PATTERNING METHOD
    2.
    发明申请
    PATTERNING METHOD 审中-公开
    绘图方法

    公开(公告)号:US20160196968A1

    公开(公告)日:2016-07-07

    申请号:US14590526

    申请日:2015-01-06

    Abstract: A patterning method is provided. A photoresist layer is formed on a target layer. An etching resistance layer is formed on the photoresist layer. The photoresist layer is exposed to light and therefore a photo acid is generated in first regions of the photoresist layer. The photoresist layer is developed to remove second regions of the photoresist layer. It is noted that the etching resistance layer is non-photosensitive but reactive to the generated photo acid.

    Abstract translation: 提供了图案化方法。 在目标层上形成光致抗蚀剂层。 在光致抗蚀剂层上形成耐蚀性层。 光致抗蚀剂层暴露于光,因此在光致抗蚀剂层的第一区域中产生光酸。 显影光致抗蚀剂层以除去光致抗蚀剂层的第二区域。 注意,耐蚀刻层是非光敏的,但对所产生的光酸具有反应性。

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