公开(公告)号：US20100122583A1

公开(公告)日：2010-05-20

申请号：US12273960

申请日：2008-11-19

申请人： Paul Rozgo ,  Alistair Bradley ,  Ryan S. Jones ,  Lamar F. Ricks

发明人： Paul Rozgo ,  Alistair Bradley ,  Ryan S. Jones ,  Lamar F. Ricks

IPC分类号： G01F1/38

CPC分类号： G01L13/025 ,  G01L9/0054 ,  G01L19/0069 ,  G01L19/145 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/00014

摘要： Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability.

摘要翻译： 基于微电子封装工艺的湿/湿差压传感器的方法和系统。 具有孔的顶盖可以通过压力感测隔膜连接到MEMS配置的压力感测模具的顶部，以便允许感测的介质与压力感测隔膜的顶侧接触。 具有用于应力消除的孔的可选约束可以附接到压力感测模的背面。 可以使用粘合剂和/或弹性体密封件和/或焊料来密封压力感测模具，允许感测到的介质与压力感测膜片的两侧接触，而不与引线接合和其它金属化表面接触。 MEMS配置的压力感应模具也可以用标准的芯片附着材料粘合到基板上。 这种微电子封装方法产生高性能和成本有效的解决方案，从而提供湿湿压力感测能力。

公开(公告)号：US08230745B2

公开(公告)日：2012-07-31

申请号：US12273960

申请日：2008-11-19

申请人： Paul Rozgo ,  Alistair Bradley ,  Ryan S. Jones ,  Lamar F. Ricks

发明人： Paul Rozgo ,  Alistair Bradley ,  Ryan S. Jones ,  Lamar F. Ricks

IPC分类号： G01L13/02 ,  G01L15/00

CPC分类号： G01L13/025 ,  G01L9/0054 ,  G01L19/0069 ,  G01L19/145 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/00014

摘要： Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability.

摘要翻译： 基于微电子封装工艺的湿/湿差压传感器的方法和系统。 具有孔的顶盖可以通过压力感测隔膜连接到MEMS配置的压力感测模具的顶部，以便允许感测的介质与压力感测隔膜的顶侧接触。 具有用于应力消除的孔的可选约束可以附接到压力感测模的背面。 可以使用粘合剂和/或弹性体密封件和/或焊料来密封压力感测模具，允许感测到的介质与压力感测膜片的两侧接触，而不与引线接合和其它金属化表面接触。 MEMS配置的压力感应模具也可以用标准的芯片附着材料粘合到基板上。 这种微电子封装方法产生高性能和成本有效的解决方案，从而提供湿湿压力感测能力。

公开(公告)号：US08371176B2

公开(公告)日：2013-02-12

申请号：US12986087

申请日：2011-01-06

申请人： Paul Rozgo

发明人： Paul Rozgo

IPC分类号： G01L7/08

CPC分类号： G01L19/0645 ,  G01L19/0007 ,  G01L19/0046 ,  G01L19/141 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A media isolated pressure sensor is disclosed that helps improve performance and reduce cost. In one illustrative embodiment, a pressure sensor may include a carrier having one or more holes defined therein. The carrier may be coupled to a diaphragm on one side, and a pressure sensing die on the other, with the pressure sensing die in fluid communication with the hole in the carrier. The carrier, diaphragm and pressure sense die may form a transfer fluid cavity, which is filled with a pressure transfer fluid. An input pressure from a media to be sensed may be provided to the diaphragm, which transmits the pressure to the pressure sensing die via the pressure transfer fluid. The pressure sensing die remains isolated from the media to be sensed.

