公开(公告)号：US08581094B2

公开(公告)日：2013-11-12

申请号：US11857208

申请日：2007-09-18

申请人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

IPC分类号： H02N6/00 ,  H01L31/042 ,  H01L31/00

CPC分类号： H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点低于约95℃，（d）基于聚合物重量，至少约15-小于约50重量％的α-烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

公开(公告)号：US20080115825A1

公开(公告)日：2008-05-22

申请号：US11857195

申请日：2007-09-18

申请人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

IPC分类号： H01L31/00

CPC分类号： C08F210/02 ,  B32B17/10018 ,  B32B17/10678 ,  B32B17/10697 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

摘要： An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0.90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.

摘要翻译： 电子设备模块包括：A.至少一个电子设备，例如太阳能电池和B.与电子设备的至少一个表面紧密接触的聚合材料，聚合物材料包含乙烯多嵌段共聚物。 通常，聚烯烃材料是密度小于约0.90克/立方厘米（g / cc）的乙烯多嵌段共聚物。 聚合物材料可以完全封装电子器件，或者它可以层压到器件的一个表面。 任选地，聚合物材料还可以包含焦烧抑制剂，并且该共聚物可以保持未交联或可以交联。

公开(公告)号：US20110290317A1

公开(公告)日：2011-12-01

申请号：US13116520

申请日：2011-05-26

申请人： John Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Niemann

发明人： John Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Niemann

IPC分类号： H01L31/0216

CPC分类号： C08L23/08 ,  B32B17/10018 ,  B32B17/1055 ,  C08L2205/02 ,  H01L31/0481 ,  Y02E10/50 ,  C08L2666/06

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene-based polymer composition characterized by a Comonomer Distribution Constant greater than about 45, more preferably greater than 50, most preferably greater than 95, and as high as 400, preferably as high as 200, wherein the composition has less than 120 total unsaturation unit/1,000,000C, preferably the ethylene-based polymer compositions comprise up to about 3 long chain branches/1000 carbons, more preferably from about 0.01 to about 3 long chain branches/1000 carbons; the ethylene-based polymer composition can have a ZSVR of at least 2; the ethylene-based polymer compositions can be further characterized by comprising less than 20 vinylidene unsaturation unit/1,000,000C; the ethylene-based polymer compositions can have a bimodal molecular weight distribution (MWD) or a multi-modal MWD; the ethylene-based polymer compositions can have a comonomer distribution profile comprising a mono or bimodal distribution from 35° C. to 120° C., excluding purge; the ethylene-based polymer compositions can comprise a single DSC melting peak; the ethylene-based polymer compositions can comprise a weight average molecular weight (Mw) from about 17,000 to about 220,000, (2) optionally, a vinyl silane, (3) optionally, a free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (4) optionally, a co-agent.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合物材料包括（1）基于乙烯的 聚合物组合物的特征在于共聚单体分布常数大于约45，更优选大于50，最优选大于95，高达400，优选高达200，其中组合物具有小于120总不饱和单元/ 1,000,000C 优选地，基于乙烯的聚合物组合物包含最多约3个长链分支/ 1000个碳，更优选约0.01至约3个长支链/ 1000个碳; 基于乙烯的聚合物组合物可以具有至少2的ZSVR; 基于乙烯的聚合物组合物可以进一步表征为包含少于20个亚乙烯基不饱和单元/ 1,000,000C; 乙烯基聚合物组合物可以具有双峰分子量分布（MWD）或多模态MWD; 乙烯基聚合物组合物可以具有包含35℃至120℃的单峰或双峰分布的共聚单体分布分布，不包括吹扫; 基于乙烯的聚合物组合物可以包含单个DSC熔融峰; 基于乙烯的聚合物组合物可包含约17,000至约220,000的重均分子量（Mw），（2）任选的乙烯基硅烷，（3）任选的自由基引发剂，例如过氧化物或偶氮化合物， 或光引发剂，例如二苯甲酮，和（4）任选的助剂。

公开(公告)号：US20080078445A1

公开(公告)日：2008-04-03

申请号：US11857208

申请日：2007-09-18

申请人： Rajen Patel ,  Shaofu Wu ,  Mark Bernius ,  Mohamed Esseghir ,  Robert McGee ,  Michael Mazor ,  John Naumovitz

发明人： Rajen Patel ,  Shaofu Wu ,  Mark Bernius ,  Mohamed Esseghir ,  Robert McGee ,  Michael Mazor ,  John Naumovitz

IPC分类号： H01L31/16

CPC分类号： H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点低于约95℃，（d）基于聚合物重量，至少约15-小于约50重量％的α-烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

公开(公告)号：US20130233383A1

公开(公告)日：2013-09-12

申请号：US13701534

申请日：2011-06-06

申请人： John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Neimann

发明人： John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Neimann

IPC分类号： H01L31/0203 ,  H01L23/29

CPC分类号： H01L31/0203 ,  B32B17/10018 ,  B32B17/1055 ,  C08F210/16 ,  C08F255/02 ,  C08L23/08 ,  H01L23/293 ,  H01L31/0481 ,  H01L2924/0002 ,  Y02E10/50 ,  C08L2666/24 ,  C08F210/14 ,  C08F2500/02 ,  C08F2500/09 ,  C08F2500/11 ,  C08F2500/26 ,  H01L2924/00 ,  C08F230/08

