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公开(公告)号:US10224156B2
公开(公告)日:2019-03-05
申请号:US15318074
申请日:2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor: Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang , Zhihao Dong , Jie Shi
IPC: H01H13/10 , H01H1/021 , C25D3/56 , C25D3/60 , C25D5/02 , H01H1/025 , H01H11/06 , C25D5/34 , C25D5/36 , C25D5/40 , C25D7/00 , C23C18/16 , C23C18/32 , C23C18/52 , H01H13/785
Abstract: The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.
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公开(公告)号:US20170133174A1
公开(公告)日:2017-05-11
申请号:US15318074
申请日:2015-07-15
Applicant: NANTONG MEMTECH TECHNOLOGIES CO., LTD.
Inventor: Huisheng Han , Zhenxing Wang , Yang Ding , Hongmei Zhang , Zhihao Dong , Jie Shi
CPC classification number: H01H13/10 , C23C18/1689 , C23C18/1692 , C23C18/32 , C23C18/52 , C25D3/56 , C25D3/60 , C25D5/02 , C25D5/34 , C25D5/36 , C25D5/40 , C25D7/00 , H01H1/021 , H01H1/025 , H01H11/06 , H01H13/785 , H01H2011/065 , H01H2201/002 , H01H2201/022 , H01H2229/014
Abstract: The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.
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