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公开(公告)号：US11239386B2
公开(公告)日：2022-02-01
申请号：US16851232
申请日：2020-04-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18 , H01L33/54
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
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2.发明授权公开(公告)号：US09972759B2
公开(公告)日：2018-05-15
申请号：US14766420
申请日：2014-01-23
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Walter Wegleiter , Paola Altieri-Weimar , Juergen Moosburger , Stefan Stegmeier , Karl Weidner
IPC: H01L31/0203 , H01L31/02 , H01L31/024 , H01L33/48 , H01L33/62 , H01L33/64 , H01L23/00
CPC classification number: H01L33/62 , H01L24/18 , H01L24/24 , H01L31/02002 , H01L31/0203 , H01L31/024 , H01L33/483 , H01L33/647 , H01L2224/04105 , H01L2224/24137 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/15153
Abstract: The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.
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公开(公告)号：US20150243857A1
公开(公告)日：2015-08-27
申请号：US14424796
申请日：2013-08-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz , Walter Wegleiter
CPC classification number: H01L33/56 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.
Abstract translation: 光电半导体部件包括嵌入到电绝缘成形体中的光电半导体芯片，其具有上表面和下表面。 在成形体中，也嵌有电通孔，其在成形体的上表面和下表面之间形成导电连接。 在成形体的上表面上，布置反射层，其在电半导体芯片接触件和通孔之间形成导电连接。 反射层覆盖成形体的上表面的至少50％。
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公开(公告)号：US11749776B2
公开(公告)日：2023-09-05
申请号：US17552657
申请日：2021-12-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18 , H01L33/54
CPC classification number: H01L33/0093 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/0203 , H01L31/02005 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/54 , H01L2924/0002 , H01L2933/005 , H01L2933/0033 , H01L2933/0066 , H01L2924/0002 , H01L2924/00
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.
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公开(公告)号：US20220109082A1
公开(公告)日：2022-04-07
申请号：US17552657
申请日：2021-12-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.
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Patent Agency Ranking
公开(公告)号：US09653670B2
公开(公告)日：2017-05-16
申请号：US14378610
申请日：2013-01-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Illek , Walter Wegleiter , Karl Weidner , Stefan Stegmeier
IPC: H01L33/00 , H01L21/00 , H01L33/64 , H01L33/48 , H01L33/62 , H01L27/15 , H01L33/36 , H01L33/52 , H01L25/075 , H01L33/54
CPC classification number: H01L33/64 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/36 , H01L33/486 , H01L33/52 , H01L33/54 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2933/0016 , H01L2933/0025 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.
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7.发明授权公开(公告)号：US09453634B2
公开(公告)日：2016-09-27
申请号：US14484069
申请日：2014-09-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Walter Wegleiter , Andreas Plöβl , Frank Singer
IPC: F21V17/00 , F21V17/10 , F21K99/00 , F21V19/00 , F21V21/096 , F21V29/89 , F21Y101/02
CPC classification number: F21V17/105 , F21K9/90 , F21V19/003 , F21V21/096 , F21V29/89 , F21Y2101/00 , F21Y2115/10 , Y10T29/4913
Abstract: An optoelectronic lighting device includes a lighting module with an optoelectronic semiconductor chip. A connection carrier has a first main surface and a second main surface facing away from the first main surface. The lighting module is arranged on the first main surface of the connection carrier, and the connection carrier adheres to a heat sink on account of a magnetic attraction.
Abstract translation: 光电照明装置包括具有光电半导体芯片的照明模块。 连接托架具有第一主表面和远离第一主表面的第二主表面。 照明模块布置在连接托架的第一主表面上，并且连接托架由于吸引力而附着在散热器上。
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公开(公告)号：US09209368B2
公开(公告)日：2015-12-08
申请号：US14424796
申请日：2013-08-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz , Walter Wegleiter
CPC classification number: H01L33/56 , H01L33/36 , H01L33/38 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semi-conductor component includes an optoelectronic semi-conductor chip embedded into an electrically-insulating shaped body that has an upper face and a lower face. In the shaped body, an electrical via is also embedded which forms an electrically-conductive connection between the upper face and the lower face of the shaped body. On the upper face of the shaped body, a reflective layer is arranged which forms an electrically-conductive connection between an electrical semi-conductor chip contact and the via. The reflective layer covers at least 50% of the upper face of the shaped body.
Abstract translation: 光电半导体部件包括嵌入到电绝缘成形体中的光电半导体芯片，其具有上表面和下表面。 在成形体中，也嵌有电通孔，其在成形体的上表面和下表面之间形成导电连接。 在成形体的上表面上，布置反射层，其在电半导体芯片接触件和通孔之间形成导电连接。 反射层覆盖成形体的上表面的至少50％。
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公开(公告)号：US12002901B2
公开(公告)日：2024-06-04
申请号：US18212935
申请日：2023-06-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L23/31 , H01L25/04 , H01L25/075 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
CPC classification number: H01L33/0093 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/54 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/0002 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.
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公开(公告)号：US20200251612A1
公开(公告)日：2020-08-06
申请号：US16851232
申请日：2020-04-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
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