Electronic device module comprising polyolefin copolymer
    1.
    发明授权
    Electronic device module comprising polyolefin copolymer 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号:US08581094B2

    公开(公告)日:2013-11-12

    申请号:US11857208

    申请日:2007-09-18

    IPC分类号: H02N6/00 H01L31/042 H01L31/00

    摘要: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    摘要翻译: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点低于约95℃,(d)基于聚合物重量,至少约15-小于约50重量%的α-烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。

    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER WITH LOW UNSATURATION AND OPTIONAL VINYL SILANE
    3.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER WITH LOW UNSATURATION AND OPTIONAL VINYL SILANE 审中-公开
    具有低不饱和度和可选的乙烯基硅烷的聚烯烃共聚物的电子器件模块

    公开(公告)号:US20110290317A1

    公开(公告)日:2011-12-01

    申请号:US13116520

    申请日:2011-05-26

    IPC分类号: H01L31/0216

    摘要: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene-based polymer composition characterized by a Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit/1,000,000C, preferably the ethylene-based polymer compositions comprise up to about 3 long chain branches/1000 carbons, more preferably from about 0.01 to about 3 long chain branches/1000 carbons; the ethylene-based polymer composition can have a ZSVR of at least 2; the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit/1,000,000C; the ethylene-based polymer compositions can have a bimodal molecular weight distribution (MWD) or a multi-modal MWD; the ethylene-based polymer compositions can have a comonomer distribution profile comprising a mono or bimodal distribution from 35° C. to 120° C., excluding purge; the ethylene-based polymer compositions can comprise a single DSC melting peak; the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl silane, (3) optionally, a free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (4) optionally, a co-agent.

    摘要翻译: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料,所述聚合物材料包括(1)基于乙烯的 聚合物组合物的特征在于共聚单体分布常数大于约45,更优选大于50,最优选大于95,高达400,优选高达200,其中组合物具有小于120总不饱和单元/ 1,000,000C 优选地,基于乙烯的聚合物组合物包含最多约3个长链分支/ 1000个碳,更优选约0.01至约3个长支链/ 1000个碳; 基于乙烯的聚合物组合物可以具有至少2的ZSVR; 基于乙烯的聚合物组合物可以进一步表征为包含少于20个亚乙烯基不饱和单元/ 1,000,000C; 乙烯基聚合物组合物可以具有双峰分子量分布(MWD)或多模态MWD; 乙烯基聚合物组合物可以具有包含35℃至120℃的单峰或双峰分布的共聚单体分布分布,不包括吹扫; 基于乙烯的聚合物组合物可以包含单个DSC熔融峰; 基于乙烯的聚合物组合物可包含约17,000至约220,000的重均分子量(Mw),(2)任选的乙烯基硅烷,(3)任选的自由基引发剂,例如过氧化物或偶氮化合物, 或光引发剂,例如二苯甲酮,和(4)任选的助剂。

    Electronic Device Module Comprising Polyolefin Copolymer
    4.
    发明申请
    Electronic Device Module Comprising Polyolefin Copolymer 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号:US20080078445A1

    公开(公告)日:2008-04-03

    申请号:US11857208

    申请日:2007-09-18

    IPC分类号: H01L31/16

    摘要: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    摘要翻译: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点低于约95℃,(d)基于聚合物重量,至少约15-小于约50重量%的α-烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。