公开(公告)号：US20180086949A1

公开(公告)日：2018-03-29

申请号：US15705468

申请日：2017-09-15

Applicant: NITTO DENKO CORPORATION

Inventor： Ryo MORIOKA ,  Akira HIRAO ,  Mitsuhiro KANADA

IPC: C09J9/02 ,  C09J7/00 ,  C09J133/08 ,  C09J11/04

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K9/02 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/38 ,  C09J11/04 ,  C09J133/08 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2467/006

Abstract: Provided is a conductive pressure-sensitive adhesive tape that achieves both strong adhesion to an adherend and a reworking property. A conductive pressure-sensitive adhesive tape (1) includes a pressure-sensitive adhesive layer (2) containing a pressure-sensitive adhesive resin containing a pressure-sensitive adhesive polymer and conductive particles (4) dispersed in the pressure-sensitive adhesive resin, in which: the pressure-sensitive adhesive layer (2) has a surface layer (22) that is formed of the pressure-sensitive adhesive resin and that forms a surface of the pressure-sensitive adhesive layer; and a thickness of the surface layer (22) includes an analysis depth from the surface of the pressure-sensitive adhesive layer when a spectral intensity derived from the conductive particles in glow discharge spectrometry becomes one half of a maximum thereof, and is 0.1 μm or more and 0.9 μm or less.

公开(公告)号：US20180086954A1

公开(公告)日：2018-03-29

申请号：US15705470

申请日：2017-09-15

Applicant: NITTO DENKO CORPORATION

Inventor： Ryo MORIOKA ,  Akira HIRAO ,  Mitsuhiro KANADA

IPC: C09J133/08 ,  C09J9/02 ,  C09J11/04

CPC classification number: C09J133/08 ,  C08K3/013 ,  C08K2201/001 ,  C09J7/385 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2203/322 ,  C09J2203/326 ,  C09J2205/102

Abstract: Provided is a filler-containing pressure-sensitive adhesive tape having an excellent pressure-sensitive adhesive strength while suppressing the occurrence of a volatile component. The filler-containing pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive resin containing an acrylic polymer and a filler dispersed in the pressure-sensitive adhesive resin, in which the acrylic polymer contains at least a constituent unit derived from a (meth)acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 20 carbon atoms, a constituent unit derived from a nitrogen-containing monomer, and a constituent unit derived from a carboxyl group-containing monomer, and has a ratio (mass ratio) of the constituent unit derived from the carboxyl group-containing monomer to the constituent unit derived from the nitrogen-containing monomer of from 0.01 to 40.

公开(公告)号：US20200255711A1

公开(公告)日：2020-08-13

申请号：US16648044

申请日：2018-06-11

Applicant: NITTO DENKO CORPORATION

Inventor： Toru ISEKI ,  Kazumichi KATO ,  Hideyuki TOKUYAMA ,  Mitsuhiro KANADA

IPC: C09J183/04 ,  C09J11/04 ,  C08J9/30 ,  C08J9/00

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, having a weak adhesive strength in a direction vertical to the surface, and having excellent antistatic performance. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, and has a surface resistivity of from 1.0×104 to 1.0×1010Ω/□, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by V1, V2, or V3 (N/1 cm□), and when a silicon chip shearing adhesive strength of the surface of the foam layer after 18 hours at each of such different temperatures as −30° C., 23° C., or 80° C. is represented by H1, H2, or H3 (N/1 cm□), relationships of V1

公开(公告)号：US20180066163A1

公开(公告)日：2018-03-08

申请号：US15810758

申请日：2017-11-13

Applicant: NITTO DENKO CORPORATION

Inventor： Kenji FURUTA ,  Yoshio TERADA ,  Tadashi TAKAHASHI ,  Mitsuhiro KANADA

IPC: C09J7/02 ,  B32B27/36 ,  B32B37/12 ,  B32B7/12 ,  C09J133/06

CPC classification number: B32B7/12 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/12 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/10 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/50 ,  B32B2307/732 ,  B32B2310/0831 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/28 ,  C09J7/29 ,  C09J7/38 ,  C09J133/066 ,  C09J2201/122 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2400/163 ,  C09J2400/226 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2467/00

