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公开(公告)号:US20160254424A1
公开(公告)日:2016-09-01
申请号:US15054585
申请日:2016-02-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Michael Zitzlsperger , Matthias Lermer , Roland Fischl
CPC classification number: H01L33/54 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/24245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2924/1815 , H01L2933/005 , H01L2933/0058 , H01L2924/00014
Abstract: A method of producing an optoelectronic lighting device includes providing a carrier on which is arranged at least one light-emitting diode including a surface that emits light during operation of the light-emitting diode, carrying out an injection molding process to encapsulate the light-emitting diode by molding as far as the light-emitting surface such that a molded housing is formed within which the light-emitting diode is encapsulated by molding, wherein the light-emitting surface remains at least partly free, shaping a reflector that reflects light emitted by the light-emitting surface during the injection molding process such that the reflector is formed integrally with the housing, at least partly masking the light-emitting surface, coating the reflector with a light-reflecting layer after the masking, and demasking the light-emitting surface after the coating.
Abstract translation: 一种光电子照明装置的制造方法,其特征在于,在所述载体上配置有至少一个发光二极管,所述至少一个发光二极管包括在所述发光二极管的操作期间发光的表面,进行注射成型工艺以封装所述发光二极管 二极管,通过模制到发光表面,使得形成模制外壳,其中通过模制封装发光二极管,其中发光表面保持至少部分自由,成形反射由 在注射成型过程中的发光表面使得反射器与壳体一体地形成,至少部分地遮蔽发光表面,在掩模之后用光反射层涂覆反射器,并且去除发光 表面涂层后。