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公开(公告)号：US20120162965A1
公开(公告)日：2012-06-28
申请号：US13394205
申请日：2011-07-20
IPC分类号： F21V9/16
CPC分类号： F21K9/235 , F21K9/232 , F21K9/237 , F21K9/238 , F21K9/64 , F21K9/66 , F21V3/00 , F21V3/02 , F21V9/08 , F21V9/30 , F21V19/005 , F21V23/002 , F21V29/70 , F21V31/005 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/32 , H01L33/48 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/62 , H01L33/647 , H01L2224/45144 , H01L2224/45147 , H01L2224/4903 , H01L2224/49107 , H01L2224/73265 , H01L2924/00011 , H01L2924/19107 , H01L2924/00014 , H01L2924/01033 , H01L2924/00
摘要： A light bulb shaped lamp according to the present invention includes a translucent base board, an LED chip mounted on the base board, a base for receiving power from outside, at least two power-supply leads for supplying power to the LED chip, and a globe partially attached to the base for housing the base board, the LED chip, and the power-supply leads. Each of the two power-supply leads extends from a side of the base toward inside of the globe and connected to the base board, and the LED chip is provided between a portion at which one of the two power-supply leads and the base board are connected and a portion at which the other of the two power-supply leads and the base board are connected.
摘要翻译： 根据本发明的灯泡状灯包括半透明基板，安装在基板上的LED芯片，用于从外部接收电力的基座，用于向LED芯片供电的至少两个电源引线，以及 球体部分地连接到用于容纳基板，LED芯片和电源引线的基座。 两个电源引线中的每一个从基座的一侧朝向球体的内部延伸并连接到基板，并且LED芯片设置在两个电源引线和基板之间的部分 并且两个电源引线和基板中的另一个连接的部分被连接。
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公开(公告)号：US09732930B2
公开(公告)日：2017-08-15
申请号：US13394205
申请日：2011-07-20
IPC分类号： F21V9/16 , F21V3/02 , F21K9/232 , F21V29/70 , F21K9/238 , F21K9/235 , F21K9/237 , F21V9/08 , F21V19/00 , F21V23/00 , F21V31/00 , F21V3/00 , H01L33/48 , F21Y105/10 , F21K9/64 , F21Y103/10 , F21Y115/10
CPC分类号： F21K9/235 , F21K9/232 , F21K9/237 , F21K9/238 , F21K9/64 , F21K9/66 , F21V3/00 , F21V3/02 , F21V9/08 , F21V9/30 , F21V19/005 , F21V23/002 , F21V29/70 , F21V31/005 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/32 , H01L33/48 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/62 , H01L33/647 , H01L2224/45144 , H01L2224/45147 , H01L2224/4903 , H01L2224/49107 , H01L2224/73265 , H01L2924/00011 , H01L2924/19107 , H01L2924/00014 , H01L2924/01033 , H01L2924/00
摘要： A light bulb shaped lamp according to the present invention includes a translucent base board, an LED chip mounted on the base board, a base for receiving power from outside, at least two power-supply leads for supplying power to the LED chip, and a globe partially attached to the base for housing the base board, the LED chip, and the power-supply leads. Each of the two power-supply leads extends from a side of the base toward inside of the globe and connected to the base board, and the LED chip is provided between a portion at which one of the two power-supply leads and the base board are connected and a portion at which the other of the two power-supply leads and the base board are connected.
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公开(公告)号：US09016900B2
公开(公告)日：2015-04-28
申请号：US13882204
申请日：2011-11-04
IPC分类号： F21V29/00 , F21V23/00 , F21K99/00 , F21V19/00 , F21Y101/02 , F21V3/04 , F21Y103/00 , F21Y105/00
CPC分类号： F21V23/002 , F21K9/232 , F21V3/061 , F21V19/003 , F21V23/001 , F21V29/85 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4903 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.
摘要翻译： 根据本发明的灯泡形灯包括：中空球体; LED模块，其包括基座平台和安装在所述基台上的LED芯片，所述LED模块设置在所述球体中; 用于向LED模块供电的引线; 以及朝向球体内部延伸的杆，其中基座平台直接固定到杆上。
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公开(公告)号：US08911108B2
公开(公告)日：2014-12-16
申请号：US13818440
申请日：2011-10-14
IPC分类号： F21S4/00 , F21V15/01 , F21K99/00 , F21V25/02 , F21V3/00 , F21Y101/02 , F21Y103/00 , F21Y105/00 , H01L25/075
CPC分类号： F21V15/01 , F21K9/232 , F21V3/00 , F21V25/02 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L2224/45144 , H01L2224/48137 , H01L2224/48463 , H01L2224/49107 , H01L2224/73265 , H01L2924/00
摘要： A light bulb shaped lamp includes: a hollow globe having an opening; an LED module having a base platform and an LED chip mounted on the base platform, the LED module being housed in the globe; a stem extending from the opening of the globe to the vicinity of the LED module; and a regulating component which regulates movement of the LED module with respect to the stem.
