公开(公告)号：US20230012665A1

公开(公告)日：2023-01-19

申请号：US17787199

申请日：2020-12-09

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Yoshiharu NAGAE ,  Kiyoshi ENOMOTO ,  Shota MURAKAMI

IPC: H01S5/02325 ,  H01L23/00 ,  H01S5/40 ,  H01S5/02315 ,  H01S5/02255 ,  H01S5/02208 ,  H01S5/0683

Abstract: A light detecting element is realized in which a length thereof is reduced in a direction perpendicular to a direction in which light detecting regions are disposed side by side. A light detecting element includes a light detecting surface provided with a plurality of light detecting regions disposed side by side in a first direction and a plurality of wiring regions electrically connected to the plurality of light detecting regions. Of the plurality of wiring regions, a plurality of the wiring regions connected to a plurality of the light detecting regions are provided in an end region that is a region excluding a central region at the light detecting surface.

公开(公告)号：US20170373234A1

公开(公告)日：2017-12-28

申请号：US15632513

申请日：2017-06-26

Applicant: NICHIA CORPORATION

Inventor： Yoshiharu NAGAE

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L21/6875 ,  H01L21/68785 ,  H01L24/97 ,  H01L33/00 ,  H01L33/486 ,  H01L2933/0066

Abstract: A method of manufacturing at least one semiconductor device includes: providing a substrate having a flat lower surface, and an upper surface that allows mounting of at least one semiconductor element or an upper surface having at least one semiconductor mounted thereon; providing a work table having a support plate with a flat support surface for placing the substrate, and having a plurality of support pins arranged at a support surface side and configured to move along an up-and-down direction; abutting the lower surface of the substrate upon tip portions of the plurality of support pins to press down so that the lower surface of the substrate abuts upon the support surface of the support plate; and fixing the substrate on the support plate and performing one or more operations on the substrate.