公开(公告)号：US20180267079A1

公开(公告)日：2018-09-20

申请号：US15760615

申请日：2016-11-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKAHIRO SHINOHARA ,  HITOSHI YOSHIDA ,  KAZUO GODA ,  RIE OKAMOTO ,  HIROSHI NAKATSUKA ,  MASAKO YAMAGUCHI ,  HIDEKI UEDA ,  TAKANORI AOYAGI ,  YUKI MAEGAWA ,  TAKUYA KAJIWARA ,  KEISUKE KURODA ,  TAKESHI MORI

IPC: G01P15/125 ,  G01P15/08 ,  G01P15/18 ,  H01L29/84

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0862 ,  H01L29/84

Abstract: A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

公开(公告)号：US20180168034A1

公开(公告)日：2018-06-14

申请号：US15577011

申请日：2016-06-22

Applicant: Panasonic Intellectual Property Management Co. Ltd.

Inventor： RYOSUKE MESHII ,  KAZUO GODA ,  TAKAHIRO SHINOHARA ,  TAKANORI AOYAGI ,  KENSAKU YAMAMOTO ,  HITOSHI YOSHIDA

IPC: H05K1/02 ,  H05K1/03 ,  G01P15/125

CPC classification number: H05K1/0298 ,  B81B7/007 ,  B81B7/0074 ,  B81B2207/092 ,  B81B2207/096 ,  G01P1/00 ,  G01P15/08 ,  G01P15/125 ,  H05K1/0306

Abstract: A wiring-buried glass substrate includes a glass substrate and a first wiring. The glass substrate includes a first surface, a second surface perpendicular to the first surface, and a third surface facing the first surface. The first wiring includes a first pillar portion and a first beam portion. The first pillar portion extends in a first direction perpendicular to the first surface of the glass substrate. The first beam portion is connected to a first surface of the first pillar portion and extends to a second direction perpendicular to a second surface of the glass substrate. The first wiring is buried in the glass substrate. The first surface of the first beam portion is exposed from a third surface of the glass substrate.