公开(公告)号：US20230407086A1

公开(公告)日：2023-12-21

申请号：US17975567

申请日：2022-10-27

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIA-LIN LIU ,  WEI-RU HUANG

IPC: C08L71/12 ,  C08L21/00 ,  B32B15/06 ,  B32B25/14 ,  B32B25/18

CPC classification number: C08L71/123 ,  C08L21/00 ,  B32B15/06 ,  B32B25/14 ,  B32B25/18 ,  B32B15/20

Abstract: A rubber resin material with high thermal conductivity and low dielectric properties and a metal substrate using the same are provided. The rubber resin material includes a rubber resin composition and at least one surface-modified inorganic filler. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 40 wt % of a polyphenylene ether resin, and 10 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one surface-modified inorganic filler has one or more modifying functional groups that are selected from the group consisting of an acrylic group, a functional group having a nitrogen-containing main or branched chain, a double bond-containing functional group, and an epoxy group.

公开(公告)号：US20230046004A1

公开(公告)日：2023-02-16

申请号：US17740301

申请日：2022-05-09

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIA-LIN LIU ,  CHIEN-KAI WEI

IPC: C23C14/20 ,  C08L9/06 ,  C08G73/10

Abstract: A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.

公开(公告)号：US20230047133A1

公开(公告)日：2023-02-16

申请号：US17740278

申请日：2022-05-09

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIEN-KAI WEI ,  CHIA-LIN LIU

IPC: C08L9/06 ,  B32B15/06 ,  B32B25/02

Abstract: A rubber resin material with high dielectric constant and a metal substrate with high dielectric constant are provided. The rubber resin material with high dielectric constant includes a rubber resin composition with high dielectric constant and inorganic fillers. The rubber resin composition with high dielectric constant includes: 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. A dielectric constant of the rubber resin material with high dielectric constant is higher than or equal to 2.0.

公开(公告)号：US20200325304A1

公开(公告)日：2020-10-15

申请号：US16679439

申请日：2019-11-11

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HAO-SHENG CHEN ,  HUNG-YI CHANG ,  CHIA-LIN LIU ,  CHIH-KAI CHANG

IPC: C08K7/18 ,  C08K3/22 ,  C08K3/36 ,  C08K5/03 ,  C08K5/3417 ,  C08K5/5313 ,  C08J5/24 ,  H05K1/03

Abstract: A thermosetting resin composition and a printed circuit board including the same are provided. The composition adopts a thermosetting polyphenylene ether resin whose terminal functional group is a styrene and an acrylic. The thermosetting polyphenylene ether resin has an appropriate hydroxyl value to be easily cured, and the ratio of two different functional groups is between 0.5 and 1.5, for adjusting heat resistance, fluidity, and filling property. A particle diameter of 1 μm to 40 μm is added to control a dielectric constant, and after curing characteristics of high dielectric constant, low dielectric loss, high Tg, high rigidity, high flame resistance and low moisture absorption rate can be achieved.

公开(公告)号：US20230407062A1

公开(公告)日：2023-12-21

申请号：US17976959

申请日：2022-10-31

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  WEI-RU HUANG ,  CHIA-LIN LIU

IPC: C08L21/00 ,  C08L71/12 ,  C08K7/26 ,  C08K5/00

CPC classification number: C08L21/00 ,  C08L71/12 ,  C08L2203/20 ,  C08K5/0025 ,  C08K2201/005 ,  C08K7/26

Abstract: A low-dielectric substrate material and a metal substrate using the same are provided. The low-dielectric substrate material includes a rubber resin composition, at least one inorganic filler, and borosilicate-type hollow microparticles. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 40 wt % of a polyphenylene ether resin, and 10 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one inorganic filler is selected from the group consisting of magnesium oxide, aluminum oxide, silicon oxide, zinc oxide, aluminum nitride, boron nitride, silicon carbide, and aluminum silicate. An amount of the borosilicate-type hollow microparticles is not more than 10 phr relative to 100 phr of the rubber resin composition.

