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1.
公开(公告)号:US20190195521A1
公开(公告)日:2019-06-27
申请号:US16287636
申请日:2019-02-27
Inventor: Koichi KUSUKAME , Nawatt SILAWAN , Shinichi SHIKII , Aki YONEDA , Kazuki FUNASE , Takahiro FUKUNISHI , Toshimitsu KODA , Norimasa ISHIKAWA , Hiroshi YAMANAKA , Takanori SUGIYAMA
CPC classification number: F24F11/30 , F24F11/00 , F24F2120/00 , F24F2120/10 , G01J5/00 , G01J5/02 , G01J5/025 , G01J2005/0077
Abstract: A radiation receiving sensor includes an infrared receiver including a plurality of infrared receiving devices that receive infrared radiation, a lens that allows infrared radiation to enter the infrared receiver, a rotator that rotates the infrared receiver and the lens about a part of the lens, and a cover member that faces the infrared receiver through the lens and that has translucency.
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公开(公告)号:US20220252458A1
公开(公告)日:2022-08-11
申请号:US17437640
申请日:2020-02-17
Inventor: Ryota SUDO , Takanori SUGIYAMA , Takaaki HIRAMATSU , Nobuaki SHIMAMOTO , Hiroshi YAMANAKA , Naoki KOBAYASHI
Abstract: A temperature sensing system senses a temperature in the monitor space. The temperature sensing system includes a first detector, a second detector, and a processing unit. The first detector detects a temperature on a ceiling and outputs first information about the temperature on the ceiling. The second detector detects infrared radiation emitted from a floor and outputs second information about the infrared radiation from the floor. The processing unit calculates, based on at least the first information and the second information, a spatial temperature distribution which includes a component in a height direction with respect to the monitor space between the ceiling and the floor.
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公开(公告)号:US20220196481A1
公开(公告)日:2022-06-23
申请号:US17598862
申请日:2020-02-26
Inventor: Shoya KIDA , Nobuaki SHIMAMOTO , Nayuta MINAMI , Isao HATTORI , Naoki KOBAYASHI , Hiroshi YAMANAKA
Abstract: A film structural component is supported by a substrate. The film structural component includes a plurality of thermal infrared detectors arranged in an array. Each of the plurality of thermal infrared detectors includes a thermopile having a plurality of hot junctions and a plurality of cold junctions. An infrared sensor further includes a plurality of heaters and at least one thermometer. The plurality of heaters are provided on the first principal surface of the substrate. The at least one thermometer is provided on the first principal surface of the substrate and is configured to detect a temperature of the substrate. Each of the plurality of heaters faces another heater of the plurality of heaters via a region including the plurality of thermal infrared detectors in plan view in the thickness direction of the substrate.
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4.
公开(公告)号:US20200224904A1
公开(公告)日:2020-07-16
申请号:US16827972
申请日:2020-03-24
Inventor: Koichi KUSUKAME , Nawatt SILAWAN , Shinichi SHIKII , Aki YONEDA , Kazuki FUNASE , Takahiro FUKUNISHI , Toshimitsu KODA , Norimasa ISHIKAWA , Hiroshi YAMANAKA , Takanori SUGIYAMA
Abstract: A radiation receiving sensor includes an infrared receiver including a plurality of infrared receiving devices that receive infrared radiation, a lens that allows infrared radiation to enter the infrared receiver, a rotator that rotates the infrared receiver and the lens about a part of the lens, and a cover member that faces the infrared receiver through the lens and that has translucency.
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