公开(公告)号：US20170336438A1

公开(公告)日：2017-11-23

申请号：US15159798

申请日：2016-05-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： KEISUKE KURODA ,  TAKESHI MORI

IPC: G01P21/00 ,  H03M1/12 ,  H03L7/06

Abstract: A sensor is provided including: an element outputting detection signals according to magnitude of physical quantity; a drive circuit outputting a driving signal to the element and receiving a monitor signal from the element; a detection circuit that includes amplifiers amplifying the detection signals and a first synchronous demodulation circuit performing synchronous demodulation on a signal from the amplifier, receives the detection signals, and outputs a physical quantity signal according to the physical quantity; a processing circuit processing a signal from the first synchronous demodulation circuit; a first diagnostic circuit that receives a signal into the processing circuit and a signal from the processing circuit, and outputs a first error signal when abnormalities occur in the processing circuit; and a second diagnostic circuit that outputs a diagnostic signal to the first diagnostic circuit, instead of the signal into the processing circuit or instead of the signal from the processing circuit.

公开(公告)号：US20180267079A1

公开(公告)日：2018-09-20

申请号：US15760615

申请日：2016-11-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKAHIRO SHINOHARA ,  HITOSHI YOSHIDA ,  KAZUO GODA ,  RIE OKAMOTO ,  HIROSHI NAKATSUKA ,  MASAKO YAMAGUCHI ,  HIDEKI UEDA ,  TAKANORI AOYAGI ,  YUKI MAEGAWA ,  TAKUYA KAJIWARA ,  KEISUKE KURODA ,  TAKESHI MORI

IPC: G01P15/125 ,  G01P15/08 ,  G01P15/18 ,  H01L29/84

CPC classification number: G01P15/125 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0862 ,  H01L29/84

Abstract: A connection assembly includes a sensor substrate, a layer substrate coupled to the sensor substrate so as to face an upper surface of the sensor substrate, and a wire connected between the sensor substrate and the layer substrate. The sensor substrate includes first and second projections provide on the upper surface of the sensor substrate and extending in an extension direction along the upper surface of the sensor substrate. The wire has a first end sandwiched between the layer substrate and the first projection, and a second end sandwiched between the layer substrate and the second projection. The connection assembly provides reliable connection.

公开(公告)号：US20160341760A1

公开(公告)日：2016-11-24

申请号：US15114777

申请日：2014-12-25

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD

Inventor： KEISUKE KURODA ,  TAKESHI MORI

IPC: G01P15/125 ,  G01P21/00

CPC classification number: G01P15/125 ,  G01P21/00

Abstract: A capacitive physical quality detection device includes a sensor part, a control circuit, and a CV conversion circuit. The sensor part includes a movable electrode, a first fixed electrode, and a second fixed electrode. The CV conversion circuit is configured to receive a reference voltage and to output a voltage corresponding to a capacitance change. In a first time period, the control circuit applies a first signal to the first fixed electrode, and applies a second signal, which is opposite in phase to the first signal, to the second fixed electrode. In a second time period, the control circuit applies the reference voltage to the first fixed electrode and applies the second signal to the second fixed electrode.

Abstract translation: 电容式物理质量检测装置包括传感器部分，控制电路和CV转换电路。 传感器部分包括可动电极，第一固定电极和第二固定电极。 CV转换电路被配置为接收参考电压并输出对应于电容变化的电压。 在第一时间段中，控制电路向第一固定电极施加第一信号，并向第二固定电极施加与第一信号相反的第二信号。 在第二时间段中，控制电路将参考电压施加到第一固定电极，并将第二信号施加到第二固定电极。

公开(公告)号：US20160091526A1

公开(公告)日：2016-03-31

申请号：US14892566

申请日：2014-06-10

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： KAZUO GODA ,  NOBUYUKI IBARA ,  HITOSHI YOSHIDA ,  TAKUMI TAURA ,  SHINICHI KISHIMOTO ,  HIDEKI UEDA ,  TAKESHI MORI

IPC: G01P15/125 ,  G01P15/18

CPC classification number: G01P15/125 ,  B81B3/0081 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01P3/44 ,  G01P15/18

Abstract: A configuration including a first substrate including a first movable electrode; a second substrate connected to the first substrate and including a first fixed electrode that faces the first movable electrode; and a third substrate connected to the second substrate. The first substrate, the second substrate, and the third substrate are laminated in this order, and the second substrate and the third substrate are not bonded to each other in at least a part between the first fixed electrode and the third substrate.

