公开(公告)号：US12119558B2

公开(公告)日：2024-10-15

申请号：US18174470

申请日：2023-02-24

Applicant: QUALCOMM Incorporated

Inventor： Julio Zegarra ,  Peter Lien ,  Sang-June Park ,  Darryl Sheldon Jessie ,  Alberto Cicalini ,  Sean Oak ,  Neil Burns

IPC: H01Q23/00 ,  H01Q1/48 ,  H01Q1/52 ,  H05K1/18

CPC classification number: H01Q23/00 ,  H01Q1/48 ,  H01Q1/526 ,  H05K1/189

Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US11594824B2

公开(公告)日：2023-02-28

申请号：US16825615

申请日：2020-03-20

Applicant: QUALCOMM Incorporated

Inventor： Julio Zegarra ,  Peter Lien ,  Sang-June Park ,  Darryl Sheldon Jessie ,  Alberto Cicalini ,  Sean Oak ,  Neil Burns

IPC: H01Q1/52 ,  H01Q23/00 ,  H01Q1/48 ,  H05K1/18

Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US11245175B2

公开(公告)日：2022-02-08

申请号：US16145100

申请日：2018-09-27

Applicant: QUALCOMM Incorporated

Inventor： Seong Heon Jeong ,  Rajneesh Kumar ,  Mohammad Ali Tassoudji ,  Darryl Jessie ,  Gurkanwal Sahota ,  Kevin Hsi Huai Wang ,  Jeong Il Kim ,  Taesik Yang ,  Thomas Myers ,  Neil Burns ,  Julio Zegarra ,  Clinton James Wilber ,  Jordan Szabo

IPC: H01Q1/24 ,  H01Q1/22 ,  H01L25/065 ,  H01L23/28 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01Q1/52 ,  H01Q9/06 ,  H01Q9/26 ,  H01Q21/28 ,  H01L23/31 ,  H01Q9/04

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

公开(公告)号：US11342961B1

公开(公告)日：2022-05-24

申请号：US17141025

申请日：2021-01-04

Applicant: QUALCOMM Incorporated

Inventor： Marvin Leroy Vis ,  Julio Zegarra ,  Thanh Duong ,  Thomas Funk ,  Erez Avigdor Falkenstein ,  Larry Flowers ,  Andrew Lejman ,  Joshua Britton ,  Tao Wang ,  Ali Morshedi

IPC: H04B17/00 ,  H04B5/00 ,  H01P5/103 ,  H04B17/29

Abstract: Methods and apparatus are disclosed for near field radio-frequency (RF) testing of devices, particularly user equipment (UEs) capable of millimeter-wave (mmWave) transmissions. An exemplary test apparatus is described that uses a transducer to facilitate near field over-the-air testing of UEs in the mmWave transmission band. The transducer may be an orthomode transducer and may include a dual-polarity port positioned in the reactive near field of an antenna of a device under test (DUT). For UE signal transmission tests, the orthomode transducer splits test signals received from the antenna of the DUT via the dual-polarity port into a pair of single-polarity RF signals. The single-polarity RF signals are separately fed through a pair of waveguide-to-coaxial adaptors into separate coaxial cables, which feed coaxial transmission versions of the single-polarity RF signals to test equipment for analysis. UE signal reception tests are also described that utilize the same or different orthomode transducer.

公开(公告)号：US10971819B2

公开(公告)日：2021-04-06

申请号：US16276957

申请日：2019-02-15

Applicant: QUALCOMM Incorporated

Inventor： Guining Shi ,  Young Jun Song ,  Allen Minh-Triet Tran ,  Mohammad Ali Tassoudji ,  Elizabeth Wyrwich ,  Julio Zegarra ,  Clinton James Wilber ,  Neil Burns ,  Jorge Fabrega Sanchez

IPC: H01Q1/00 ,  H01Q5/371 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q5/378 ,  H01Q1/24 ,  H01Q9/42 ,  H01Q21/28

Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.