公开(公告)号：US20240234366A9

公开(公告)日：2024-07-11

申请号：US18546088

申请日：2022-01-27

Applicant: NHK SPRING CO., LTD.

Inventor： Ryo TANAKA ,  Yuichiro YAMAUCHI ,  Kohei SUZUKI

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/83 ,  H01L23/498 ,  H01L24/32 ,  H01L24/75 ,  H05K1/183 ,  H05K1/186 ,  H05K3/3463 ,  H01L2224/05014 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/75353 ,  H01L2224/83205 ,  H01L2224/83385 ,  H01L2924/3511

Abstract: A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.

公开(公告)号：US20240136325A1

公开(公告)日：2024-04-25

申请号：US18546088

申请日：2022-01-27

Applicant: NHK SPRING CO., LTD.

Inventor： Ryo TANAKA ,  Yuichiro YAMAUCHI ,  Kohei SUZUKI

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/83 ,  H01L23/498 ,  H01L24/32 ,  H01L24/75 ,  H05K1/183 ,  H05K1/186 ,  H05K3/3463 ,  H01L2224/05014 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/75353 ,  H01L2224/83205 ,  H01L2224/83385 ,  H01L2924/3511

Abstract: A circuit board having a circuit pattern on a base plate and an additional metal layer laid and bonded on the circuit pattern, wherein the additional metal layer comprises an attachment plane portion configured to fix a semiconductor chip using solder, and an engagement uneven portion provided adjacent to the attachment plane portion, wherein the attachment plane portion is a face having unevenness smaller than the engagement uneven portion.

公开(公告)号：US20210017084A1

公开(公告)日：2021-01-21

申请号：US17033704

申请日：2020-09-26

Applicant: NHK SPRING CO., LTD.

Inventor： Kohei SUZUKI ,  Toshiaki MARUICHI

IPC: C04B35/04 ,  C04B35/628 ,  C04B35/10 ,  H05K1/02 ,  H05K1/05 ,  C04B35/63 ,  C04B35/634

Abstract: A thermally conductive composite particle, including: a core portion including an inorganic particle; and a shell portion including a nitride particle and covering the core portion, is provided. The thermally conductive composite particle is a sintered body.

公开(公告)号：US20190228953A1

公开(公告)日：2019-07-25

申请号：US16367643

申请日：2019-03-28

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiro TACHIKAWA ,  Naoya AIKAWA ,  Go TAKAHARA ,  Kohei SUZUKI ,  Hiroshi MITSUDA

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01J37/34 ,  C23C16/46 ,  C23C16/458 ,  C23C14/50

Abstract: Provided is a stage for precisely controlling a substrate temperature and a manufacturing method thereof. Alternatively, a film-forming apparatus or a film-processing apparatus having the stage is provided. The stage includes a base material and a heater layer over the base material. The heater layer has a first insulating film, a heater wire over the first insulating film, and a second insulating film over the heater wire. The heater wire includes more than one kind of metal selected from tungsten, nickel. chromium cobalt, and molybdenum.