Optical system and method for measurement of one or more parameters of via-holes
    2.
    发明授权
    Optical system and method for measurement of one or more parameters of via-holes 有权
    用于测量通孔的一个或多个参数的光学系统和方法

    公开(公告)号:US09140539B2

    公开(公告)日:2015-09-22

    申请号:US14021010

    申请日:2013-09-09

    Inventor: David Scheiner

    Abstract: Obtaining at least one of a cross-section profile, depth, width, slope, undercut and other parameters of via-holes by a non-destructive technique using an optical system having an illumination system for producing at least one light beam and directing it on a sample in a region of the structure containing at least one via-hole, a detection system configured and operable to collect a pattern of light reflected from the illuminated region, the light pattern being indicative of one or more parameters of said via-hole, and, a control system connected to the detection system, the control system comprising a memory utility for storing a predetermined theoretical model comprising data representative of a set of parameters describing via-holes reflected pattern, and a data processing and analyzing utility configured and operable to receive and analyze image data indicative of the detected light pattern and determine one or more parameters of said via-hole.

    Abstract translation: 通过使用具有用于产生至少一个光束并将其导向的照明系统的光学系统的非破坏性技术来获得通孔的横截面轮廓,深度,宽度,斜率,底切和其他参数中的至少一个 所述结构的区域中的样品包含至少一个通孔,检测系统被配置和可操作以收集从所述被照射区域反射的光的图案,所述光图案指示所述通孔的一个或多个参数, 以及连接到所述检测系统的控制系统,所述控制系统包括用于存储预定理论模型的存储器实用程序,所述预定理论模型包括表示描述通孔反射模式的一组参数的数据,以及配置和可操作的数据处理和分析实用程序 接收和分析指示检测到的光图案的图像数据,并确定所述通孔的一个或多个参数。

Patent Agency Ranking