LIGHT-EMITTING DEVICE
    1.
    发明公开

    公开(公告)号:US20230387365A1

    公开(公告)日:2023-11-30

    申请号:US18302418

    申请日:2023-04-18

    Inventor: Takuya YAMANOI

    CPC classification number: H01L33/60

    Abstract: A light-emitting device includes a base member having a recess inside which a light-emitting element is disposed; and a light-reflective member continuously disposed on an upper surface of the bottom portion and at least a portion of an inner lateral surface of a wall portion inside the recess of the base member, in a cross-sectional view, the inner lateral surface of the wall portion having a first surface, a second surface located above the first surface, and a third surface connecting the first surface and the second surface, a shortest distance between the second surface and the light-emitting element being larger than a shortest distance between the first surface and the light-emitting element, the third surface being located below an upper surface of the light-emitting element, and an upper end of the light-reflective member being located below an upper surface of the wall portion.

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE

    公开(公告)号:US20220140202A1

    公开(公告)日:2022-05-05

    申请号:US17579998

    申请日:2022-01-20

    Abstract: A light emitting device includes a package having an upper surface and an upward-opening recess defined in a portion of the upper surface, at least one light-emitting element in the recess, a light-transmissive member covering the opening of the recess, and an antireflection film on a lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package via the antireflection film. A coating film is disposed on at least a portion of an outer surfaces of the light emitting device, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the package is exposed.

    LIGHT-EMITTING DEVICE
    4.
    发明申请

    公开(公告)号:US20170288096A1

    公开(公告)日:2017-10-05

    申请号:US15475160

    申请日:2017-03-31

    CPC classification number: H01L33/486 H01L25/167 H01L33/60

    Abstract: A light-emitting device includes a substrate including a substrate second upper surface provided between a substrate bottom surface and a substrate first upper surface in a height direction. A light-emitting element to emit ultraviolet light is provided on the substrate first upper surface. A protective element includes a protective element upper surface provided between the substrate first upper surface and the substrate second upper surface in the height direction. A frame is bonded to the substrate first upper surface via adhesive members to surround the light-emitting element. The frame includes a frame lower surface opposite to the substrate first upper surface and the substrate second upper surface in the height direction to provide a gap between the substrate first upper surface and the frame lower surface. A space in which the light-emitting element is provided communicates with an outside of the light-emitting device via the gap.

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTING DEVICE

    公开(公告)号:US20200287092A1

    公开(公告)日:2020-09-10

    申请号:US16811965

    申请日:2020-03-06

    Abstract: A light emitting device includes a package having an upper surface and an upward-opening recess defined in a portion of the upper surface, at least one light-emitting element in the recess, a light-transmissive member covering the opening of the recess, and an antireflection film on a lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package via the antireflection film. A coating film is disposed on at least a portion of an outer surfaces of the light emitting device, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the package is exposed.

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