摘要翻译： 灯泡状灯包括：具有开口的中空球体; LED模块，其具有基座和安装在基座上的LED芯片，所述LED模块容纳在所述球体中; 从所述球体的开口延伸到所述LED模块附近的杆; 以及调节组件，其调节LED模块相对于杆的移动。
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公开(公告)号：USD646810S1
公开(公告)日：2011-10-11
申请号：US29389739
申请日：2011-04-15
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公开(公告)号：US08587011B2
公开(公告)日：2013-11-19
申请号：US13502662
申请日：2011-09-06
申请人： Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人： Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , F21K9/232 , F21V3/00 , F21Y2105/10 , F21Y2115/10 , H01L33/507 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.
摘要翻译： 提供了全向发光的发光装置。 根据本发明的发光器件包括：半透明的封装; 设置在所述封装中的凹部中的LED; 以及用于密封LED并封装凹部的密封构件; 并且所述凹部包括其上安装有LED的底表面和围绕底表面的侧表面，并且由所述LED发射的光通过所述凹部的底表面和侧表面在所述封装内部传输并且被发射到 包装从包装的后表面和侧表面。
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公开(公告)号：US08421111B2
公开(公告)日：2013-04-16
申请号：US13503242
申请日：2011-08-23
申请人： Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人： Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , F21K9/232 , F21V3/00 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/508 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.
摘要翻译： 一种发光器件，包括：半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽， 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。
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公开(公告)号：US20120256538A1
公开(公告)日：2012-10-11
申请号：US13393397
申请日：2011-09-20
CPC分类号： F21K9/232 , F21V3/00 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2224/4945 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device capable of effectively dissipating heat generated at an LED is provided. The light-emitting device according to the present invention includes: a base board and an LED chip mounted on the base board. The base board is a translucent base board made of a polycrystalline ceramic. A main region of the base board includes an element mounted region on which the LED chip is mounted, and an average grain size of the polycrystalline ceramic in the main region is between 10 μm and 40 μm inclusive. An end portion region of said base board is a region around an end portion, and an average grain size of the polycrystalline ceramic in the end portion region is preferably smaller than an average grain size of the polycrystalline ceramic in the element mounted region.
摘要翻译： 提供能够有效散发在LED产生的热量的发光装置。 根据本发明的发光装置包括：基板和安装在基板上的LED芯片。 基板是由多晶陶瓷制成的半透明基板。 基板的主区域包括安装有LED芯片的元件安装区域，并且主区域中的多晶陶瓷的平均晶粒尺寸在10μm和40μm之间。 所述基板的端部区域是端部周围的区域，并且端部区域中的多晶陶瓷的平均粒径优选小于元件安装区域中的多晶陶瓷的平均粒径。
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公开(公告)号：US20120235181A1
公开(公告)日：2012-09-20
申请号：US13503242
申请日：2011-08-23
申请人： Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人： Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号： H01L33/08
CPC分类号： H01L33/507 , F21K9/232 , F21V3/00 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/508 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要： A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.
摘要翻译： 一种发光器件，包括：半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽， 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。
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公开(公告)号：US20120217862A1
公开(公告)日：2012-08-30
申请号：US13393552
申请日：2011-09-22
IPC分类号： H05B33/08
CPC分类号： F21K9/232 , F21V29/506 , F21V29/507 , F21Y2105/10 , F21Y2107/90 , F21Y2115/10
摘要： A light bulb shaped lamp capable of achieving light-distribution property equivalent to that of a conventional incandescent light bulb and easily fixing the LED module in the lamp is provided. The lamp according to the present invention includes an LED module housed in a hollow globe and a fixing component for fixing the LED module. The LED module includes a translucent board having a first main surface with an LED mounted thereon and a second main surface. The board includes a first light-emitting area and a second light-emitting area, the first light-emitting area in which predetermined light by the LED is emitted from the first main surface toward the globe, and the second light-emitting area in which predetermined light by the LED is emitted from the second main surface toward the globe.
摘要翻译： 提供能够实现与常规白炽灯泡相同的光分布特性并且容易地将LED模块固定在灯中的灯泡形灯。 根据本发明的灯包括容纳在中空球体中的LED模块和用于固定LED模块的固定部件。 LED模块包括具有安装在其上的LED的第一主表面和第二主表面的半透明板。 该板包括第一发光区域和第二发光区域，其中由LED的预定光从第一主表面朝向球体发射的第一发光区域和第二发光区域，其中 LED的预定光从第二主表面朝向球体发射。
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