摘要翻译： 公开了一种有助于提高性能并降低成本的介质隔离压力传感器。 在一个说明性实施例中，压力传感器可以包括其中限定有一个或多个孔的载体。 载体可以在一侧耦合到隔膜，另一侧耦合到压力感测模具，压力感测模具与载体中的孔流体连通。 载体，隔膜和压力感应管芯可以形成传输流体腔，其填充有压力传递流体。 来自待检测介质的输入压力可以被提供给隔膜，隔膜通过压力传递流体将压力传递到压力感测管芯。 压力传感管芯与待检测的介质保持隔离。

公开(公告)号：US20120286872A1

公开(公告)日：2012-11-15

申请号：US13103913

申请日：2011-05-09

申请人： Paul Rozgo ,  Ryan Jones ,  Lamar Floyd Ricks

发明人： Paul Rozgo ,  Ryan Jones ,  Lamar Floyd Ricks

IPC分类号： H03G3/20

CPC分类号： G01D18/004 ,  H03M1/1295 ,  H03M1/183

摘要： Methods and devices for increasing a sensor resolution are disclosed. In one example, a two measurement process is used. A first measurement is used to effectively measure across a full range (e.g. 0 to 5 VDC) of the sensor. This first measurement may identify the current operating point of the sensor (e.g. 3.5 VDC). A second measurement may then be made to effectively measure across a sub-range of the sensor that encompasses the current operating point of the sensor (e.g. across a sub-range of 3.0 to 4.0 VDC for a current operating point of 3.5 VDC). The gain of the amplifier may be raised during the second measurement to produce a higher resolution measurement. In some cases, the first measurement may be used to determine an appropriate offset that may be applied so as to scale the amplifier to the desired sub-range of sensor that includes the current operating point of the sensor. In some cases, the two measurements may be used together to compute an effectively higher resolution measurement signal. In some cases, this may allow for a smaller and/or cheaper sensor to be used, while still achieving good results.

摘要翻译： 公开了用于增加传感器分辨率的方法和装置。 在一个示例中，使用两个测量过程。 第一测量用于有效地测量传感器的全范围（例如0至5VDC）。 该第一测量可以识别传感器的当前工作点（例如3.5VDC）。 然后可以进行第二测量以有效地测量包含传感器的当前工作点的传感器的子范围（例如，对于3.5VDC的当前操作点，在3.0至4.0VDC的子范围内）。 放大器的增益可能在第二次测量期间提高，以产生更高分辨率的测量。 在一些情况下，可以使用第一测量来确定可以应用的适当的偏移，以便将放大器缩放到包括传感器的当前工作点的传感器的期望子范围。 在一些情况下，可以一起使用两个测量来计算有效地更高分辨率的测量信号。 在某些情况下，这可能允许使用更小和/或更便宜的传感器，同时仍然获得良好的结果。

公开(公告)号：US08446220B2

公开(公告)日：2013-05-21

申请号：US13103913

申请日：2011-05-09

申请人： Paul Rozgo ,  Ryan Jones ,  Lamar Floyd Ricks

发明人： Paul Rozgo ,  Ryan Jones ,  Lamar Floyd Ricks

IPC分类号： H03F1/00

CPC分类号： G01D18/004 ,  H03M1/1295 ,  H03M1/183

摘要： Methods and devices for increasing a sensor resolution are disclosed. In one example, a two measurement process is used. A first measurement is used to effectively measure across a full range (e.g. 0 to 5 VDC) of the sensor. This first measurement may identify the current operating point of the sensor (e.g. 3.5 VDC). A second measurement may then be made to effectively measure across a sub-range of the sensor that encompasses the current operating point of the sensor (e.g. across a sub-range of 3.0 to 4.0 VDC for a current operating point of 3.5 VDC). The gain of the amplifier may be raised during the second measurement to produce a higher resolution measurement. In some cases, the first measurement may be used to determine an appropriate offset that may be applied so as to scale the amplifier to the desired sub-range of sensor that includes the current operating point of the sensor. In some cases, the two measurements may be used together to compute an effectively higher resolution measurement signal. In some cases, this may allow for a smaller and/or cheaper sensor to be used, while still achieving good results.

