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6 条记录 (耗时 0.019 秒)

    Control unit for refrigerating machine
    1.
    发明授权
    Control unit for refrigerating machine 失效
    制冷机控制单元

    公开(公告)号：US06311506B1

    公开(公告)日：2001-11-06

    申请号：US09348459

    申请日：1999-07-07

    申请人： Norio Takahashi ,  Tsutomu Hatanaka ,  Toshiyuki Kamei

    发明人： Norio Takahashi ,  Tsutomu Hatanaka ,  Toshiyuki Kamei

    IPC分类号： F25B4106

    CPC分类号： F25B41/04 ,  F25B2700/197 ,  F25B2700/21171

    摘要： A control unit is disclosed for controlling a refrigerating machine in such a way that a refrigerating power exceeding the required performance is secured while the control unit has a function of bypassing hot gas by means of a hot gas bypass line. A temperature-responsive valve is mounted in the hot gas bypass line in addition to a pressure regulating valve. If a preset temperature Tr of a brine becomes equal to or higher than a given temperature (0° C.), the temperature-responsive valve opens the bypass line. If the preset temperature Tr becomes lower than the given temperature, the temperature-responsive valve closes the bypass line.

    摘要翻译： 公开了一种用于控制冷冻机的控制单元，使得在控制单元具有通过热气旁通管旁路热气的功能的同时确保超过所需性能的制冷功率。 温度响应阀除了压力调节阀之外还安装在热气旁通管路中。 如果盐水的预设温度Tr等于或高于给定温度（0°C），则温度响应阀打开旁路管路。 如果预设温度Tr低于给定温度，则温度响应阀关闭旁路管路。

    Temperature control device and temperature control method
    2.
    发明授权
    Temperature control device and temperature control method 失效
    温度控制装置和温度控制方法

    公开(公告)号：US6148909A

    公开(公告)日：2000-11-21

    申请号：US236371

    申请日：1999-01-25

    申请人： Masashi Osanai ,  Shunsuke Miyamoto ,  Tomohisa Sato ,  Hiroaki Takechi ,  Tsutomu Hatanaka ,  Norio Takahashi ,  Toshiyuki Kamei ,  Takumi Sugihara ,  Isao Shibata ,  Hironori Akiba

    发明人： Masashi Osanai ,  Shunsuke Miyamoto ,  Tomohisa Sato ,  Hiroaki Takechi ,  Tsutomu Hatanaka ,  Norio Takahashi ,  Toshiyuki Kamei ,  Takumi Sugihara ,  Isao Shibata ,  Hironori Akiba

    IPC分类号： F04B49/06 ,  F04B41/00 ,  F25B1/00 ,  G05D23/00 ,  G05D23/19 ,  F25B29/00

    CPC分类号： G05D23/1919

    摘要： A temperature control system which performs control of an object whose temperature is to be controlled as accurately as possible. The system comprises: a chiller located in a fluid circulating and supplying system, for cooling a thermal fluid returning from a vacuum chamber, a first flow control valve located in the fluid circulating and supplying system in a position between the chiller and the vacuum chamber, a bypass passage for splitting and supplying thermal fluid returning from the vacuum chamber to a position between the first flow control valve and the vacuum chamber, before it reaches the chiller, a second flow control valve located in the bypass passage, and a halogen lamp heater located in the fluid circulating and supplying system in a position between a confluence point of the bypass passage and the vacuum chamber, for adjusting the temperature of the thermal fluid passing therethrough to a set temperature.

    摘要翻译： 一种温度控制系统，其对要温度控制的物体尽可能准确地进行控制。 该系统包括：位于流体循环供应系统中的冷却器，用于冷却从真空室返回的热流体;位于冷却器和真空室之间位置的流体循环供应系统中的第一流量控制阀， 旁通通道，用于将从真空室返回的热流体分流并供应到第一流量控制阀和真空室之间的位置，到达冷却器之前，位于旁路通道中的第二流量控制阀和卤素灯加热器 位于流体循环和供给系统中的位于旁路通道的汇合点和真空室之间的位置，用于将通过其的热流体的温度调节到设定温度。

    Heating Device
    3.
    发明申请
    Heating Device 审中-公开
    加热装置

    公开(公告)号：US20140014644A1

    公开(公告)日：2014-01-16

    申请号：US14008373

    申请日：2012-03-28

    申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    IPC分类号： H01L21/02

    CPC分类号： H01L21/02002 ,  H01L21/67103 ,  H01L21/68728 ,  H01L21/68785 ,  H05B3/143

    摘要： A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward.

    摘要翻译： 加热装置包括位于基板上方的面板形状的基板，晶片被放置在基板上，并且设置有用于加热晶片的薄膜加热器，垂直设置在基板和 面板和支撑面板，以及将面板拉向底板的张紧构件。 柱和张紧构件定位成支撑或拉动对应于晶片的放置区域的面板的至少一部分。 每个张力构件包括具有被面板锁定的上端和穿过基板的下端的轴，以及定位在基板上的螺旋弹簧，并且将轴的下端偏压到下方。

    Heating Device
    4.
    发明申请
    Heating Device 审中-公开
    加热装置

    公开(公告)号：US20140014643A1

    公开(公告)日：2014-01-16

    申请号：US14008287

    申请日：2012-03-28

    申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    IPC分类号： H01L21/67

    CPC分类号： H01L21/67103 ,  H01L21/67098 ,  H01L21/68728 ,  H01L21/68785

    摘要： A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted.

    摘要翻译： 加热装置包括基板和面板，其设置在基板上方并且放置有晶片。 面板包括铝基板，设置在铝基板上并加热晶片的薄膜加热器，以及设置在铝基板上且介于铝基板和晶片之间的间隙球。 铝基板设置有第二安装孔，间隙球被压配入其中。 间隙球仅由第二安装孔的内壁通过压配而保持。