公开(公告)号：US09542333B2

公开(公告)日：2017-01-10

申请号：US14560450

申请日：2014-12-04

Applicant: QUALCOMM INCORPORATED

Inventor： Stephen Arthur Molloy ,  Dexter Tamio Chun

IPC: G06F12/02 ,  G06F12/10 ,  G11C7/10

CPC classification number: G06F12/1009 ,  G06F12/1072 ,  G06F15/163 ,  G06F2212/1024 ,  G06F2212/2542 ,  G06F2212/657 ,  G11C7/1072

Abstract: Systems, methods, and computer programs are disclosed for allocating memory in a portable computing device having a non-uniform memory architecture. One embodiment of a method comprises: receiving from a process executing on a first system on chip (SoC) a request for a virtual memory page, the first SoC electrically coupled to a second SoC via an interchip interface, the first SoC electrically coupled to a first local volatile memory device via a first high-performance bus and the second SoC electrically coupled to a second local volatile memory device via a second high-performance bus; determining whether a number of available physical pages on the first and second local volatile memory devices exceeds a minimum threshold for initiating replication of memory data between the first and second local volatile memory devices; and if the minimum threshold is exceeded, allocating a first physical address on the first local volatile memory device and a second physical address on the second local volatile memory device to a single virtual page address.

Abstract translation: 公开了用于在具有非均匀存储器架构的便携式计算设备中分配存储器的系统，方法和计算机程序。 一种方法的一个实施例包括：从在第一片上系统（SoC）上执行对虚拟存储器页的请求的处理，所述第一SoC经由芯片间接口电耦合到第二SoC，所述第一SoC电耦合到 第一本地易失性存储器设备经由第一高性能总线，并且所述第二SoC经由第二高性能总线电耦合到第二本地易失性存储器设备; 确定所述第一和第二本地易失性存储器设备上的多个可用物理页是否超过用于在所述第一和第二本地易失性存储器设备之间启动存储器数据的复制的最小阈值; 并且如果超过所述最小阈值，则将所述第一本地易失性存储器设备上的第一物理地址和所述第二本地易失性存储器设备上的第二物理地址分配到单个虚拟页地址。

公开(公告)号：US10353445B2

公开(公告)日：2019-07-16

申请号：US15481665

申请日：2017-04-07

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Jorge Luis Rosales ,  Stephen Arthur Molloy ,  Jon James Anderson

IPC: G06F1/20 ,  H01L23/427 ,  H01L23/473 ,  F28D15/02

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

公开(公告)号：US20170293329A1

公开(公告)日：2017-10-12

申请号：US15481665

申请日：2017-04-07

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Jorge Luis Rosales ,  Stephen Arthur Molloy ,  Jon James Anderson

IPC: G06F1/20 ,  H01L23/427 ,  H01L23/473

CPC classification number: G06F1/20 ,  F28D15/0233 ,  F28D15/0266 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  H01L23/427 ,  H01L23/473

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

公开(公告)号：US09575881B2

公开(公告)日：2017-02-21

申请号：US14560290

申请日：2014-12-04

Applicant: QUALCOMM INCORPORATED

Inventor： Stephen Arthur Molloy ,  Dexter Tamio Chun

IPC: G06F12/02 ,  G11C7/10 ,  G06F12/10

CPC classification number: G06F12/023 ,  G06F12/0223 ,  G06F12/1072 ,  G06F15/163 ,  G06F2212/1024 ,  G06F2212/1044 ,  G06F2212/2542 ,  G11C7/1072 ,  G11C7/1075

Abstract: Systems, methods, and computer programs are disclosed for allocating memory in a portable computing device having a non-uniform memory architecture. One embodiment of a method comprises: receiving from a process executing on a first system on chip (SoC) a request for a virtual memory page, the first SoC electrically coupled to a second SoC via an interchip interface, the first SoC electrically coupled to a first local volatile memory device via a first high-performance bus and the second SoC electrically coupled to a second local volatile memory device via a second high-performance bus; determining a free physical page pair comprising a same physical address available on the first and second local volatile memory devices; and mapping the free physical page pair to a single virtual page address.

