公开(公告)号：US20230046004A1

公开(公告)日：2023-02-16

申请号：US17740301

申请日：2022-05-09

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIA-LIN LIU ,  CHIEN-KAI WEI

IPC: C23C14/20 ,  C08L9/06 ,  C08G73/10

Abstract: A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.

公开(公告)号：US20230090736A1

公开(公告)日：2023-03-23

申请号：US17887525

申请日：2022-08-15

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  YU-TING LIU ,  CHUNG-YU CHEN ,  CHIA-RUEY TSAI ,  JUNG-TSU WU ,  CHIEN-KAI WEI

IPC: C08G65/48 ,  H05K1/03

Abstract: A polyphenylene ether resin modified with two amino functional groups, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the two amino functional groups has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

公开(公告)号：US20230047133A1

公开(公告)日：2023-02-16

申请号：US17740278

申请日：2022-05-09

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIEN-KAI WEI ,  CHIA-LIN LIU

IPC: C08L9/06 ,  B32B15/06 ,  B32B25/02

Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

公开(公告)号：US20230089728A1

公开(公告)日：2023-03-23

申请号：US17871982

申请日：2022-07-24

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  YU-TING LIU ,  CHIEN-KAI WEI ,  Chi-Lin Chen

IPC: C08G65/48 ,  C08K5/357

Abstract: A polyphenylene ether resin modified with benzoxazine, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the benzoxazine has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.

公开(公告)号：US20230002611A1

公开(公告)日：2023-01-05

申请号：US17560177

申请日：2021-12-22

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIEN-KAI WEI

IPC: C08L75/04 ,  C08J5/24 ,  B32B5/02 ,  B32B15/14

Abstract: A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

公开(公告)号：US20230128476A1

公开(公告)日：2023-04-27

申请号：US17885993

申请日：2022-08-11

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIEN-KAI WEI ,  CHIA-LIN LIU ,  WEI-RU HUANG

IPC: C08F36/06 ,  C08F212/08 ,  C08G65/48 ,  C08K3/36 ,  C08K9/04 ,  C08K5/3492 ,  C08K5/5425

Abstract: A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are dispersed in the resin composition. The resin composition includes 10 wt % to 40 wt % of a liquid rubber, 20 wt % to 50 wt % of a polyphenylene ether resin, and 10 wt % to 30 wt % of a crosslinker. The polyphenylene ether resin includes a first polyphenylene ether that has a bismaleimide group at a molecular end.

公开(公告)号：US20230091594A1

公开(公告)日：2023-03-23

申请号：US17850974

申请日：2022-06-27

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  YU-TING LIU ,  CHIEN-KAI WEI ,  Chi-Lin Chen

IPC: C08G65/48

Abstract: A polyphenylene ether resin modified with bismaleimide, a method for producing the same, and a substrate material for a circuit board are provided. The polyphenylene ether resin modified with the bismaleimide has a structural formula as follows: in which R represents a chemical group that is located between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25, inclusive.