摘要翻译： 公开了用于增加传感器分辨率的方法和装置。 在一个示例中，使用两个测量过程。 第一测量用于有效地测量传感器的全范围（例如0至5VDC）。 该第一测量可以识别传感器的当前工作点（例如3.5VDC）。 然后可以进行第二测量以有效地测量包含传感器的当前工作点的传感器的子范围（例如，对于3.5VDC的当前操作点，在3.0至4.0VDC的子范围内）。 放大器的增益可能在第二次测量期间提高，以产生更高分辨率的测量。 在一些情况下，可以使用第一测量来确定可以应用的适当的偏移，以便将放大器缩放到包括传感器的当前工作点的传感器的期望子范围。 在一些情况下，可以一起使用两个测量来计算有效地更高分辨率的测量信号。 在某些情况下，这可能允许使用更小和/或更便宜的传感器，同时仍然获得良好的结果。

公开(公告)号：US07930944B2

公开(公告)日：2011-04-26

申请号：US12120378

申请日：2008-05-14

申请人： Jim Machir ,  Todd Eckhardt ,  Paul Rozgo ,  William S. Hoover

发明人： Jim Machir ,  Todd Eckhardt ,  Paul Rozgo ,  William S. Hoover

IPC分类号： G01L7/00

CPC分类号： G01L19/148 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An ASIC compensated pressure sensor includes a sense die, an ASIC chip, and supporting elements. The sense die includes a metallized surface for attaching the sense die to a mounting surface. The resulting solder joint provides a hermetic seal that is resistant to a wide range of media associated with different environmental conditions. The mounting surface can contain the ASIC and electronics for compensation or can be attached to another mounting surface, which contains the ASIC and electronics. Either configuration can include collars of different styles for ease of assembly and in turn can be attached to a mating connector. The mounting surface can possess a closely matched coefficient of thermal expansion to the sense die in order to enhance electrical stability of the output signal over a wide temperature and pressure ranges.

摘要翻译： ASIC补偿压力传感器包括感测管芯，ASIC芯片和支撑元件。 感测管芯包括用于将感测管芯附接到安装表面的金属化表面。 所得到的焊接接头提供气密密封，其耐受与不同环境条件相关的广泛的介质。 安装表面可以包含用于补偿的ASIC和电子器件，或者可以连接到包含ASIC和电子器件的另一个安装表面。 任何配置可以包括不同样式的套环，以便于组装，并且可以连接到配合连接器。 安装表面可以具有与感应管芯的紧密匹配的热膨胀系数，以便在宽的温度和压力范围内增强输出信号的电稳定性。

公开(公告)号：US20130214369A1

公开(公告)日：2013-08-22

申请号：US13401727

申请日：2012-02-21

申请人： Ryan Jones ,  Paul Rozgo ,  Richard Charles Sorenson

发明人： Ryan Jones ,  Paul Rozgo ,  Richard Charles Sorenson

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： G01L19/147 ,  G01L19/0038 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

摘要： The present disclosure relates to pressure sensor assemblies and methods. The pressure sensor assembly may include a first substrate, a second substrate and a sense die. The first substrate may be connected to the second substrate, such that an aperture in the first substrate is in fluid communication with an aperture in the second substrate. The second substrate may be connected to the sense die, such that the aperture in the second substrate is in fluid communication with a sense diaphragm on the second substrate. The pressure sensor assembly may include a media path that extends through the aperture in the first substrate, through the aperture in the second substrate, and to the sense die. In some cases, the first substrate, the second substrate and the sense die may be connected in a manner that does not include an adhesive.

摘要翻译： 本公开涉及压力传感器组件和方法。 压力传感器组件可以包括第一基板，第二基板和感测管芯。 第一衬底可以连接到第二衬底，使得第一衬底中的孔与第二衬底中的孔流体连通。 第二衬底可以连接到感测管芯，使得第二衬底中的孔与第二衬底上的感测膜流体连通。 压力传感器组件可以包括延伸穿过第一衬底中的孔，穿过第二衬底中的孔并且到达感应管芯的介质路径。 在一些情况下，可以以不包括粘合剂的方式连接第一基板，第二基板和感测裸片。

公开(公告)号：US20090282925A1

公开(公告)日：2009-11-19

申请号：US12120378

申请日：2008-05-14

申请人： Jim Machir ,  Todd Eckhardt ,  Paul Rozgo ,  William S. Hoover

发明人： Jim Machir ,  Todd Eckhardt ,  Paul Rozgo ,  William S. Hoover

IPC分类号： G01L19/14

CPC分类号： G01L19/148 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An ASIC compensated pressure sensor includes a sense die, an ASIC chip, and supporting elements. The sense die includes a metallized surface for attaching the sense die to a mounting surface. The resulting solder joint provides a hermetic seal that is resistant to a wide range of media associated with different environmental conditions. The mounting surface can contain the ASIC and electronics for compensation or can be attached to another mounting surface, which contains the ASIC and electronics. Either configuration can include collars of different styles for ease of assembly and in turn can be attached to a mating connector. The mounting surface can possess a closely matched coefficient of thermal expansion to the sense die in order to enhance electrical stability of the output signal over a wide temperature and pressure ranges.

