公开(公告)号：US20160211163A1

公开(公告)日：2016-07-21

申请号：US14914358

申请日：2014-08-29

Applicant: LINTEC CORPORATION

Inventor： Shigeyuki YAMASHITA ,  Akinori SATO

IPC: H01L21/683 ,  C09J7/02

CPC classification number: H01L21/6836 ,  C08K5/0025 ,  C08K5/0075 ,  C08L2312/06 ,  C09J7/385 ,  C09J9/02 ,  C09J133/14 ,  C09J2201/122 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/31 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  C09J133/08 ,  C08L33/14 ,  C08L75/16

Abstract: A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.

Abstract translation: 一种半导体处理片，所述片包括层压在所述基材的至少一个表面上的基材和压敏粘合剂层，所述压敏粘合剂层由压敏粘合剂组合物形成，所述压敏粘合剂组合物含有聚合物 具有盐和能量射线固化性基团和能量射线固化型压敏粘合剂成分（不包括上述聚合物）。 半导体处理片能够抑制能量射线照射后的剥离时的粘着剂的污染，同时具有足够的抗静电性。

公开(公告)号：US20190055396A1

公开(公告)日：2019-02-21

申请号：US15770529

申请日：2016-11-02

Applicant: LINTEC Corporation

Inventor： Akinori SATO ,  Masanori YAMAGISHI

IPC: C08L63/00 ,  B32B27/08 ,  B32B27/38 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  C08L33/08 ,  C09J7/38 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

公开(公告)号：US20180327637A1

公开(公告)日：2018-11-15

申请号：US15769469

申请日：2016-11-02

Applicant: LINTEC Corporation

Inventor： Masanori YAMAGISHI ,  Akinori SATO

IPC: C09J7/38 ,  C09J201/00 ,  H01L23/31 ,  H01L21/78 ,  H01L21/683 ,  B32B27/08 ,  B32B27/26 ,  B32B27/38 ,  H01L23/00

Abstract: This curable resin film is attached to a surface having bumps of a semiconductor wafer and is cured so as to form a first protective film on the surface, and when the curable resin film is cured by being heated at 160° C. for one hour, a yellow index (YI1) after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index (YI2) after curing is equal to or lower than 45. The first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

公开(公告)号：US20220135828A1

公开(公告)日：2022-05-05

申请号：US17575811

申请日：2022-01-14

Applicant: LINTEC Corporation

Inventor： Masanori YAMAGISHI ,  Akinori SATO

IPC: C09D133/04 ,  C09J163/00 ,  C09J7/20 ,  C09J7/30 ,  C09J4/06 ,  C09J7/25 ,  C09J7/38 ,  C08L63/00 ,  H01L23/00

Abstract: A curable resin film of the present invention forms a first protective film (la) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film (1a) at a center position between the bumps (51) to an average peak height (h1) of the bumps (51), and a ratio (h2/h1) of an average thickness (h2) of the first protective film (1a) at a position being in contact with the plurality of bumps (51) to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].

公开(公告)号：US20180320029A1

公开(公告)日：2018-11-08

申请号：US15769189

申请日：2016-11-02

Applicant: LINTEC Corporation

Inventor： Masanori YAMAGISHI ,  Akinori SATO

IPC: C09J7/25 ,  C09J7/38 ,  C08L63/00 ,  H01L23/00

CPC classification number: C09J7/25 ,  C08L63/00 ,  C08L2203/16 ,  C08L2203/20 ,  C09J7/00 ,  C09J7/20 ,  C09J7/38 ,  C09J163/00 ,  H01L24/26 ,  H01L2224/11 ,  H01L2224/11515

Abstract: A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film (1a) at a center position between the bumps (51) to an average peak height (h1) of the bumps (51), and a ratio (h2/h1) of an average thickness (h2) of the first protective film (1a) at a position being in contact with the plurality of bumps (51) to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].

公开(公告)号：US20190330465A1

公开(公告)日：2019-10-31

申请号：US16460280

申请日：2019-07-02

Applicant: LINTEC Corporation

Inventor： Akinori SATO ,  Masanori YAMAGISHI

IPC: C08L63/00 ,  H01L23/00 ,  B32B7/02 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B27/08 ,  H01L23/12 ,  H01L21/56 ,  C09J7/38 ,  C08L33/08 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31

Abstract: This curable resin film forms a first protective film on a surface having bumps of a semiconductor wafer by being attached to the surface and being cured, in which a cured material of the curable resin film has a Young's modulus of equal to or greater than 0.02 MPa and a peak value of a load measured by a probe tack test at 80° C. is equal to or less than 500 g. A first protective film forming sheet is provided with a first supporting sheet, and the curable resin film is provided on one surface of the first supporting sheet.

公开(公告)号：US20200277515A1

公开(公告)日：2020-09-03

申请号：US16646546

申请日：2018-09-04

Applicant: LINTEC CORPORATION

Inventor： Isao ICHIKAWA ,  Hidekazu NAKAYAMA ,  Akinori SATO

IPC: C09J7/10 ,  C09J11/04 ,  H01L21/78 ,  H01L21/683 ,  H01L23/00

Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.

公开(公告)号：US20180323084A1

公开(公告)日：2018-11-08

申请号：US15769167

申请日：2016-11-02

Applicant: LINTEC Corporation

Inventor： Masanori YAMAGISHI ,  Akinori SATO

IPC: H01L21/56 ,  B32B37/00 ,  H01L21/78 ,  C09J7/38 ,  C09J7/29 ,  C09J7/40 ,  C09J5/06

CPC classification number: H01L21/568 ,  B32B27/00 ,  B32B37/025 ,  B32B2457/14 ,  C09J5/00 ,  C09J5/06 ,  C09J7/20 ,  C09J7/29 ,  C09J7/38 ,  C09J7/401 ,  C09J201/00 ,  C09J2423/006 ,  C09J2463/005 ,  C09J2467/006 ,  C09J2475/00 ,  H01L21/304 ,  H01L21/563 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3157 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/94 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2224/11

Abstract: The present invention relates to a first protective film-forming sheet formed by stacking a first pressure-sensitive adhesive layer on a first base material and stacking a curable resin layer on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film on a bump-provided surface of a semiconductor wafer by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 μm or more, and the thickness of the curable resin layer is 20 μm to 100 μm.