利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

4 条记录 (耗时 0.025 秒)

    Electronic component
    1.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号：US09165714B2

    公开(公告)日：2015-10-20

    申请号：US13479397

    申请日：2012-05-24

    申请人： Makoto Ogawa ,  Akihiro Motoki ,  Atsuko Saito ,  Kenji Masuko ,  Toshinobu Fujiwara

    发明人： Makoto Ogawa ,  Akihiro Motoki ,  Atsuko Saito ,  Kenji Masuko ,  Toshinobu Fujiwara

    IPC分类号： H01G4/228 ,  H01G2/20 ,  H01G4/008 ,  C25D5/12 ,  C25D3/30 ,  C25D3/12

    CPC分类号： H01G4/008 ,  C25D3/12 ,  C25D3/30 ,  C25D5/12

    摘要： An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

    摘要翻译： 抑制晶须生长并且具有优异的可焊性的电子部件优选为层叠陶瓷电容器，包括例如长方体形状的电子部件元件。 端子电极的外部电极位于电子元件的第一和第二端面上。 包含电镀Ni的第一电镀膜位于外部电极的表面上。 第二镀膜位于第一镀膜的表面上。 第二镀膜具有包括第一镀层和第二镀层的堆叠结构。 第二镀层比第一镀层具有较低的致密化程度。