摘要翻译： ASIC补偿压力传感器包括感测管芯，ASIC芯片和支撑元件。 感测管芯包括用于将感测管芯附接到安装表面的金属化表面。 所得到的焊接接头提供气密密封，其耐受与不同环境条件相关的广泛的介质。 安装表面可以包含用于补偿的ASIC和电子器件，或者可以连接到包含ASIC和电子器件的另一个安装表面。 任何配置可以包括不同样式的套环，以便于组装，并且可以连接到配合连接器。 安装表面可以具有与感应管芯的紧密匹配的热膨胀系数，以便在宽的温度和压力范围内增强输出信号的电稳定性。

公开(公告)号：US06220101B1

公开(公告)日：2001-04-24

申请号：US09241959

申请日：1999-02-02

申请人： James Schloss ,  James Seefeldt ,  Carol Spicuzza ,  Gary Ryall ,  Wendell McCulley ,  Paul Rozgo ,  Jesse Marcelle

发明人： James Schloss ,  James Seefeldt ,  Carol Spicuzza ,  Gary Ryall ,  Wendell McCulley ,  Paul Rozgo ,  Jesse Marcelle

IPC分类号： G01L700

CPC分类号： G01L15/00

摘要： The apparatus includes a housing; a plurality of sensors mounted on the housing, each of the sensors including a sensing element and an electrical output connected to said sensing element. The apparatus also includes a plurality of inputs connected to the sensors, respectively, to transmit to the sensors. A circuit is mounted in the housing and in electrical connection with the electrical outputs to provide a common signal conditioner for the sensors.

摘要翻译： 该装置包括壳体; 安装在壳体上的多个传感器，每个传感器包括感测元件和连接到所述感测元件的电输出。 该装置还包括分别连接到传感器以传输到传感器的多个输入。 电路安装在壳体中并与电输出端电连接，为传感器提供公共信号调节器。

公开(公告)号：US20130098160A1

公开(公告)日：2013-04-25

申请号：US13281183

申请日：2011-10-25

申请人： Paul Rozgo ,  Ryan Jones

发明人： Paul Rozgo ,  Ryan Jones

IPC分类号： G01L9/00 ,  B23P11/00

CPC分类号： G01L19/0672 ,  G01L9/0041 ,  G01L19/147 ,  H01L2224/48091 ,  Y10T29/49826 ,  H01L2924/00014

摘要： The present disclosure relates to sensors that are exposed to media during use. In some cases, a sensor assembly includes a sensor element positioned on a substrate, where the sensor element may be mechanically and electrically connected to the substrate and may be in fluid communication with a media inlet port. The sensor assembly may include a cover sealed to the substrate of the sensor assembly to enclose the sensor element in a sealed chamber. In some instances, the sensor assembly may include a bonding layer on the substrate of the sensor assembly, and the cover may be sealed to the bonding layer to form the sealed chamber. In some instances, the sealed chamber may help provide a fail-safe media seal for the sensor assembly in the event the sensor element forms a leak during use.

摘要翻译： 本公开涉及在使用期间暴露于介质的传感器。 在一些情况下，传感器组件包括定位在基底上的传感器元件，其中传感器元件可以机械地和电连接到基底并且可以与介质入口端口流体连通。 传感器组件可以包括密封到传感器组件的基底的盖，以将传感器元件封闭在密封室中。 在一些情况下，传感器组件可以包括传感器组件的衬底上的结合层，并且盖子可以密封到粘合层以形成密封室。 在一些情况下，在传感器元件在使用期间形成泄漏的情况下，密封腔室可以帮助为传感器组件提供故障安全的介质密封件。