Electrophoretic mobility measuring apparatus
    1.
    发明授权
    Electrophoretic mobility measuring apparatus 有权
    电泳迁移率测定装置

    公开(公告)号:US07449097B2

    公开(公告)日:2008-11-11

    申请号:US10784278

    申请日:2004-02-24

    IPC分类号: G01N27/453

    摘要: The present invention provides an electrophoretic mobility measuring apparatus capable of conducting measurement with high sensitivity with optical attenuation reduced by incidence of light through the electrode face. This apparatus comprises a transparent electrode 63 forming a part of a cell wall of a cell 6 capable of confining a sample, and the other electrode 62 opposite to the transparent electrode 63. A voltage is applied across these electrodes 62, 63, and light is incident upon the inside of the cell 6 through the transparent electrode 63. The scattering light which scatters from a sample S at a predetermined angle θ with respect to the incident angle, is received through the transparent electrode 63. The Doppler displacement is then measured based on the difference in frequency between the incident light and the outgoing light. The direction of the scattering vector which is the vector difference between incident and outgoing vectors, is substantially identical with that of the normal line h of the transparent electrode face.

    摘要翻译: 本发明提供一种能够以高灵敏度进行测量的电泳迁移率测量装置,通过电极面的光入射减少光衰减。 该装置包括形成能够限制样品的单元6的单元壁的一部分的透明电极63和与透明电极63相对的另一个电极62。 在这些电极62,63之间施加电压,并且光通过透明电极63入射到电池6的内部。 通过透明电极63接收从样品S以相对于入射角以预定角度θ散射的散射光。 然后基于入射光和出射光之间的频率差来测量多普勒位移。 作为入射矢量与向外矢量之间的矢量差的散射矢量的方向与透明电极面的法线h基本相同。

    Spectroscope
    2.
    发明授权
    Spectroscope 失效
    光谱仪

    公开(公告)号:US4922309A

    公开(公告)日:1990-05-01

    申请号:US267884

    申请日:1988-11-07

    摘要: An optical waveguide having a detour is disposed at either or both of the light-receiving and light-emitting ends of a dispersion optical system in a spectroscope. Even though light being propagated through the optical waveguide has specified polarizing characteristics, the light is depolarized by passing through the optical waveguide and many times reflecting therein. Accordingly, unpolarized light not affected by the polarization selectivity of the dispersion optical system or the like can be emitted from the spectroscope.

    Circuit board wire trimming apparatus
    3.
    发明授权
    Circuit board wire trimming apparatus 失效
    电路板修线装置

    公开(公告)号:US4200018A

    公开(公告)日:1980-04-29

    申请号:US855901

    申请日:1977-11-29

    申请人: Mitsunao Sekiwa

    发明人: Mitsunao Sekiwa

    IPC分类号: H05K13/04 B23D33/02 B26D7/06

    摘要: First and second elongated support members for supporting a circuit board and for transporting the circuit board in one direction parallel to the lengthwise direction of the support members are provided on a frame, and a blade member is rotatably supported on the frame for rotation about its own axis in a plane parallel to the plane of the circuit board. While the circuit board is being transported with opposed edges of the circuit board guided along the support member, the blade member trims excessive length from wires extending from the circuit board.

    摘要翻译: 第一和第二细长支撑构件用于支撑电路板并用于在平行于支撑构件的长度方向的一个方向上输送电路板,并且叶片构件可旋转地支撑在框架上以围绕其自身旋转 轴平行于电路板的平面。 当电路板沿着支撑构件被引导的电路板的相对边缘被传送时,叶片构件从电路板延伸的线材中修剪过长的长度。

    Method for cutting lead wires
    4.
    发明授权
    Method for cutting lead wires 失效
    铅丝切割方法

    公开(公告)号:US4436006A

    公开(公告)日:1984-03-13

    申请号:US189299

    申请日:1980-09-22

    摘要: A cutting method comprising using a main body in the form of a circular disk and a hard layer provided on one surface of the main body and having a thickness of 0.02 to 0.2 mm. The hard layer is made of cemented carbides, TiC TaC, Cr.sub.2 C.sub.3, Al.sub.2 O.sub.3 or the like, while the main body is made of a material, such as steel, non-ferrous metal or plastics, which is lower than the hard layer in abrasion resistance. The hard layer is formed along its outer periphery with a cutting edge which is self-sharpened when chipped.

    摘要翻译: 一种切割方法,包括使用呈圆盘形状的主体和设置在主体的一个表面上的厚度为0.02至0.2mm的硬层。 硬质层由硬质合金TiC TaC,Cr2C3,Al2O3等制成,而主体由耐磨性低于硬质层的钢,有色金属或塑料等材料制成 。 硬层沿着其外周边形成切削刃,在切削时自动磨削。