公开(公告)号：US20180267079A1

公开(公告)日：2018-09-20

申请号：US15760615

申请日：2016-11-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKAHIRO SHINOHARA ,  HITOSHI YOSHIDA ,  KAZUO GODA ,  RIE OKAMOTO ,  HIROSHI NAKATSUKA ,  MASAKO YAMAGUCHI ,  HIDEKI UEDA ,  TAKANORI AOYAGI ,  YUKI MAEGAWA ,  TAKUYA KAJIWARA ,  KEISUKE KURODA ,  TAKESHI MORI

IPC: G01P15/125 ,  G01P15/08 ,  G01P15/18 ,  H01L29/84

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0862 ,  H01L29/84

Abstract: A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

公开(公告)号：US20170336436A1

公开(公告)日：2017-11-23

申请号：US15526333

申请日：2016-01-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YUKI MAEGAWA ,  HIDEKI UEDA ,  HIDEAKI FUJIURA ,  TAKESHI UEMURA ,  HIROSHI NAKATSUKA ,  TSUYOSHI SAKAUE ,  RIE OKAMOTO ,  SHOYA KIDA

IPC: G01P15/125 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

Abstract: A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.