CONDUCTOR GRID FOR ELECTRONIC HOUSINGS AND MANUFACTURING METHOD
    2.
    发明申请
    CONDUCTOR GRID FOR ELECTRONIC HOUSINGS AND MANUFACTURING METHOD 有权
    电子壳导体网格和制造方法

    公开(公告)号:US20120018187A1

    公开(公告)日:2012-01-26

    申请号:US13263629

    申请日:2010-03-29

    Inventor: Lorenz Berchtold

    Abstract: With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.

    Abstract translation: 通过本发明,提供了电子壳体的导体栅格和这种导体栅格的制造方法。 根据本发明,导体栅格由沿着接合边缘(150)焊接的两个金属条(130,110,140)制成,只有两个金属条中的一个需要具有适于引线接合的表面。 以这种方式可以显着减少常规使用的镀覆起始材料的量。

    Spectacle frames made of NI alloy
    4.
    发明授权
    Spectacle frames made of NI alloy 失效
    由NI合金制成的眼镜架

    公开(公告)号:US4728494A

    公开(公告)日:1988-03-01

    申请号:US813825

    申请日:1985-12-27

    CPC classification number: C22C19/002 G02C5/008

    Abstract: Zinc-free nickel alloys for spectacle frames and spectacle parts are described which in addition to very good corrosion properties also show good shaping properties. In addition to nickel, they contain 5 to 20% copper, 2 to 6% aluminum, 0 to 1% beryllium, and up to 0.5% carbon.

    Abstract translation: 描述了用于眼镜框和眼镜部件的无锌镍合金,除了非常好的腐蚀性能之外,还显示出良好的成型性能。 除了镍之外,它们含有5-20%的铜,2至6%的铝,0至1%的铍和至多0.5%的碳。

    Conductor grid for electronic housings and manufacturing method
    5.
    发明授权
    Conductor grid for electronic housings and manufacturing method 有权
    电子外壳导线栅格及制造方法

    公开(公告)号:US08723032B2

    公开(公告)日:2014-05-13

    申请号:US13263629

    申请日:2010-03-29

    Inventor: Lorenz Berchtold

    Abstract: With the present invention, conductor grids for electronic housings and a manufacturing method for such conductor grids are provided. According to the invention, the conductor grid is produced from two metal strips (130, 110, 140) welded along the joint edge (150), with only one of the two metal strips needing to have a surface suitable for the wire bonding. The amount of the conventionally used, plated starting material can be considerably reduced in this way.

    Abstract translation: 通过本发明,提供了电子壳体的导体栅格和这种导体栅格的制造方法。 根据本发明,导体栅格由沿着接合边缘(150)焊接的两个金属条(130,110,140)制成,只有两个金属条中的一个需要具有适于引线接合的表面。 以这种方式可以显着减少常规使用的镀覆起始材料的量。

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