公开(公告)号：US20230406982A1

公开(公告)日：2023-12-21

申请号：US17975568

申请日：2022-10-27

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  HAO-SHENG CHEN ,  CHIA-LIN LIU

IPC: C08F236/06 ,  C08F212/08 ,  C08F212/36 ,  C08F222/06 ,  C08G65/48 ,  C08K3/22 ,  C08K3/38 ,  C08K3/36 ,  C08K5/5425 ,  C08K9/04 ,  B32B15/082 ,  B32B15/20

CPC classification number: C08F236/06 ,  C08F212/08 ,  C08F212/36 ,  C08F222/06 ,  C08G65/485 ,  C08K3/22 ,  C08K3/38 ,  C08K3/36 ,  C08K5/5425 ,  C08K9/04 ,  B32B15/082 ,  B32B15/20 ,  C08F2810/40 ,  C08K2201/001 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2003/2241 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2311/12 ,  B32B2307/302 ,  B32B2307/204

Abstract: A rubber resin material with a high thermal conductivity and a high dielectric constant and a metal substrate using the same are provided. The rubber resin material includes a rubber resin composition, at least one first inorganic filler, and at least one second inorganic filler. The rubber resin composition includes 30 wt % to 60 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 2500 g/mol to 6000 g/mol. The at least one first inorganic filler is selected from the group consisting of aluminum oxide, boron nitride, magnesium oxide, zinc oxide, aluminum nitride, silicon carbide, and aluminum silicate. The at least one second inorganic filler is selected from the group consisting of silica, strontium titanate, calcium titanate, and titanium dioxide.

公开(公告)号：US20230128476A1

公开(公告)日：2023-04-27

申请号：US17885993

申请日：2022-08-11

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIEN-KAI WEI ,  CHIA-LIN LIU ,  WEI-RU HUANG

IPC: C08F36/06 ,  C08F212/08 ,  C08G65/48 ,  C08K3/36 ,  C08K9/04 ,  C08K5/3492 ,  C08K5/5425

Abstract: A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are dispersed in the resin composition. The resin composition includes 10 wt % to 40 wt % of a liquid rubber, 20 wt % to 50 wt % of a polyphenylene ether resin, and 10 wt % to 30 wt % of a crosslinker. The polyphenylene ether resin includes a first polyphenylene ether that has a bismaleimide group at a molecular end.

公开(公告)号：US20230044091A1

公开(公告)日：2023-02-09

申请号：US17741585

申请日：2022-05-11

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HUNG-YI CHANG ,  CHIA-LIN LIU

IPC: C08L9/06 ,  C08L9/00 ,  B32B15/06

Abstract: A rubber resin material with high thermal conductivity and a metal substrate with high thermal conductivity are provided. The rubber resin material includes inorganic fillers and a rubber resin composition with high thermal conductivity. The rubber resin composition with high thermal conductivity includes 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

公开(公告)号：US20220030709A1

公开(公告)日：2022-01-27

申请号：US17337682

申请日：2021-06-03

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HAO-SHENG CHEN ,  HUNG-YI CHANG ,  CHIA-LIN LIU ,  CHIH-KAI CHANG

IPC: H05K1/03 ,  C08K3/36 ,  B32B15/08 ,  C08L71/12

Abstract: A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 phr, the resin composition for the high frequency substrate includes: 20 phr to 70 phr of a polyphenylene ether resin, 5 phr to 40 phr of a polybutadiene resin, 5 phr to 30 phr of a bismaleimide resin, and 20 phr to 45 phr of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230° C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate.

公开(公告)号：US20220024182A1

公开(公告)日：2022-01-27

申请号：US17316677

申请日：2021-05-10

Applicant: NAN YA PLASTICS CORPORATION

Inventor： TE-CHAO LIAO ,  HAO-SHENG CHEN ,  HUNG-YI CHANG ,  CHIH-KAI CHANG ,  CHIA-LIN LIU

IPC: B32B15/16 ,  B32B15/08 ,  B32B15/14 ,  B32B5/16

Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.