Abstract translation: 公开了用于在具有非均匀存储器架构的便携式计算设备中分配存储器的系统，方法和计算机程序。 一种方法的一个实施例包括：从在第一片上系统（SoC）上执行对虚拟存储器页的请求的处理，所述第一SoC经由芯片间接口电耦合到第二SoC，所述第一SoC电耦合到 第一本地易失性存储器设备经由第一高性能总线，并且所述第二SoC经由第二高性能总线电耦合到第二本地易失性存储器设备; 确定包括在所述第一和第二本地易失性存储器设备上可用的相同物理地址的空闲物理页对; 并将自由物理页对映射到单个虚拟页地址。

公开(公告)号：US20170295671A1

公开(公告)日：2017-10-12

申请号：US15230114

申请日：2016-08-05

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Jorge Rosales ,  Stephen Arthur Molloy ,  Jon Anderson

IPC: H05K7/20 ,  G06F1/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, wherein the evaporation portion is at least partially defined by the inner wall, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator, wherein the collection portion is at least partially defined by the inner wall. The heat dissipating device may be a multi-phase heat dissipating device.

公开(公告)号：US09329646B2

公开(公告)日：2016-05-03

申请号：US14221171

申请日：2014-03-20

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Youmin Yu ,  Dexter Tamio Chun ,  Stephen Arthur Molloy

IPC: G06F1/20 ,  F28F21/00 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28F21/00 ,  H05K7/20445

Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

Abstract translation: 一些实施方案提供了一种多层散热装置，其包括第一散热器层，第一支撑结构和第二散热器层。 第一散热器层包括第一撒布机表面和第二撒布机表面。 第一支撑结构包括第一支撑表面和第二支撑表面。 第一支撑结构的第一支撑表面联接到第一散热器的第二扩张器表面。 第二散热器层包括第三扩散器表面和第四扩散器表面。 第二散热器层的第三扩散器表面联接到第一支撑结构的第二支撑表面。 在一些实施方案中，第一支撑结构是导热粘合剂层。 在一些实施方案中，第一散热器层具有第一导热性，并且第一支撑结构具有第二导热性。

公开(公告)号：US20150268704A1

公开(公告)日：2015-09-24

申请号：US14221171

申请日：2014-03-20

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian Chiriac ,  Youmin Yu ,  Dexter Tamio Chun ,  Stephen Arthur Molloy

IPC: G06F1/20 ,  F28F21/00

CPC classification number: G06F1/20 ,  F28F21/00 ,  H05K7/20445

Abstract: Some implementations provide a multi-layer heat dissipating device that includes a first heat spreader layer, a first support structure, and a second heat spreader layer. The first heat spreader layer includes a first spreader surface and a second spreader surface. The first support structure includes a first support surface and a second support surface. The first support surface of the first support structure is coupled to the second spreader surface of the first heat spreader. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The third spreader surface of the second heat spreader layer is coupled to the second support surface of the first support structure. In some implementations, the first support structure is a thermally conductive adhesive layer. In some implementations, the first heat spreader layer has a first thermal conductivity, and the first support structure has a second thermal conductivity.

Abstract translation: 一些实施方案提供了一种多层散热装置，其包括第一散热器层，第一支撑结构和第二散热器层。 第一散热器层包括第一撒布机表面和第二撒布机表面。 第一支撑结构包括第一支撑表面和第二支撑表面。 第一支撑结构的第一支撑表面联接到第一散热器的第二扩张器表面。 第二散热器层包括第三扩散器表面和第四扩散器表面。 第二散热器层的第三扩散器表面联接到第一支撑结构的第二支撑表面。 在一些实施方案中，第一支撑结构是导热粘合剂层。 在一些实施方案中，第一散热器层具有第一导热性，并且第一支撑结构具有第二导热性。