公开(公告)号：US10403806B2

公开(公告)日：2019-09-03

申请号：US15572522

申请日：2016-05-13

Applicant: Momentive Performance Materials Inc.

Inventor： Wei Fan ,  Eelco Galestien ,  Creighton Tomek ,  Manjunath Subbanna

IPC: H01L33/64 ,  H01L23/373 ,  F21V29/87 ,  F21S41/141 ,  F21S45/47 ,  F21S41/148 ,  F21Y101/00 ,  F21Y115/10 ,  F21Y107/90

Abstract: A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.

公开(公告)号：US20150253089A1

公开(公告)日：2015-09-10

申请号：US14431123

申请日：2013-09-24

Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.

Inventor： Wei Fan ,  Xiang Liu ,  John Mariner ,  Aaron Rape

IPC: F28F21/02 ,  F28F21/08

Abstract: A thermal management assembly comprising a bulk graphene material and a metal-based coating layer disposed on opposing surfaces of the bulk graphene core material comprising an agent that is reactive with the graphene to form a carbide. The metal-based coating layer can serve as an outer layer of the assembly or can serve to bond the graphene to other materials encapsulating the graphene core. The metal-based coating layer with the reactive agent provides an assembly exhibiting excellent thermal conductivity properties and greatly improved thermal interface resistance.

Abstract translation: 一种热管理组件，其包括体积石墨烯材料和设置在所述块状石墨烯芯材料的相对表面上的金属基涂层，其包含与所述石墨烯反应以形成碳化物的试剂。 金属基涂层可以用作组件的外层，或者可以用于将石墨烯与包封石墨烯核心的其它材料结合。 具有反应剂的金属基涂层提供了具有优异的导热性能和大大改善的热界面电阻的组合。

公开(公告)号：USRE46136E1

公开(公告)日：2016-09-06

申请号：US13790423

申请日：2013-03-08

Applicant: Momentive Performance Materials Inc.

Inventor： John Mariner ,  Ajit Sane ,  Toshiki Ebata ,  Marc Schaepkens ,  Xiang Liu ,  Wei Fan

IPC: C23C16/458 ,  H01L21/67

Abstract: A heating apparatus for regulating/controlling the surface temperature of a substrate is provided. At least a thermal pyrolytic graphite (TPG) layer is embedded in the heater to diffuse the temperature difference of the various components in the heating apparatus and provide temporal and spatial control of the surface temperature of the substrate, for a relatively uniform substrate temperature with the difference between the maximum and minimum temperature points on the substrate of less than 10° C.

Abstract translation: 提供一种用于调节/控制基板的表面温度的加热装置。 至少一个热解石墨（TPG）层被嵌入在加热器中以扩散加热装置中的各种组分的温度差，并提供衬底的表面温度的时间和空间控制，对于相对均匀的衬底温度， 基板上最大和最小温度点之间的差值小于10°C

公开(公告)号：US20180159008A1

公开(公告)日：2018-06-07

申请号：US15572522

申请日：2016-05-13

Applicant: Momentive Performance Materials Inc.

Inventor： Wei Fan ,  Eelco Galestien ,  Creighton Tomek ,  Manjunath Subbanna

IPC: H01L33/64 ,  F21S41/141 ,  F21S45/48

CPC classification number: H01L33/641 ,  F21S41/141 ,  F21S41/148 ,  F21S45/47 ,  F21V29/87 ,  F21Y2101/00 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L23/373 ,  H01L33/642 ,  H01L33/648

Abstract: A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a light emitting diode in thermal contact with a heat spreader. The heat spreader may comprise a core and/or fins. The core and/or fins comprise a thermal pyrolytic graphite material. The thermal management assembly comprising the core and/or fins can dissipate heat from the light emitting diode.