公开(公告)号：US08330568B2

公开(公告)日：2012-12-11

申请号：US12911518

申请日：2010-10-25

申请人： Masaharu Konoue ,  Yukio Maeda ,  Tatsuya Mizuno ,  Hiroki Hashimoto ,  Mitsuru Ueda

发明人： Masaharu Konoue ,  Yukio Maeda ,  Tatsuya Mizuno ,  Hiroki Hashimoto ,  Mitsuru Ueda

IPC分类号： H01F27/24 ,  H01F5/00 ,  H01F7/06

CPC分类号： H01F17/0013 ,  H01F27/292 ,  H01F27/34 ,  H01F41/046 ,  H01F2017/0066 ,  Y10T29/4902

摘要： A multilayer coil component includes internal conductors made of silver (Ag) having metal films provided on surfaces thereof to suppress migration of Ag contained in the internal conductors and/or relieve internal stress between magnetic ceramic layers and internal conductor layers without forming gaps at interfaces between the internal conductors including the metal films and a magnetic ceramic surrounding the internal conductors and the interfaces between the internal conductors and the magnetic ceramic. In a manufacturing method for forming a multilayer coil, an acidic solution containing a metal is allowed to penetrate a magnetic ceramic through side surfaces thereof and side gap sections that are regions between side portions of internal conductors and the side surfaces to reach the interfaces between the internal conductors and a surrounding magnetic ceramic, whereby the metal is deposited on surfaces of the internal conductors.

摘要翻译： 多层线圈部件包括由银（Ag）制成的内部导体，其具有设置在其表面上的金属膜，以抑制内部导体中包含的Ag的迁移和/或缓和磁性陶瓷层与内部导体层之间的内部应力，而不会在 内部导体包括金属膜和围绕内部导体的磁性陶瓷以及内部导体与磁性陶瓷之间的界面。 在形成多层线圈的制造方法中，允许含有金属的酸性溶液通过其侧表面渗透磁性陶瓷，并且允许内部导体的侧部和侧表面之间的区域的侧间隙部分到达 内部导体和周围的磁性陶瓷，由此金属沉积在内部导体的表面上。

公开(公告)号：US08288924B2

公开(公告)日：2012-10-16

申请号：US13168631

申请日：2011-06-24

申请人： Tatsuya Mizuno ,  Masaharu Konoue ,  Hiroki Hashimoto ,  Mitsuru Ueda

发明人： Tatsuya Mizuno ,  Masaharu Konoue ,  Hiroki Hashimoto ,  Mitsuru Ueda

IPC分类号： H01L41/08

CPC分类号： H01G4/30 ,  H01G4/2325 ,  Y10T29/43 ,  Y10T29/435

摘要： A method for manufacturing a ceramic electronic component capable of preventing degradation of the self alignment property and product characteristics due to absorption of flux into pores of a ceramic element assembly during soldering in mounting and a ceramic electronic component. In the method, a ceramic element assembly is subjected to an oil-repellent treatment by using an oil-repellent agent containing a polyfluoropolyether compound as a primary component and hydrofluoroether as a solvent, so as to avoid absorption of the flux by the ceramic element assembly.

摘要翻译： 一种陶瓷电子部件的制造方法，其能够防止由于在安装时的陶瓷元件组件的陶瓷电子部件的焊接过程中将助熔剂吸收到陶瓷元件组件的孔内而导致的自对准性和产品特性的劣化。 在该方法中，通过使用含有多氟聚醚化合物作为主要成分的斥油剂和氢氟醚作为溶剂，对陶瓷元件组件进行拒油处理，以避免陶瓷元件组件吸收助焊剂 。

公开(公告)号：US08475866B2

公开(公告)日：2013-07-02

申请号：US13523510

申请日：2012-06-14

申请人： Tatsuya Mizuno ,  Masaharu Konoue ,  Hiroki Hashimoto ,  Mitsuru Ueda

发明人： Tatsuya Mizuno ,  Masaharu Konoue ,  Hiroki Hashimoto ,  Mitsuru Ueda

IPC分类号： H01G7/00

CPC分类号： H01G4/30 ,  H01G4/2325 ,  Y10T29/43 ,  Y10T29/435

摘要： A method for manufacturing a ceramic electronic component capable of preventing degradation of the self alignment property and product characteristics due to absorption of flux into pores of a ceramic element assembly during soldering in mounting and a ceramic electronic component. In the method, a ceramic element assembly is subjected to an oil-repellent treatment by using an oil-repellent agent containing a polyfluoropolyether compound as a primary component and hydrofluoroether as a solvent, so as to avoid absorption of the flux by the ceramic element assembly.

摘要翻译： 一种陶瓷电子部件的制造方法，其能够防止由于在安装时的陶瓷元件组件的陶瓷电子部件的焊接过程中将助熔剂吸收到陶瓷元件组件的孔内而导致的自对准性和产品特性的劣化。 在该方法中，通过使用含有多氟聚醚化合物作为主要成分的斥油剂和氢氟醚作为溶剂，对陶瓷元件组件进行拒油处理，以避免陶瓷元件组件吸收助焊剂 。

公开(公告)号：US07889044B2

公开(公告)日：2011-02-15

申请号：US12778694

申请日：2010-05-12

申请人： Mitsuru Ueda ,  Masaharu Konoue ,  Hiroki Hashimoto ,  Tatsuya Mizuno

发明人： Mitsuru Ueda ,  Masaharu Konoue ,  Hiroki Hashimoto ,  Tatsuya Mizuno

IPC分类号： H01F5/00 ,  H01F27/28

CPC分类号： H01F17/0013 ,  H01F17/04

摘要： A multilayer coil component is provided in which solder fusibility and a self-alignment property are prevented from being degraded due to absorption of a flux in a soldering step. The multilayer coil component has no voids present at interfaces between internal conductors 2 and a magnetic ceramic 11 located therearound. A magnetic ceramic forming a central region 7 has a region (side gap portion 8) which extends from a side surface 3a of the magnetic ceramic element to the internal conductors and which has a pore area ratio of 6% to 20%. At least one of a first external layer region 9a, located at an upper side of the central region, and a second external layer region 9b, located at a lower side of the central region (an external layer region at a mounting surface side of a mounting substrate), has a pore area ratio of less than 5%.