Abstract translation: 一种构造，包括：第一基板，包括第一可动电极; 连接到所述第一基板并包括面向所述第一可动电极的第一固定电极的第二基板; 以及连接到第二基板的第三基板。 第一基板，第二基板和第三基板按顺序层叠，并且第二基板和第三基板在第一固定电极和第三基板之间的至少一部分上彼此不接合。

公开(公告)号：US20150368089A1

公开(公告)日：2015-12-24

申请号：US14764572

申请日：2014-02-03

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： KAZUO GODA ,  TAKUMI TAURA ,  SHINICHI KISHIMOTO ,  HIDEKI UEDA ,  TAKESHI MORI

IPC: B81B3/00 ,  G01P15/125

CPC classification number: B81B3/0008 ,  B81B2201/0235 ,  G01P15/125 ,  G01P2015/0834 ,  H01L29/84

Abstract: A MEMS device includes a movable section, a frame, a beam, and an electrode substrate. The frame surrounds a surrounding of the movable section. The beam extends from at least a part of the frame, and is connected to the movable section. The electrode substrate includes a fixed electrode, an extended electrode, and a substrate section. The fixed electrode is formed on the electrode substrate in at least a part of a region facing a swing section. The extended electrode is connected to the fixed electrode, and is formed on the electrode substrate in at least a part of a region facing the shaft.

Abstract translation: MEMS器件包括可移动部分，框架，光束和电极基板。 框架围绕可动部分的周围。 梁从框架的至少一部分延伸，并连接到可移动部分。 电极基板包括固定电极，延伸电极和基板部分。 在面向摆动部的区域的至少一部分中，在电极基板上形成固定电极。 延伸电极连接到固定电极，并且在面向轴的区域的至少一部分中形成在电极基板上。

公开(公告)号：US20160202287A1

公开(公告)日：2016-07-14

申请号：US15073645

申请日：2016-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKESHI MORI ,  KEISUKE KURODA ,  HITOSHI YOSHIDA ,  KAZUO GODA ,  TAKUMI TAURA ,  HIDEKI UEDA

IPC: G01P21/00 ,  G01P15/125 ,  G01P15/08

CPC classification number: G01P21/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0831

Abstract: An acceleration sensor includes a CV conversion circuit, an AD conversion circuit, and first and second registers. The CV conversion circuit outputs a voltage corresponding to the capacitance changes between a movable electrode and each of first and second fixed electrodes disposed to face the movable electrode. The AD conversion circuit is connected to the CV conversion circuit and has a first detection range and a second detection range. The first register is connected to the AD conversion circuit and holds a first value. The second register is connected to the AD conversion circuit and holds a second value. The first value contains information about an acceleration in the first detection range, and the second value contains information about an acceleration in the second detection range. The first and second values indicate accelerations in the same direction.

Abstract translation: 加速度传感器包括CV转换电路，AD转换电路以及第一和第二寄存器。 CV转换电路输出与可动电极和设置在可动电极之间的第一和第二固定电极中的每一个之间的电容变化相对应的电压。 AD转换电路连接到CV转换电路，具有第一检测范围和第二检测范围。 第一个寄存器连接到AD转换电路并保持第一个值。 第二寄存器连接到AD转换电路并保持第二值。 第一值包含关于第一检测范围中的加速度的信息，第二值包含关于第二检测范围中的加速度的信息。 第一个和第二个值表示相同方向的加速度。