公开(公告)号：US09165714B2

公开(公告)日：2015-10-20

申请号：US13479397

申请日：2012-05-24

申请人： Makoto Ogawa ,  Akihiro Motoki ,  Atsuko Saito ,  Kenji Masuko ,  Toshinobu Fujiwara

发明人： Makoto Ogawa ,  Akihiro Motoki ,  Atsuko Saito ,  Kenji Masuko ,  Toshinobu Fujiwara

IPC分类号： H01G4/228 ,  H01G2/20 ,  H01G4/008 ,  C25D5/12 ,  C25D3/30 ,  C25D3/12

CPC分类号： H01G4/008 ,  C25D3/12 ,  C25D3/30 ,  C25D5/12

摘要： An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

摘要翻译： 抑制晶须生长并且具有优异的可焊性的电子部件优选为层叠陶瓷电容器，包括例如长方体形状的电子部件元件。 端子电极的外部电极位于电子元件的第一和第二端面上。 包含电镀Ni的第一电镀膜位于外部电极的表面上。 第二镀膜位于第一镀膜的表面上。 第二镀膜具有包括第一镀层和第二镀层的堆叠结构。 第二镀层比第一镀层具有较低的致密化程度。

公开(公告)号：US08709612B2

公开(公告)日：2014-04-29

申请号：US13444925

申请日：2012-04-12

申请人： Akihiro Motoki ,  Makoto Ogawa ,  Atsuko Saito ,  Toshinobu Fujiwara ,  Kenji Masuko

发明人： Akihiro Motoki ,  Makoto Ogawa ,  Atsuko Saito ,  Toshinobu Fujiwara ,  Kenji Masuko

IPC分类号： B32B15/00 ,  C22F1/00 ,  C22F1/16 ,  B05D3/06 ,  C25D5/50 ,  C25D3/30 ,  C25D3/60 ,  H01G4/12 ,  H01G4/252 ,  H01G9/04 ,  C22C13/00

CPC分类号： C25D5/505 ,  B05D3/065 ,  B32B15/00 ,  C22C13/00 ,  C22C2200/00 ,  C22F1/00 ,  C22F1/16 ,  C23C28/021 ,  C23C28/023 ,  C25D3/30 ,  C25D3/60 ,  H01G4/12 ,  H01G4/232 ,  H01G4/252 ,  H01G4/30 ,  H01G2009/0404 ,  Y10S428/929 ,  Y10S428/935 ,  Y10T428/12715 ,  Y10T428/12722

摘要： A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.

摘要翻译： 层叠陶瓷电容器包括矩形固体电子元件。 端子电极的外部电极设置在电子元件的一端面和另一端面上。 包括Ni电镀的第一镀膜设置在外部电极的表面上。 在第一电镀膜的表面上，设置含有Sn的第二镀膜，作为限定外部电极的最外层的Sn镀膜。 第二电镀膜具有多晶结构，片状Sn-Ni合金晶粒分别位于Sn晶界和Sn晶粒内。