申请号：US14710946

申请日：2015-05-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Min Lee ,  Sang Gon Kim ,  Sook Hyun Kim ,  Chae Hoon Kim ,  Myoung Lae Roh ,  Joong Hyun Park ,  Hyung Min Sohn ,  Jong Bae Shin ,  Boone Won ,  Yong Sang Cho ,  Yun Kyoung Jo

IPC: H01L35/32 ,  H01L35/30

CPC classification number: H01L35/30 ,  H01L35/32

Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.

Abstract translation: 提供一种热转换装置，包括：单元热电模块，包括第一半导体元件和第二半导体元件; 以及通过与所述单元热电模块接触来进行热转换的热转换模块，其中所述热转换模块包括：热转换衬底，其与所述第一半导体元件的一端和另一端中的至少任一个直接接触 或第二半导体元件; 以及设置在所述热转换基板上的辐射单元。