公开(公告)号：US20210178734A1

公开(公告)日：2021-06-17

申请号：US16322776

申请日：2017-07-06

Applicant: NITTO DENKO CORPORATION

Inventor： Kazumichi KATO ,  Hideyuki TOKUYAMA

IPC: B32B27/06 ,  G06F3/041 ,  C08J9/30

Abstract: There is provided a foamed sheet having the excellent impact absorbability and the excellent resistance to repetitive impacts. The foamed sheet of the present invention has an average cell diameter of 10 to 200 μm, a resiliency of 6.0 N/cm2 or less when compressed to 50% of an original thickness thereof, and a thickness recovery rate defined by the following equation of 90% or more: thickness recovery rate (%)=(thickness 0.5 seconds after compressed state is released)/(original thickness)×100 original thickness: a thickness of the foamed sheet before a load is applied, thickness 0.5 seconds after compressed state is released: a thickness of the foamed sheet after a compressed state in which a load of 100 g/cm2 is applied to the foamed sheet is kept for 120 seconds followed by release of the foamed sheet from the compression and an elapse of 0.5 seconds from the release.

公开(公告)号：US20210070011A1

公开(公告)日：2021-03-11

申请号：US16960136

申请日：2018-12-17

Applicant: NITTO DENKO CORPORATION

Inventor： Hideyuki TOKUYAMA ,  Makoto SAITO

IPC: B32B5/18 ,  B32B27/30 ,  B32B27/06 ,  C09J7/38 ,  C09J7/26

Abstract: Provided is a foam sheet that can raise an electrostatic capacitance at the time of compression, and hence can improve sensitivity when used for an electrostatic capacitance sensor. The foam sheet includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has a dielectric constant increase amount Q-P at 10% compression of 0.2 (F/m) or more, where P (F/m) represents a dielectric constant of the foam sheet immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Q (F/m) represents a dielectric constant of the foam sheet at a time when the foam sheet is compressed by 10% immediately after being left at rest under the conditions of a temperature of 23° C. and a humidity of 50% for 2 hours.

公开(公告)号：US20200346439A1

公开(公告)日：2020-11-05

申请号：US16964385

申请日：2018-12-17

Applicant: NITTO DENKO CORPORATION

Inventor： Hideyuki TOKUYAMA ,  Makoto SAITO

IPC: B32B27/06 ,  B32B5/18 ,  B32B5/22 ,  B32B7/12 ,  B32B27/30 ,  C09J7/38 ,  C09J7/26

Abstract: Provided is a foam sheet showing little change in dielectric constant even when exposed under a high-humidity condition. The foam sheet of the present invention includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has a dielectric constant change amount [(Y−X)×100]/X of 10(%) or less, where X (F/m) represents a dielectric constant of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Y (F/m) represents a dielectric constant of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 60° C. and a humidity of 95% for 24 hours.

公开(公告)号：US20200255711A1

公开(公告)日：2020-08-13

申请号：US16648044

申请日：2018-06-11

Applicant: NITTO DENKO CORPORATION

Inventor： Toru ISEKI ,  Kazumichi KATO ,  Hideyuki TOKUYAMA ,  Mitsuhiro KANADA

IPC: C09J183/04 ,  C09J11/04 ,  C08J9/30 ,  C08J9/00

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010Ω/□, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm□), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm□), relationships of V1

公开(公告)号：US20160221299A1

公开(公告)日：2016-08-04

申请号：US14914359

申请日：2014-08-21

Applicant: NITTO DENKO CORPORATION

Inventor： Kohei DOI ,  Kunio NAGASAKI ,  Tetsuya OTSUKA ,  Mika OKADA ,  Kazumichi KATO ,  Hideyuki TOKUYAMA ,  Tsunaki KITAHARA ,  Tadao TAKAHASHI ,  Kiichiro MATSUSHITA

IPC: B32B5/18 ,  H05K5/00 ,  B32B7/12

CPC classification number: B32B5/18 ,  B32B7/06 ,  B32B7/12 ,  B32B27/065 ,  B32B27/308 ,  B32B27/36 ,  B32B2266/0207 ,  B32B2266/0221 ,  B32B2266/0242 ,  B32B2266/0278 ,  B32B2266/06 ,  B32B2307/302 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2307/558 ,  B32B2307/56 ,  B32B2307/72 ,  B32B2307/732 ,  B32B2457/20 ,  B32B2571/00 ,  C08J9/30 ,  C08J2201/026 ,  C08J2201/0504 ,  C08J2205/05 ,  C08J2205/06 ,  C08J2309/04 ,  C08J2323/08 ,  C08J2333/08 ,  C08J2375/04 ,  C09J7/26 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2423/046 ,  C09J2431/006 ,  C09J2433/006 ,  C09J2475/006 ,  H04M1/0266 ,  H04M1/185 ,  H05K5/0017

Abstract: A foamed sheet according to the present invention has a thickness of 30 to 500 μm and includes a foam. The foam has a density of 0.2 to 0.7 g/cm3, an average cell diameter of 10 to 150 μm, and a peak top of loss tangent (tan δ) occurring in a temperature range of from −30° C. to 30° C., where the loss tangent is defined as the ratio of a loss modulus to a storage modulus determined at an angular frequency of 1 rad/s in dynamic viscoelastic measurement of the foam. The foam preferably has a maximum of the loss tangent (tan δ) in the temperature range of from −30° C. to 30° C. of 0.2 or more.

