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公开(公告)号:US12045503B2
公开(公告)日:2024-07-23
申请号:US17515229
申请日:2021-10-29
Applicant: Micron Technology, Inc.
Inventor: Kenneth Marion Curewitz , Shivam Swami , Samuel E. Bradshaw , Justin M. Eno , Ameen D. Akel , Sean S. Eilert
CPC classification number: G06F3/0659 , G06F3/0679 , G06F12/0246 , H10B63/84 , G06F3/0622
Abstract: A memory chip having a predefined memory region configured to store program data transmitted from a microchip. The memory chip also having a programmable engine configured to facilitate access to a second memory chip to read data from the second memory chip and write data to the second memory chip according to stored program data in the predefined memory region. The predefined memory region can include a portion configured as a command queue for the programmable engine, and the programmable engine can be configured to facilitate access to the second memory chip according to the command queue.
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公开(公告)号:US11687282B2
公开(公告)日:2023-06-27
申请号:US17236981
申请日:2021-04-21
Applicant: Micron Technology, Inc.
Inventor: Shivasankar Gunasekaran , Samuel E. Bradshaw , Justin M. Eno , Ameen D. Akel
IPC: G06F3/06 , G06F12/0873 , G06F11/07
CPC classification number: G06F3/0659 , G06F3/0614 , G06F3/0653 , G06F3/0679 , G06F11/0757 , G06F12/0873
Abstract: A memory sub-system configured to be responsive to a time to live requirement for load commands from a processor. For example, a load command issued by the processor (e.g., SoC) can include, or be associated with, an optional time to live parameter. The parameter requires that the data at the memory address be available within the time specified by the time to live parameter. When the requested data is currently in the lower speed memory (e.g., NAND flash) and not available in the higher speed memory (e.g., DRAM, NVRAM), the memory sub-system can determine that the data cannot be made available with the specified time and optionally skip the operations and return an error response immediately.
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公开(公告)号:US20220300437A1
公开(公告)日:2022-09-22
申请号:US17837565
申请日:2022-06-10
Applicant: Micron Technology, Inc.
Inventor: Sean S. Eilert , Kenneth Marion Curewitz , Justin M. Eno
Abstract: A memory chip (e.g., DRAM) connecting a SoC and an accelerator chip (e.g., an AI accelerator chip). A system including the memory chip and the accelerator chip. The system can include the SoC. The memory chip can include first memory cells to store and provide computation input data (e.g., AI computation input data) received from the SoC to be used by the accelerator chip as computation input (e.g., AI computation input). The memory chip can include second memory cells to store and provide first computation output data (e.g., AI computation output data) received from the accelerator chip to be retrieved by the SoC or reused by the accelerator chip as computation input. The memory chip can also include third memory cells to store second computation output data (e.g., non-AI computation output data) related to non-AI tasks received from the SoC to be retrieved by the SoC for non-AI tasks.
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公开(公告)号:US11243804B2
公开(公告)日:2022-02-08
申请号:US16688245
申请日:2019-11-19
Applicant: Micron Technology, Inc.
Inventor: Justin M. Eno
Abstract: Systems, apparatuses, and methods to implement time to live for memory access by processors. For example, a processor has a register configured to store a parameter specifying a time duration indicative of the desired time to live. A memory system has multiple components with different latencies for memory access. When the memory controller of the processor sends a command to the memory system to load an item from a memory address, the memory system can fail to provide, to the processor within the time duration, the item from the memory address currently being hosted in a first component. In response, the memory controller can send a signal to abort the command; and the memory system can select a second component having a memory access latency shorter than the first component, and change the hosting of the memory address from in the first component to in the second component.
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公开(公告)号:US11199995B2
公开(公告)日:2021-12-14
申请号:US16688250
申请日:2019-11-19
Applicant: Micron Technology, Inc.
Inventor: Shivasankar Gunasekaran , Samuel E. Bradshaw , Justin M. Eno , Ameen D. Akel
IPC: G06F3/06 , G06F12/0873 , G06F11/07
Abstract: A memory sub-system configured to be responsive to a time to live requirement for load commands from a processor. For example, a load command issued by the processor (e.g., SoC) can include, or be associated with, an optional time to live parameter. The parameter requires that the data at the memory address be available within the time specified by the time to live parameter. When the requested data is currently in the lower speed memory (e.g., NAND flash) and not available in the higher speed memory (e.g., DRAM, NVRAM), the memory subsystem can determine that the data cannot be made available with the specified time and optionally skip the operations and return an error response immediately.
