INFRARED SENSOR AND INFRARED SENSOR DEVICE EQUIPPED WITH SAME

    公开(公告)号:US20220196481A1

    公开(公告)日:2022-06-23

    申请号:US17598862

    申请日:2020-02-26

    Abstract: A film structural component is supported by a substrate. The film structural component includes a plurality of thermal infrared detectors arranged in an array. Each of the plurality of thermal infrared detectors includes a thermopile having a plurality of hot junctions and a plurality of cold junctions. An infrared sensor further includes a plurality of heaters and at least one thermometer. The plurality of heaters are provided on the first principal surface of the substrate. The at least one thermometer is provided on the first principal surface of the substrate and is configured to detect a temperature of the substrate. Each of the plurality of heaters faces another heater of the plurality of heaters via a region including the plurality of thermal infrared detectors in plan view in the thickness direction of the substrate.

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