Abstract translation: 根据本发明的发泡片材的厚度为30-500μm，并且包括泡沫。 泡沫体的密度为0.2〜0.7g / cm 3，平均泡孔直径为10〜150μm，在-30℃〜30℃的温度范围内发生损耗角正切峰值（tanδ） 其中损耗角正切被定义为在泡沫的动态粘弹性测量中以1rad / s的角频率确定的损耗模量与储能模量的比率。 泡沫优选在-30℃至30℃的温度范围内具有0.2或更大的损耗角正切（tanδ）的最大值。

公开(公告)号：US20210060895A1

公开(公告)日：2021-03-04

申请号：US16959384

申请日：2018-12-17

Applicant: NITTO DENKO CORPORATION

Inventor： Hideyuki TOKUYAMA ,  Makoto SAITO

IPC: B32B5/18 ,  B32B27/06 ,  C09J7/38 ,  C09J7/26 ,  C09J7/25 ,  C09J133/08 ,  C09J153/00

Abstract: Provided is a foam sheet showing little change in dielectric constant even when exposed under a high-humidity condition. The foam sheet of the present invention includes: a foam layer; and a pressure-sensitive adhesive layer arranged on at least one side of the foam layer, wherein the foam sheet has an impact absorbability change amount [(Q−P)×100]/P of 10 (%) or less, where P (N) represents impact absorbability of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 23° C. and a humidity of 50% for 2 hours, and Q (N) represents impact absorbability of the foam layer immediately after the foam sheet has been left at rest under conditions of a temperature of 60° C. and a humidity of 95% for 24 hours.

公开(公告)号：US20200030772A1

公开(公告)日：2020-01-30

申请号：US16603388

申请日：2018-01-22

Applicant: NITTO DENKO CORPORATION

Inventor： Toru ISEKI ,  Kohei DOI ,  Mitsuhiro KANADA ,  Kazumichi KATO ,  Hideyuki TOKUYAMA

IPC: B01J20/26 ,  B01J20/28 ,  B01J20/30 ,  C09J7/10 ,  H01L21/683

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as −40° C., 23° C., or 125° C. is represented by V1 (N/1 cm□), V2 (N/1 cm□), or V3 (N/1 cm□) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (−40° C., 23° C., or 125° C.) is represented by H1 (N/1 cm□), H2 (N/1 cm□), or H3 (N/1 cm□), relationships of V1

公开(公告)号：US20160303822A1

公开(公告)日：2016-10-20

申请号：US15101437

申请日：2015-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Kazumichi KATO ,  Kohei DOI ,  Hideyuki TOKUYAMA ,  Tadao TAKAHASHI

IPC: B32B5/18 ,  C08J9/00 ,  C09J7/02 ,  C08J5/18 ,  C08J9/12

CPC classification number: C08J5/18 ,  B32B5/18 ,  B32B27/065 ,  B32B27/283 ,  B32B2266/025 ,  B32B2266/0278 ,  B32B2266/08 ,  B32B2305/022 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/558 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2405/00 ,  B32B2457/20 ,  C08J9/0061 ,  C08J9/12 ,  C08J9/30 ,  C08J9/365 ,  C08J2201/026 ,  C08J2205/044 ,  C08J2205/05 ,  C08J2205/06 ,  C08J2207/00 ,  C08J2333/06 ,  C08J2333/08 ,  C08J2433/08 ,  C08J2491/00 ,  C09J7/26 ,  C09J201/00 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2400/24 ,  C09J2423/046 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2475/006 ,  G02F2201/503

Abstract: The foamed sheet includes a foamed body having an average cell diameter of 10 to 200 μm, and a compression set at 80° C. of not more than 80% and an impact absorption change rate of not more than ±20% defined by: Impact absorption change rate (%)={(an impact absorption rate b after high-temperature compression−an initial impact absorption rate a)/the initial impact absorption rate a}×100, where the impact absorption rate a is an impact absorption rate (%) of a test piece A and the impact absorption rate b (%) after high-temperature compression is an impact absorption rate (%) acquired by storing the test piece A at 80° C. for 72 hours in the state of being compressed by 60% with respect to the initial thickness of the test piece A, thereafter releasing the compression state, and thereafter conducting measurement after a lapse of 24 hours at 23° C.

Abstract translation: 其中冲击吸收率a是试件A的冲击吸收率（％）和高温压缩后的冲击吸收率b（％）是通过将试样A储存在80℃而获得的冲击吸收率（％） 在相对于试验片A的初始厚度被压缩60％的状态下72小时，然后释放压缩状态，然后在23℃经过24小时后进行测量。