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1.发明授权Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys 有权带有电镀锌镍三元及以上合金的制品，电镀浴，电镀这种合金的工艺和系统公开(公告)号：US07442286B2
公开(公告)日：2008-10-28
申请号：US10789175
申请日：2004-02-26
IPC分类号： C25D3/56
CPC分类号： C25D3/565
摘要： An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te+4, Bi+3 and Sb+3, and in some embodiments, further including one or more additional ionic species selected from ions of Bi+3, Sb+3, Ag+1, Cd+2, Co+2, Cr+3, Cu+2, Fe+2, In+3, Mn+2, Mo+6, P+3, Sn+2 and W+6. In some embodiments, the system includes a divider forming a cathodic chamber and an anodic chamber, with the electroplating bath in the cathodic chamber only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.
摘要翻译： 电镀浴，系统，工艺和从沉积锌 - 镍三元或更高合金得到的制品，a）锌离子; b）镍离子; 和c）选自Te +4，Bi + 3和Sb + 3的离子中的一种或多种离子物质，并且在一些实施方案中， 还包括一种或多种另外的选自Bi +3 +，Sb + 3 +，+，+，+ 2 +，+ + + +， - + - ， - - - - - 在 +3 中，Mn +2，Mo +6，P +3，Sn +2 和W + 6。 在一些实施例中，系统包括形成阴极室和阳极室的分隔器，电镀浴仅在阴极室中。 在各种实施方案中，锌 - 镍三元和更高的合金可以为沉积合金的导电基底提供改进的性能。
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公开(公告)号：US06436269B1
公开(公告)日：2002-08-20
申请号：US09691985
申请日：2000-10-19
IPC分类号： C25D360
CPC分类号： C25D3/60
摘要： The present invention relates to an aqueous plating bath for electrodeposition of tin-zinc alloys comprising at least one bath-soluble stannous salt, at least one bath soluble zinc salt, and a quaternary ammonium polymer selected from a ureylene quaternary ammonium polymer, an iminoureylene quaternary ammonium polymer or a thioureylene quaternary ammonium polymer. The plating baths also may contain one or more of the following additives: hydroxy polycarboxylic acids or salts thereof such as citric acid; ammonium salts; conducting salts; aromatic carbonyl-containing compounds; polymers of aliphatic amines such as a poly(alkyleneimine); and hydroxyalkyl substituted diamines as metal complexing agents. The plating baths of this invention deposit a bright and level deposit, and they can be adapted to provide plated alloys having high tin concentration over a wide current density range.
摘要翻译： 本发明涉及一种用于电沉积锡 - 锌合金的含水电镀液，其包含至少一种可溶溶的亚锡盐，至少一种溶液可溶性锌盐和季铵聚合物，所述季铵聚合物选自脲芳季铵聚合物，亚氨基亚乙基季铵 铵聚合物或硫脲类季铵聚合物。 电镀浴还可以含有一种或多种以下添加剂：羟基多元羧酸或其盐如柠檬酸; 铵盐; 导电盐 含芳族羰基的化合物; 脂族胺的聚合物如聚（亚烷基亚胺）; 和羟烷基取代的二胺作为金属络合剂。 本发明的电镀液沉积了明亮的水平沉积物，并且它们可适用于在宽电流密度范围内提供具有高锡浓度的电镀合金。
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公开(公告)号：US5628893A
公开(公告)日：1997-05-13
申请号：US562393
申请日：1995-11-24
申请人： Vincent C. Opaskar
发明人： Vincent C. Opaskar
CPC分类号： C25D3/30
摘要： A composition of matter for electrolytically depositing a tin layer on an iron containing-substrate is disclosed comprising an acidic aqueous mixture of:(a) a stannous tin halide; and(b) a salt having(1) an alkaline cation, and(2) an oxygen-containing inorganic acid anion reducible to a lower oxidation state.The salt is selected to minimize oxidation of Sn (II) to Sn (IV). An electrolytic cell for electrolytically depositing a tin layer on an iron-containing substrate is also disclosed, where the cell has an electrolyte comprising the foregoing composition. The overall cell potential of the cell is decreased, and the free energy increased, compared to an electrolytic cell without the salt. A process is disclosed for depositing a tin layer on an iron containing substrate comprising electrolytically coating the substrate with the composition, or coating the substrate employing the foregoing electrolytic cell. A product made by any of the foregoing processes is also described.
