摘要:
There is disclosed an actinic-radiation-curing, hot-melt pressure-sensitive adhesive composition, which comprises a mixture in a limited mixing ratio of an acrylic high-molecular-weight polymer that is made up of main chain having a molecular weight of 8,000 to 100,000 and a glass transition temperature of -75.degree. to -20.degree. C., and branched chain, in which the main chains and/or branched chains have or at least one ethylenically unsaturated group; and a low-molecular-weight polymer having a molecular weight of 500 to 8,000 and a glass transition temperature of lower than 100.degree. C., which polymer has or does not have an ethylenically unsaturated group in the molecule.
摘要:
A resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 number-average molecular weight. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used for reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.
摘要:
There is disclosed a resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 of number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 of number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 of number-average molecular weight is disclosed. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used to reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.
摘要:
The present invention relates to a thermosetting powder paint comprising, as essential components, (A) a copolymer of particular composition composed of a glycidyl group-containing monomer, styrene and other monomer copolymerizable therewith and, as curing agents capable of reacting with the component (A) to crosslink the component (A), (B) an aliphatic polycarboxylic acid and (C) a linear anhydride of an aliphatic polycarboxylic acid; a coating method using the above thermosetting powder paint; and a coated article obtained by using the above thermosetting powder paint. The above thermosetting powder paint, when used as a paint for automobile, has excellent storage stability and gives a coating film having excellent appearance, properties, weathering resistance and yellowing resistance; therefore, the paint can be favorably used particularly as an top coat and an intermediate coat for automobile and its parts.
摘要:
A thermosetting powder paint composition is disclosed which can realize simultaneous manifestation of I) excellent stability before film forming (in storage), II) excellent low temperature melting property/low temperature curing property in forming a film, and III) excellent film properties and physical properties after film forming;and which comprises (A) a copolymer component which is obtained by radical polymerization in a reaction system containing (a-1) an ethylenically unsaturated monomer having a glycidyl group and a unsaturated double bond in the molecule, (a-2) styrene, and (a-3) the other monomer in a specific condition, (B) a curing agent component which is a linear acid anhydride of an aliphatic divalent carboxylic acid having a specific structure, and (C) a curing catalyst component having a specific structure.
摘要:
In order to provide a semiconductor single crystal manufacturing device and a manufacturing method using a CZ method wherein the resistivity and oxygen concentration of a silicon single crystal can be controlled and wherein a single crystal yield can be improved, in the present invention, there is provided a wall 10 which defines a chamber inner wall 1c of a chamber 1, a crucible 2 and a heater 3. The wall 10 is formed by three members, namely, a single crystal side flow-straightening member 11, a melt surface side flow-straightening member 12 and a heater side flow-straightening member 13, which are connected to form a purge gas directing path 100. When the semiconductor single crystal is pulled, a flow speed of a purge gas that passes through the vicinity of the surface of the melt in a quartz crucible 3 is controlled from 0.2 to 0.35 m/min by purge gas introduction means.
摘要:
The invention provides oiled-face adherable, hot-melt adhesive composition which has constitutive components consisting of thermoplastic resin such as ethylene-acrylate ester resin, tacky resin such as rosin ester derivative and waxes such as paraffin wax and/or plasticizer such as naphthene oil, and also contains modified resin components obtained by introducing into the molecular chains of these components a phosphoric acid group or, if desired, a carboxyl or its anhydride group, for example, by grafting 2-hydroxy-3-(meth)acryloxypropyl phosphate.By providing the composition, adhesion and seal of metals with difficulty adhesive plastics are improved and a non-slip processing method of face-oiled metal scaffolding boards can be accomplished.
摘要:
In order to provide a semiconductor single crystal manufacturing device and a manufacturing method using a CZ method wherein the resistivity and oxygen concentration of a silicon single crystal can be controlled and wherein a single crystal yield can be improved, in the present invention, there is provided a wall 10 which defines a chamber inner wall 1c of a chamber 1, a crucible 2 and a heater 3. The wall 10 is formed by three members, namely, a single crystal side flow-straightening member 11, a melt surface side flow-straightening member 12 and a heater side flow-straightening member 13, which are connected to form a purge gas directing path 100. When the semiconductor single crystal is pulled, a flow speed of a purge gas that passes through the vicinity of the surface of the melt in a quartz crucible 3 is controlled.