公开(公告)号：US20240055827A1

公开(公告)日：2024-02-15

申请号：US18494190

申请日：2023-10-25

Applicant: NICHIA CORPORATION

Inventor： Shota MURAKAMI ,  Soichiro MIURA

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/026

CPC classification number: H01S5/022 ,  H01S5/02461 ,  H01S5/0262

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and includes a first stepped portion including a first upper face and a second stepped portion including a second upper face, wherein the first upper face and the second upper face are disposed below the uppermost face, wherein the first upper face and the second upper face are disposed inward of the uppermost face in a top view, and wherein a height of the first stepped portion from the bottom face is lower than a height of the second stepped portion from the bottom face; a semiconductor laser element disposed on the bottom face; and a light reflective member and/or an optical member disposed on the bottom face.

公开(公告)号：US20240413602A1

公开(公告)日：2024-12-12

申请号：US18808446

申请日：2024-08-19

Applicant: NICHIA CORPORATION

Inventor： Shota MURAKAMI ,  Soichiro MIURA

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/026

Abstract: A base includes: a bottom part having a bottom face; and a lateral part surrounding the bottom face and extending upwards from the bottom face, the lateral part having an uppermost face and comprises a first stepped portion including a first upper face and a second stepped portion including a second upper face, the first upper face and the second upper face being disposed below the uppermost face, and a height of the first stepped portion from the bottom face being different from a height of the second stepped portion from the bottom face. In a top view: the first upper face and the second upper face are disposed inward of the uppermost face, the bottom face is directly adjacent to the first upper face, the bottom face is directly adjacent to the second upper face, and the first upper face is directly adjacent to the second upper face.

公开(公告)号：US20210175681A1

公开(公告)日：2021-06-10

申请号：US17111194

申请日：2020-12-03

Applicant: NICHIA CORPORATION

Inventor： Shota MURAKAMI ,  Soichiro MIURA

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/026

Abstract: A light emitting device includes: a base having a first stepped portion and a second stepped portion; a light emitting element; an electronic member configured to be irradiated by light emitted from the light emitting element; a first wiring region located on the first stepped portion; a second wiring region located on the second stepped portion; wires connected to the light emitting element and the electronic member. The wires includes a first and second wires. The first wire has a first end that is connected to the first wiring region, and a second end. The second wire has a first end that is connected to the second wiring region, and a second end. A position of the second end of the first wire relative to the bottom face is lower than a position of the second end of the second wire relative to the bottom face.

公开(公告)号：US20230187899A1

公开(公告)日：2023-06-15

申请号：US18065587

申请日：2022-12-13

Applicant: NICHIA CORPORATION

Inventor： Shota MURAKAMI ,  Norikazu YANO ,  Tadaaki MIYATA

IPC: H01S5/0237 ,  B23K1/00

CPC classification number: H01S5/0237 ,  B23K1/0016 ,  B23K35/3013

Abstract: A manufacturing method of a light-emitting device includes: preparing a mounting substrate having a mounting surface, the mounting substrate including a first metal pattern arranged on a mounting surface side, a second metal pattern arranged on the mounting surface side inward of the first metal pattern in a plan view, and a third metal pattern arranged on the mounting surface side outward of the first metal pattern in the plan view; arranging a light-emitting element over the mounting surface of the mounting substrate; applying a bonding material to the first metal pattern; and joining a sealing member to at least the first metal pattern of the mounting substrate via the bonding material, the sealing member including a fourth metal pattern with a width greater than or equal to a width of the first metal pattern.

公开(公告)号：US20230125799A1

公开(公告)日：2023-04-27

申请号：US18146070

申请日：2022-12-23

Applicant: NICHIA CORPORATION

Inventor： Shota MURAKAMI ,  Soichiro MIURA

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/026

Abstract: A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

公开(公告)号：US20230012665A1

公开(公告)日：2023-01-19

申请号：US17787199

申请日：2020-12-09

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Yoshiharu NAGAE ,  Kiyoshi ENOMOTO ,  Shota MURAKAMI

IPC: H01S5/02325 ,  H01L23/00 ,  H01S5/40 ,  H01S5/02315 ,  H01S5/02255 ,  H01S5/02208 ,  H01S5/0683

Abstract: A light detecting element is realized in which a length thereof is reduced in a direction perpendicular to a direction in which light detecting regions are disposed side by side. A light detecting element includes a light detecting surface provided with a plurality of light detecting regions disposed side by side in a first direction and a plurality of wiring regions electrically connected to the plurality of light detecting regions. Of the plurality of wiring regions, a plurality of the wiring regions connected to a plurality of the light detecting regions are provided in an end region that is a region excluding a central region at the light detecting surface.