摘要翻译： 公开了一种用于在含铁基底上电解沉积锡层的物质组合物，其包含酸性含水混合物：（a）锡锡卤化物; 和（b）具有（1）碱性阳离子的盐和（2）可还原成低氧化态的含氧无机酸阴离子。 选择盐以使Sn（II）氧化成Sn（IV）。 还公开了一种用于在含铁基底上电解沉积锡层的电解池，其中电池具有包含上述组成的电解质。 与没有盐的电解池相比，电池的整体电池电位降低，自由能增加。 公开了一种用于在含铁基材上沉积锡层的方法，包括用该组合物电解涂覆该基材，或使用前述电解槽涂覆该基材。 还描述了通过任何前述方法制成的产品。
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公开(公告)号：US4662999A
公开(公告)日：1987-05-05
申请号：US826849
申请日：1986-02-06
CPC分类号： C25D3/36 , C25D3/32 , C25D3/60 , H05K3/3473
摘要： An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoride and fluoborate ions and comprise (A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (B) at least one alkane sulfonic acid or alkanolsulfonic acid, (C) at least one surfactant, (D) an effective amount of at least one primary brightening agent selected from the group consisting of halogen substituted and dialkoxy and trialkoxy substituted benzaldehydes, (E) an effective amount of a secondary brightening agent which is at least one lower aliphatic aldehyde, and (F) an effective amount of an auxiliary brightening agent which is at least one of the group consisting of aniline and the amino-, carboxy-, halo-, alkyl- or alkoxy-substituted anilines. Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths also are described.
摘要翻译： 描述了用于在基底上电沉积锡，铅或锡铅合金的酸性电镀液。 电镀浴不含氟化物和氟硼酸根离子，并且包含（A）至少一种选自亚锡盐，铅盐或亚锡和铅盐的混合物的浴溶性金属盐，（B）在 至少一种烷烃磺酸或链烷醇磺酸，（C）至少一种表面活性剂，（D）有效量的至少一种选自卤素取代和二烷氧基和三烷氧基取代的苯甲醛的初级增白剂，（E）有效量 作为至少一种低级脂族醛的二次增白剂的量，和（F）有效量的辅助增白剂，其为至少一种苯胺和氨基 - ，羧基 - ，卤代 - 烷基 - 或烷氧基取代的苯胺。 还描述了用于从这种浴中电沉积锡，铅或锡铅合金的方法。
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公开(公告)号：US5282954A
公开(公告)日：1994-02-01
申请号：US815735
申请日：1991-12-30
申请人： Vincent C. Opaskar
发明人： Vincent C. Opaskar
CPC分类号： C25D3/32
摘要： Surfactants made by the successive ethoxylation and propoxylation of diamines are effective in providing a fine-grain tin coating in high-speed strip-steel plating operations under conditions of high current density. Surfactants prepared by successive propoxylation and ethoxylation are also effective.
摘要翻译： 通过二胺的连续乙氧基化和丙氧基化形成的表面活性剂在高电流密度的条件下在高速带钢镀覆操作中提供细晶粒锡涂层是有效的。 通过连续丙氧基化和乙氧基化制备的表面活性剂也是有效的。
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公开(公告)号：US4440608A
公开(公告)日：1984-04-03
申请号：US408238
申请日：1982-08-16
摘要： A process is provided for the electrodeposition of alloys of tin and lead by passing electrical current through an anode, an aqueous acidic plating solution and a cathode, wherein the aqueous acidic plating bath includes at least one organic compound having a formula ##STR1## wherein X=O, S, or NH and R.sub.2 and R.sub.3 are H, or lower alkyl and R.sub.1 is ##STR2## .
摘要翻译： 提供了一种通过使电流通过阳极，酸性电镀液和阴极电解电沉积锡和铅的方法，其中酸性电镀液包含至少一种具有下式的有机化合物，其中X = O，S或NH，并且R 2和R 3是H或低级烷基，并且R 1是
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