METHOD OF MANUFACTURING LIGHT EMITTING DEVICE

    公开(公告)号:US20180114882A1

    公开(公告)日:2018-04-26

    申请号:US15851459

    申请日:2017-12-21

    Abstract: A light emitting device includes: a light emitting element including: a semiconductor structure including an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, each containing a nitride semiconductor, a p-electrode disposed on a portion of a surface of the p-type semiconductor layer on a side opposite to a surface provided with the active layer, and an n-electrode disposed on a surface of the n-type semiconductor layer on a side opposite to a surface provided with the active layer in a region other than a region facing the p-electrode; and a protective film continuously covering a surface of the n-electrode and a surface of the n-type semiconductor layer. The protective film includes a first metal oxide film and a second metal oxide film that are alternately layered, the first metal oxide film containing a first metal, and the second metal oxide film containing a second metal.

    LIGHT EMITTING DEVICE
    2.
    发明申请

    公开(公告)号:US20220336722A1

    公开(公告)日:2022-10-20

    申请号:US17724139

    申请日:2022-04-19

    Abstract: A light emitting device includes: a base having an upper face; a light emitting element mounted on the upper face of the base; one or more bonding members disposed on the upper face of the base outward of the light emitting element; a light transmissive member bonded to a portion of the upper face of the base by the one or more bonding members; and a protective film that continuously covers the light emitting element, the upper face of the base, lateral faces of the one or more bonding members, and a lower face of the light transmissive member. A gap is located between the upper face of the base and the lower face of the light transmissive member and configured to allow a space in which the light emitting element is mounted to communicate with an outside of the light emitting device, wherein the gap is defined by the upper face of the base, the lower face of the light transmissive member, and the one or more bonding members.

    METHOD OF MANUFACTURING OPTICAL MEMBER
    3.
    发明公开

    公开(公告)号:US20240061159A1

    公开(公告)日:2024-02-22

    申请号:US18446592

    申请日:2023-08-09

    Inventor: Takaaki TADA

    CPC classification number: G02B5/0268 G02B5/0231 G02B5/0221

    Abstract: A method of manufacturing an optical member includes forming a first layer on a light transmissive substrate by atomic layer deposition, converting a surface layer of the first layer into a boehmite layer, and forming a second layer by atomic layer deposition so as to cover the boehmite layer. The first layer includes aluminum oxide and has a first thickness. The second layer has a second thickness less than the first thickness.

    METHOD OF MANUFACTURING LIGHT EMITTING DEVICE

    公开(公告)号:US20180342648A1

    公开(公告)日:2018-11-29

    申请号:US16035510

    申请日:2018-07-13

    Abstract: A light emitting device includes: a light emitting element including: a semiconductor structure including an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, each containing a nitride semiconductor, a p-electrode disposed on a portion of a surface of the p-type semiconductor layer on a side opposite to a surface provided with the active layer, and an n-electrode disposed on a surface of the n-type semiconductor layer on a side opposite to a surface provided with the active layer in a region other than a region facing the p-electrode; and a protective film continuously covering a surface of the n-electrode and a surface of the n-type semiconductor layer. The protective film includes a first metal oxide film and a second metal oxide film that are alternately layered, the first metal oxide film containing a first metal, and the second metal oxide film containing a second metal.

    LIGHT EMITTING MODULE
    6.
    发明申请

    公开(公告)号:US20200098735A1

    公开(公告)日:2020-03-26

    申请号:US16582259

    申请日:2019-09-25

    Inventor: Takaaki TADA

    Abstract: A light emitting module includes red, green and blue light sources, and a light diffusing member is arranged above the light sources. The red light source includes a first light emitting element configured to emit light in a range from ultraviolet to blue, a first phosphor layer containing a first phosphor configured to emit red light, and a first film configured to transmit red light and block light in the range from ultraviolet to blue. The green light source includes a second light emitting clement configured to emit light in the range from ultraviolet to blue, a second phosphor layer containing a second phosphor configured to emit green light, and a second film configured to transmit green light and block light in the range from ultraviolet to blue. The blue light source includes a third light emitting element configured to emit light in the range from ultraviolet to blue.

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