Abstract: A magnetic disk drive includes a base having an opening, a cover configured to close the opening of the base, and a pressure-sensitive adhesive sheet configured to seal a gap between the base and the cover. The pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer, and a substrate layer configured to support the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1,680 N/cm to 3,000 N/cm. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm, the amount being the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the holding ability test is started. Helium gas is accommodated in a cavity defined by the base and the cover.

公开(公告)号：US20170253773A1

公开(公告)日：2017-09-07

申请号：US15445061

申请日：2017-02-28

Applicant: NITTO DENKO CORPORATION

Inventor： Kenji FURUTA ,  Yoshio TERADA ,  Tadashi TAKAHASHI ,  Mitsuhiro KANADA

IPC: C09J7/02 ,  B32B7/12 ,  B32B27/36 ,  B32B37/12

CPC classification number: B32B7/12 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/12 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/281 ,  B32B27/286 ,  B32B27/288 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B37/12 ,  B32B38/10 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/50 ,  B32B2307/732 ,  B32B2310/0831 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/28 ,  C09J7/29 ,  C09J7/38 ,  C09J133/066 ,  C09J2201/122 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2400/163 ,  C09J2400/226 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2467/00

Abstract: A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23° C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cm2 of the sheet in a holding ability test at 80° C. after one hour from a time when the test is started.

公开(公告)号：US20220093816A1

公开(公告)日：2022-03-24

申请号：US17421798

申请日：2019-12-03

Applicant: NITTO DENKO CORPORATION

Inventor： Toru ISEKI ,  Makoto SAITO ,  Mitsuhiro KANADA

IPC: H01L33/00 ,  H01L25/075 ,  H01L21/683 ,  H01L33/48

Abstract: Provided is a method of manufacturing an element-mounted substrate having mounted thereon elements with high positional accuracy. The method of manufacturing an element-mounted substrate of the present invention is a method of manufacturing an element-mounted substrate having elements mounted on a substrate, the method including: a step (I) of preparing a temporary fixing material with elements having arrayed thereon the elements by holding one surface of each of the elements on a temporary fixing material; a step (II) of arranging the temporary fixing material with elements on the substrate so that another surface of each of the elements adheres onto the substrate; and a step (III) of peeling the temporary fixing material from the elements adhering onto the substrate.

公开(公告)号：US20200030772A1

公开(公告)日：2020-01-30

申请号：US16603388

申请日：2018-01-22

Applicant: NITTO DENKO CORPORATION

Inventor： Toru ISEKI ,  Kohei DOI ,  Mitsuhiro KANADA ,  Kazumichi KATO ,  Hideyuki TOKUYAMA

IPC: B01J20/26 ,  B01J20/28 ,  B01J20/30 ,  C09J7/10 ,  H01L21/683

Abstract: Provided is an adsorption temporary fixing sheet having a sufficient shear adhesive strength in a direction parallel to its surface, and having a weak adhesive strength in a direction vertical to the surface. Also provided is a method of producing such adsorption temporary fixing sheet. The adsorption temporary fixing sheet includes a foam layer including an open-cell structure, wherein, when a silicon chip vertical adhesive strength of a surface of the foam layer after 20 hours at each of such different temperatures as −40° C., 23° C., or 125° C. is represented by V1 (N/1 cm□), V2 (N/1 cm□), or V3 (N/1 cm□) and when a silicon chip shearing adhesive strength of the surface of the foam layer after 20 hours at each of the different temperatures (−40° C., 23° C., or 125° C.) is represented by H1 (N/1 cm□), H2 (N/1 cm□), or H3 (N/1 cm□), relationships of V1