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公开(公告)号:US09484508B2
公开(公告)日:2016-11-01
申请号:US14430539
申请日:2013-09-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Georg Dirscherl , Walter Wegleiter , Caroline Cassignol , Karl Weidner
CPC classification number: H01L33/56 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.
Abstract translation: 本发明涉及一种具有载体元件(1)的光电子半导体元件,其上布置有具有至少一个有源层的光电子半导体芯片(2),其中该有源层被设计为在操作期间发射或接收光;以及 其中所述半导体芯片(2)被包含聚对二甲苯的保护层(3)覆盖。
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公开(公告)号:US20150270459A1
公开(公告)日:2015-09-24
申请号:US14430539
申请日:2013-09-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor: Georg Dirscherl , Walter Wegleiter , Caroline Cassignol , Karl Weidner
CPC classification number: H01L33/56 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.
Abstract translation: 本发明涉及一种具有载体元件(1)的光电子半导体元件,其上布置有具有至少一个有源层的光电子半导体芯片(2),其中该有源层被设计为在操作期间发射或接收光;以及 其中所述半导体芯片(2)被包含聚对二甲苯的保护层(3)覆盖。
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