摘要翻译： 提供了一种多层线圈部件，其中防止焊料熔融性和自对准性由于在焊接步骤中的焊剂的吸收而劣化。 多层线圈部件在内部导体2和位于其周围的磁性陶瓷11之间的界面处不存在空隙。 形成中心区域7的磁性陶瓷具有从磁性陶瓷元件的侧表面3a延伸到内部导体并且具有6％至20％的孔面积比的区域（侧面间隙部分8）。 位于中心区域上侧的第一外部层区域9a和第二外部层区域9b中的至少一个位于中心区域的下侧（位于中央区域的安装面侧的外部区域 安装基板），孔面积比小于5％。

公开(公告)号：US08004383B2

公开(公告)日：2011-08-23

申请号：US12719564

申请日：2010-03-08

申请人： Masaharu Konoue ,  Yukio Maeda ,  Tatsuya Mizuno ,  Hiroki Hashimoto ,  Mitsuru Ueda

发明人： Masaharu Konoue ,  Yukio Maeda ,  Tatsuya Mizuno ,  Hiroki Hashimoto ,  Mitsuru Ueda

IPC分类号： H01F5/00

CPC分类号： H01F5/00 ,  H01F17/0013 ,  H01F17/04

摘要： A highly reliable multilayer coil component is provided without forming voids between magnetic ceramic layers and internal conductor layers. According to the multilayer coil component, an internal stress problem is reduced, the direct current resistance is low, and fracture of internal conductors caused by the surge or the like is not likely to occur. An acidic solution is allowed to permeate a magnetic ceramic element from a side surface thereof through a side gap portion which is a region between side portions of the internal conductors and the side surface of the magnetic ceramic element and to reach interfaces between the internal conductors and a magnetic ceramic located therearound. A pore area ratio of the magnetic ceramic of the side gap portion which is located between the side portions of the internal conductors and the side surface of the magnetic ceramic element is set in the range of 6% to 28%.

摘要翻译： 提供高度可靠的多层线圈部件，而不在磁陶瓷层和内部导体层之间形成空隙。 根据多层线圈部件，内部应力问题减少，直流电阻低，不易发生由浪涌等导致的内部导线的断裂。 允许酸性溶液从其侧表面穿过作为内部导体的侧部和磁性陶瓷元件的侧表面之间的区域的侧间隙部分渗透到磁性陶瓷元件，并且到达内部导体和 位于其周围的磁性陶瓷。 位于内部导体的侧部和磁性陶瓷元件的侧面之间的侧面间隙部分的磁性陶瓷的孔面积比设定在6％至28％的范围内。

公开(公告)号：US06855222B2

公开(公告)日：2005-02-15

申请号：US10448048

申请日：2003-05-30

申请人： Masaharu Konoue ,  Kimiharu Anao

发明人： Masaharu Konoue ,  Kimiharu Anao

IPC分类号： H01G4/232 ,  C04B35/26 ,  H01B1/22 ,  H01F17/00 ,  H01F41/04 ,  H01G4/008 ,  H01G4/012 ,  H01G4/30 ,  H05K1/09 ,  B32B31/26 ,  H01F1/34 ,  H05K3/46

CPC分类号： H01G4/008 ,  B32B18/00 ,  B32B2309/022 ,  B32B2311/08 ,  C04B35/265 ,  C04B35/6264 ,  C04B35/62655 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/96 ,  C04B2237/34 ,  C04B2237/408 ,  C04B2237/704 ,  H01B1/22 ,  H01F17/0013 ,  H01F41/046 ,  H01F2017/048 ,  H01G4/012 ,  H01G4/30 ,  H05K1/092

摘要： A method for producing a laminated electronic component produces a laminated electronic component having a superior surge-proofing property, a sufficient resistance to a flux, and excellent electrical properties, without experience the occurrence of structural effects such as cracking, delamination, or other structural defects. Conductive paste is prepared to contain conductive particles and resin particles having a thermal decomposition-ability. The resin particles have an average particle size of about 0.25 to about 1.50 times the average particle size of the conductive particles. The volume ratio of the resin particles is in the range of about 0.5 to about 1.0 the volume of the conductive particles. The conductive paste is applied to the surface of a ceramic layer to form a conductor layer. The ceramic layers and the conductor layers are alternately laminated. The laminate is fired to form a ceramic sintered laminate. Thus, a laminated electronic component is produced.

摘要翻译： 层压电子部件的制造方法制造具有优异的防浪涌性，足够的耐焊接性和优异的电性能的层压电子部件，而不会发生结构效应如开裂，分层或其他结构缺陷 。 制备导电浆料以含有具有热分解能力的导电颗粒和树脂颗粒。 树脂颗粒的平均粒径为导电颗粒的平均粒径的约0.25至约1.50倍。 树脂颗粒的体积比在导电颗粒体积的约0.5至约1.0的范围内。 将导电膏施加到陶瓷层的表面以形成导体层。 陶瓷层和导体层交替层叠。 将层压体烧成以形成陶瓷烧结层压体。 因此，制造层叠电子部件。