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公开(公告)号：US10253950B2
公开(公告)日：2019-04-09
申请号：US15035384
申请日：2014-11-14
发明人： Ion Stoll , Frank Singer , Georg Dirscherl
摘要： A method for producing a multifunctional layer, a method for producing an electrophoresis substrate, and a method for producing a converter plate and an optoelectronic component are disclosed. In an embodiment the method includes providing an electrophoresis substrate comprising a carrier having a front side and a back side, wherein a first electrically conductive layer and a second electrically conductive layer are located on the front side, electrophoretically depositing a first material onto the first electrically conductive layer, electrophoretically depositing a second material onto the second electrically conductive layer and arranging a filler material between the first material and the second material, wherein the filler material forms a common boundary surface with the first material and the second material.
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公开(公告)号：US09799795B2
公开(公告)日：2017-10-24
申请号：US14780470
申请日：2014-03-19
CPC分类号： H01L33/0095 , H01L33/504 , H01L33/505 , H01L33/508 , H01L2933/0041
摘要： In various exemplary embodiments, a method is provided for producing an assembly emitting electromagnetic radiation. In this case, a component composite structure is provided which has components emitting electromagnetic radiation, which components are coupled to one another physically in the component composite structure. In each case at least one component-individual property is imparted to the components. Depending on the determined properties of the components, a structure mask for covering the components in the component composite structure is formed, wherein the structure mask has structure mask cutouts corresponding to the components, which structure mask cutouts are formed in component-individual fashion depending on the properties of the corresponding components. The structure mask cutouts provide phosphor regions, which are exposed in the structure mask cutouts, on the components. Phosphor layers are formed on the phosphor regions of the components.
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3.发明授权公开(公告)号：US11075324B2
公开(公告)日：2021-07-27
申请号：US16334411
申请日：2017-09-20
发明人： Georg Dirscherl , Marcus Adam , Guido Kickelbick
IPC分类号： H01L21/00 , H01L33/50 , C09K11/02 , C09K11/70 , C08L83/04 , C09K11/62 , C08G77/00 , B82Y20/00
摘要： A method of producing an outcoupling element for an optoelectronic component includes A) providing quantum dots each having a core made of a semiconductor material, B) applying an inorganic or a phosphonate-containing ligand shell on a respective core of the quantum dots, and C) introducing the quantum dots with the ligand shell into a matrix material, wherein introducibility of the quantum dots with the ligand shell is facilitated compared to the quantum dots produced in step A), and the outcoupling element is transparent for radiation from the red and/or IR region.
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4.发明申请公开(公告)号：US20200058831A1
公开(公告)日：2020-02-20
申请号：US16484541
申请日：2018-01-30
发明人： Georg Dirscherl
摘要： A method for producing an output coupling element and an output coupling element are disclosed. In an embodiment a method includes producing a suspension having quantum dots in a suspension medium, wherein each quantum dot comprises a core having a semiconductor material, directly applying the suspension onto a surface of an optoelectronic component and/or onto a surface of a carrier and removing the suspension medium for producing the output coupling element, wherein the output coupling element is matrix-free and transparent to radiation of a red range and/or a IR range.
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5.发明申请公开(公告)号：US20190221722A1
公开(公告)日：2019-07-18
申请号：US16334411
申请日：2017-09-20
发明人： Georg Dirscherl , Marcus Adam , Guido Kickelbick
CPC分类号： H01L33/502 , B82Y20/00 , C08G77/80 , C08L83/04 , C09K11/02 , C09K11/025 , C09K11/62 , C09K11/70 , H01L2933/0041
摘要： A method of producing an outcoupling element for an optoelectronic component includes A) providing quantum dots each having a core made of a semiconductor material, B) applying an inorganic or a phosphonate-containing ligand shell on a respective core of the quantum dots, and C) introducing the quantum dots with the ligand shell into a matrix material, wherein introducibility of the quantum dots with the ligand shell is facilitated compared to the quantum dots produced in step A), and the outcoupling element is transparent for radiation from the red and/or IR region.