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公开(公告)号:US20210081324A1
公开(公告)日:2021-03-18
申请号:US16573527
申请日:2019-09-17
Applicant: Micron Technology, Inc.
Inventor: Samuel E. Bradshaw , Justin M. Eno , Sean S. Eilert , Shivasankar Gunasekaran , Hongyu Wang , Shivam Swami
IPC: G06F12/1009 , G06F12/1027
Abstract: A computer system includes physical memory devices of different types that store randomly-accessible data in memory of the computer system. In one approach, access to memory in an address space is maintained by an operating system of the computer system. A virtual page is associated with a first memory type. A page table entry is generated to map a virtual address of the virtual page to a physical address in a first memory device of the first memory type. The page table entry is used by a memory management unit to store the virtual page at the physical address.
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公开(公告)号:US10445195B2
公开(公告)日:2019-10-15
申请号:US15670544
申请日:2017-08-07
Applicant: Micron Technology, Inc.
Inventor: Samuel E. Bradshaw , Justin M. Eno
IPC: G06F11/07 , G06F11/14 , G06F3/06 , G06F1/3225
Abstract: The present disclosure includes apparatuses and methods for performing data restore operations in memory. An embodiment includes a memory, and a controller configured to perform a data restore operation on data stored in the memory using a first table and a second table stored in the controller, wherein the first table includes a current mapping of the data stored in the memory that is based on a previous assessment of previous error rates associated with the data stored in the memory, and the second table includes a new mapping of the data stored in the memory that is based on a current assessment of current error rates associated with the data stored in the memory.
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公开(公告)号:US20190278670A1
公开(公告)日:2019-09-12
申请号:US16423574
申请日:2019-05-28
Applicant: Micron Technology, Inc.
Inventor: Samuel E. Bradshaw , Justin M. Eno
IPC: G06F11/14 , G06F3/06 , G06F1/3225
Abstract: The present disclosure includes apparatuses and methods for performing data restore operations in memory. An embodiment includes a memory, and a controller configured to perform a data restore operation on data stored in the memory using a first table and a second table stored in the controller, wherein the first table includes a current mapping of the data stored in the memory that is based on a previous assessment of previous error rates associated with the data stored in the memory, and the second table includes a new mapping of the data stored in the memory that is based on a current assessment of current error rates associated with the data stored in the memory.
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公开(公告)号:US20240427708A1
公开(公告)日:2024-12-26
申请号:US18828657
申请日:2024-09-09
Applicant: Micron Technology, Inc.
Inventor: Samuel E. Bradshaw , Shivam Swami , Sean Stephen Eilert , Justin M. Eno , Ameen D. Akel
IPC: G06F13/10 , G06F3/06 , G06F12/0802 , G06F13/12
Abstract: A memory chip having a first set of pins configured to allow the memory chip to be coupled to a first microchip or device via first wiring. The memory chip also having a second set of pins configured to allow the memory chip to be coupled to a second microchip or device via second wiring that is separate from the first wiring. The memory chip also having a data mover configured to facilitate access to the second microchip or device, via the second set of pins, to read data from the second microchip or device and write data to the second microchip or device. Also, a system having the memory chip, the first microchip or device, and the second microchip or device.
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公开(公告)号:US12086078B2
公开(公告)日:2024-09-10
申请号:US17888392
申请日:2022-08-15
Applicant: Micron Technology, Inc.
Inventor: Samuel E. Bradshaw , Shivam Swami , Sean Stephen Eilert , Justin M. Eno , Ameen D. Akel
IPC: G06F12/0802 , G06F3/06 , G06F13/00 , G06F13/10 , G06F13/12
CPC classification number: G06F13/102 , G06F3/06 , G06F12/0802 , G06F13/124 , G06F2212/621
Abstract: A memory chip having a first set of pins configured to allow the memory chip to be coupled to a first microchip or device via first wiring. The memory chip also having a second set of pins configured to allow the memory chip to be coupled to a second microchip or device via second wiring that is separate from the first wiring. The memory chip also having a data mover configured to facilitate access to the second microchip or device, via the second set of pins, to read data from the second microchip or device and write data to the second microchip or device. Also, a system having the memory chip, the first microchip or device, and the second microchip or device.
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