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公开(公告)号：US20220293554A1
公开(公告)日：2022-09-15
申请号：US17636211
申请日：2020-08-20
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA , Yosuke SATO
Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying a back surface side of the semiconductor chip to the film-form firing material on the support sheet to face each other; peeling off the film-form firing material and the semiconductor chip from the support sheet; applying, to a substrate, a film-form firing material side of the semiconductor chip to which the film-form firing material has been applied; and heating the film-form firing material to 200° C. or higher to sinter-bond the semiconductor chip and the substrate.
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公开(公告)号：US20200277515A1
公开(公告)日：2020-09-03
申请号：US16646546
申请日：2018-09-04
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA , Akinori SATO
IPC: C09J7/10 , C09J11/04 , H01L21/78 , H01L21/683 , H01L23/00
Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.
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公开(公告)号：US20230018086A1
公开(公告)日：2023-01-19
申请号：US17777926
申请日：2020-11-20
Applicant: LINTEC Corporation
Inventor： Hidekazu NAKAYAMA , Isao ICHIKAWA , Yosuke SATO
Abstract: The present invention relates to a film-shaped firing material (1) which contains: sinterable metal particles (10); a binder component (20) that is a solid at room temperature; and a liquid component (30) that is a liquid at room temperature, the liquid component having a boiling point from 300 to 450° C.
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公开(公告)号：US20200376549A1
公开(公告)日：2020-12-03
申请号：US16608288
申请日：2018-03-15
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA
Abstract: A film-shaped fired material of the present invention is a film-shaped fired material 1 which contains sinterable metal particles 10 and a binder component 20, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of “A1
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Patent Agency Ranking
公开(公告)号：US20200276645A1
公开(公告)日：2020-09-03
申请号：US16645916
申请日：2018-09-03
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA
Abstract: A film-shaped firing material 1 is provided, including sinterable metal particles 10 and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a shrinkage factor in a planar direction of the film-shaped firing material after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes is 10% or less with respect to the shrinkage factor before the firing, and a volume shrinkage factor thereof is in a range of 15% to 90% with respect to the volume shrinkage factor before the firing, and a contact ratio of the film-shaped firing material with an adherend after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes in a state in which the film-shaped firing material is in contact with the adherend is 90% or greater with respect to a contact area of the adherend.
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公开(公告)号：US20200273596A1
公开(公告)日：2020-08-27
申请号：US16650225
申请日：2018-09-28
Applicant: LINTEC Corporation
Inventor： Takeshi MORI , Hidekazu NAKAYAMA , Isao ICHIKAWA , Yukiharu NOSE
Abstract: The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (10), a binder component (20), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.
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公开(公告)号：US20220293555A1
公开(公告)日：2022-09-15
申请号：US17636309
申请日：2020-08-20
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA , Yosuke SATO
Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.
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公开(公告)号：US20210121959A1
公开(公告)日：2021-04-29
申请号：US16605373
申请日：2018-02-13
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA
IPC: B22F5/00 , B22F1/00 , B22F7/04 , H01L21/683 , H01L23/00 , C09J133/08 , C09J1/00
Abstract: This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.
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公开(公告)号：US20210078080A1
公开(公告)日：2021-03-18
申请号：US16970484
申请日：2019-02-08
Applicant: LINTEC CORPORATION
Inventor： Takeshi MORI , Isao ICHIKAWA , Hidekazu NAKAYAMA
Abstract: A film-shaped firing material (1) is provided, including first metal particles (10), second metal particles (20), and a binder component (30), in which the average particle diameter of the first metal particles (10) is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles (20) is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.
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