公开(公告)号：US20180078276A1

公开(公告)日：2018-03-22

申请号：US15718780

申请日：2017-09-28

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ming Ting Wu ,  Arun S. Veeramani ,  Vacit Arat ,  Gregory P. Schmitz ,  Juan Diego Perea ,  Ronald Leguidleguid ,  Gregory B. Arcenio ,  Eric C. Miller

IPC: A61B17/3205

CPC classification number: A61B17/3205 ,  A61B10/0266 ,  A61B10/0283 ,  A61B17/32002 ,  A61B17/3203 ,  A61B17/320758 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/320064 ,  A61B2017/320775 ,  A61F2009/00887

Abstract: Various embodiments of a tissue cutting device and methods for using are described. In some variations devices include an elongate tube having a proximal end and a distal end and a central axis extending from the proximal end to the distal end; a first annular element at the distal end of the elongate tube, the first annular element having a cutting portion at its distal; and a second annular element at the distal end of the elongate tube and concentric with the first annular element, the second annular element having a cutting portion at its distal end, the first and second annular elements being rotatable relative to one another to cause the first annular element and the second annular element to pass each other to shear tissue.

公开(公告)号：US20140239541A1

公开(公告)日：2014-08-28

申请号：US14194214

申请日：2014-02-28

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: B29C65/56

CPC classification number: B29C65/56 ,  B33Y10/00 ,  C25D5/02 ,  Y10T29/49885

Abstract: Forming multi-layer 3D structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer 3D structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second element is not accessible to the retention region of the first element.

Abstract translation: 形成多层3D结构，其涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层3D结构，其中通过以下之一进行接合：（1）弹性变形和弹性恢复，（2 ）至少一个元件的初始部分相对于所述至少一个元件的另一部分的相对变形，直到所述至少两个元件处于期望的保持位置，之后所述变形被减少或消除，或者（3）移动保持 一个元件的区域进入到另一个元件的保持区域中，没有任何一个元件的变形，沿着包括另一个元件的加载区域的路径，并且其中在正常使用期间，第一和第二元件相对于彼此配置，使得负载 第二元件的区域不能被第一元件的保持区域访问。

公开(公告)号：US20150108002A1

公开(公告)日：2015-04-23

申请号：US14572472

申请日：2014-12-16

Applicant: Microfabrica Inc.

Inventor： Kieun Kim ,  Adam L. Cohen ,  Willa M. Larsen ,  Richard Chen ,  Ananda H. Kumar ,  Ezekiel J.J. Kruglick ,  Vacit Arat ,  Gang Zhang ,  Michael S. Lockard ,  Christopher A. Bang ,  Jeffrey A. Thompson

IPC: C25D5/02 ,  C25D7/00

CPC classification number: C25D1/003

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

公开(公告)号：US20190204354A1

公开(公告)日：2019-07-04

申请号：US16172354

申请日：2018-10-26

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

IPC: G01R1/067

CPC classification number: G01R1/06727 ,  G01R1/06738

Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

公开(公告)号：US20230204626A1

公开(公告)日：2023-06-29

申请号：US17124417

申请日：2020-12-16

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

IPC: G01R1/067

CPC classification number: G01R1/06727 ,  G01R1/06738

Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

公开(公告)号：US09597834B2

公开(公告)日：2017-03-21

申请号：US14194214

申请日：2014-02-28

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

IPC: C25D5/02 ,  C25D5/48 ,  B29C65/56

CPC classification number: B29C65/56 ,  B33Y10/00 ,  C25D5/02 ,  Y10T29/49885

Abstract: Forming multi-layer 3D structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer 3D structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second element is not accessible to the retention region of the first element.