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公开(公告)号：US20140246690A1
公开(公告)日：2014-09-04
申请号：US14181104
申请日：2014-02-14
摘要： An optoelectronic semiconductor component includes one or more light-emitting diode chips. The light-emitting diode chip has a main radiation side. A diaphragm is arranged downstream of the main radiation side along a main radiation direction of the light-emitting diode chip. The diaphragm is mounted on or in a component housing. The main radiation side has a mean edge length of at least 50 μm. The diaphragm can be switched from light-impervious to light-pervious. The diaphragm comprises precisely one opening region for radiation transmission. The semiconductor component can be used as a flashlight for a mobile image recording device.
摘要翻译： 光电子半导体部件包括一个或多个发光二极管芯片。 发光二极管芯片具有主辐射侧。 沿着发光二极管芯片的主辐射方向在主辐射侧的下游配置隔膜。 隔膜安装在组件外壳上或组件外壳中。 主辐射侧具有至少50μm的平均边缘长度。 隔膜可以从不透光到透光的切换。 隔膜包括精确的一个用于辐射传播的开口区域。 半导体元件可以用作移动图像记录装置的手电筒。
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公开(公告)号：US10886426B2
公开(公告)日：2021-01-05
申请号：US16087646
申请日：2017-03-22
摘要： A method for producing an electronic device and an electronic device are disclosed. In an embodiment a method for producing an electronic device includes attaching semiconductor chips on a carrier, applying a fluoropolymer to main surfaces of the semiconductor chips facing away from the carrier and a main surface of the carrier facing the semiconductor chip thereby forming an encapsulation layer including a fluoropolymer, structuring the encapsulation layer thereby forming cavities in the encapsulation layer and applying a metal layer in the cavities.
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公开(公告)号：US10217910B2
公开(公告)日：2019-02-26
申请号：US15944328
申请日：2018-04-03
IPC分类号： H01L33/50 , H01L33/56 , H01L33/54 , H01L33/00 , H01L31/14 , H01L33/44 , H01L25/16 , H01L25/00 , H01L31/173
摘要： A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.
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公开(公告)号：US09515236B2
公开(公告)日：2016-12-06
申请号：US14430191
申请日：2013-09-20
发明人： Georg Dirscherl
CPC分类号： H01L33/56 , H01L23/293 , H01L33/486 , H01L33/501 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： What is specified is an optoelectronic component comprising a layer sequence having an active layer, which emits primary electromagnetic radiation, and at least one transparent coupling-out element arranged in the beam path of the primary electromagnetic radiation. The at least one transparent coupling-out element comprises a hybrid material or is produced from a hybrid material.
摘要翻译： 指定的是光电子部件，其包括具有发射初级电磁辐射的有源层的层序列和布置在主要电磁辐射的光束路径中的至少一个透明耦合输出元件。 所述至少一个透明耦合输出元件包括混合材料或由混合材料制成。
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10.发明申请OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD OF FABRICATING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT 审中-公开光电子半导体元件和制造光电半导体元件的方法公开(公告)号：US20160218261A1
公开(公告)日：2016-07-28
申请号：US15021091
申请日：2014-08-25
发明人： Jürgen Moosburger , Ion Stoll , Thomas Schwarz , Frank Singer , Georg Dirscherl , Lutz Höppel
CPC分类号： H01L33/60 , H01L24/24 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2933/005 , H01L2933/0058 , H01L2933/0091 , H01L2924/00
摘要： An optoelectronic semiconductor component includes an optoelectronic semiconductor chip including a light-transmissive carrier, a semiconductor layer sequence on the light-transmissive carrier and electrical connection points on a bottom portion remote from the light-transmissive carrier of the semiconductor layer sequence, a light-transmissive encapsulating material enclosing the optoelectronic semiconductor chip in places, and particles of a light-scattering and/or light-reflecting material, wherein the bottom of the semiconductor layer sequence is at least in places free of the light-transmissive encapsulating material, and the particles cover the bottom of the semiconductor layer sequence and an outer face of the encapsulating material in places.
摘要翻译： 光电子半导体部件包括：光电子半导体芯片，其包含透光性载体，透光性载体上的半导体层序列和远离半导体层序列的透光性载体的底部的电连接点; 封装光电子半导体芯片的透射性封装材料，以及光散射和/或光反射材料的颗粒，其中半导体层序列的底部至少在没有透光封装材料的位置，并且 颗粒在位置覆盖半导体层序列的底部和封装材料的外表面。
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