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm3; total unsaturation of not more than 125 per 100,000 carbons; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/Mn), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145° C.) and 1H-NMR (125° C.), (2) grafted vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）乙烯互聚物，其包含 总聚合物密度不大于0.905g / cm3; 总不饱和度不超过125 / 100,000个碳; 最多3条长支链/ 1000个碳; 乙烯基-3含量小于5 / 100,000碳; 和总数（1000 / Mn）的乙烯基/ 1000个碳的总数，其中通过凝胶渗透色谱（145℃）和1 H-NMR（125°）测量乙烯基-3含量和乙烯基测量值 C.），（2）接枝的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量为基于共聚物重量的至少约0.05重量％，和（3）任选的助剂 其量为基于共聚物重量的至少约0.05重量％。

公开(公告)号：US20130087198A1

公开(公告)日：2013-04-11

申请号：US13703405

申请日：2011-06-15

申请人： John A. Naumovitz ,  Debra H. Niemann ,  Rajen M. Patel ,  Shaofu Wu

发明人： John A. Naumovitz ,  Debra H. Niemann ,  Rajen M. Patel ,  Shaofu Wu

IPC分类号： H01L31/0203 ,  H05K1/03

CPC分类号： H01L31/0203 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10697 ,  B32B17/10788 ,  C08L23/0815 ,  C08L2203/204 ,  H01L31/0481 ,  H05K1/032 ,  Y02E10/50

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer characterized as having has an average Mv and a valley temperature between the interpolymer and high crystalline fraction, Thc, such that the average Mv for a fraction above Thc from ATREF divided by average Mv of the whole polymer from ATREF (Mhc/Mp) is less than about 1.95 and wherein the copolymer has a CDBI of less than 60%, (2) optionally, a vinyl silane, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (4) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合物材料包括（1）聚烯烃共聚物， 具有在互聚物和高结晶部分Thc之间具有平均Mv和谷值温度，使得在ATREF之上的Thc以上的分数的平均Mv除以ATREF（Mhc / Mp）之外的整个聚合物的平均Mv小于 约1.95，并且其中所述共聚物的CDBI小于60％，（2）任选的乙烯基硅烷，（3）任选的自由基引发剂或光引发剂，其量为至少约0.05重量％ 共聚物，和（4）任选地，基于共聚物的重量，至少约0.05重量％的助剂。

公开(公告)号：US20130087199A1

公开(公告)日：2013-04-11

申请号：US13703639

申请日：2011-06-15

申请人： John A. Naumovitz ,  Debra H. Neimann ,  Rajen M. Patel ,  Shaofu Wu

发明人： John A. Naumovitz ,  Debra H. Neimann ,  Rajen M. Patel ,  Shaofu Wu

IPC分类号： H01L31/0203 ,  H05K1/03

CPC分类号： H01L31/0203 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10678 ,  B32B17/10697 ,  H01L23/293 ,  H01L31/0481 ,  H01L2924/0002 ,  H05K1/032 ,  Y02E10/50 ,  H01L2924/00

摘要： An electronic device module is disclosed comprising: A. at least one electronic device, and B. a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) An ethylenic polymer comprising at least 0.1 amyl branches per 1000 carbon atoms as determined by Nuclear Magnetic Resonance and both a highest peak melting temperature, Tm, in ° C., and a heat of fusion, Hf, in J/g, as determined by DSC Crystallinity, where the numerical values of Tm and Hf correspond to the relationship: Tm≧(0.2143*Hf)+79.643, and wherein the ethylenic polymer has less than about 1 mole percent ctane comonomer, and less than about 0.5 mole percent ctane, pentene, or ctane comonomer. (2) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, (3) optionally, a co-agent in an amount of at least about 0.05 wt % based upon the weight of the copolymer, and (4) optionally, a vinyl silane compound.

摘要翻译： 公开了一种电子设备模块，包括：A.至少一个电子设备，以及B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）包含至少0.1个戊基 通过核磁共振确定的每1000个碳原子的分支，并且通过DSC结晶度测定的最高峰值熔融温度Tm，℃和熔融热Hf（J / g），其中数值 Tm和Hf对应于Tm≥（0.2143×Hf）+79.643的关系，并且其中乙烯类聚合物具有小于约1摩尔％的正丁烯共聚单体，和小于约0.5摩尔％的正丁烯，戊烯或者正庚烷共聚单体。 （2）任选地，基于共聚物重量的至少约0.05重量％的自由基引发剂或光引发剂，（3）任选地，基于以下物质的至少约0.05重量％的量的助剂： 共聚物的重量，和（4）任选的乙烯基硅烷化合物。

公开(公告)号：US20130206224A1

公开(公告)日：2013-08-15

申请号：US13701060

申请日：2011-06-06

申请人： John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Niemann

发明人： John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu ,  Debra H. Niemann

IPC分类号： H05K1/03 ,  H01L31/048

CPC分类号： H05K1/0353 ,  B32B17/10018 ,  B32B17/1055 ,  B32B17/10697 ,  C08F210/16 ,  C08L23/08 ,  H01L31/0481 ,  Y02E10/50 ,  C08L2666/24 ,  C08F210/14 ,  C08F2500/08 ,  C08F2500/09 ,  C08F2500/26

摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) an ethylene interpolymer comprising an overall polymer density of not more than 0.905 g/cm3; total unsaturation of not more than 125 per 100,000 carbons; and; up to 3 long chain branches/1000 carbons; vinyl-3 content of less than 5 per 100,000 carbons; and a total number of vinyl groups/1000 carbons of less than the quantity (8000/Mn), wherein the vinyl-3 content and vinyl group measurements are measured by gel permeation chromatography (145° C.) and 1H-NMR (125° C.), (2) a graft polymer to enhance the adhesion, (3) optionally, free radical initiator or a photoinitiator in an amount of at least about 0.05 wt % based on the weight of the copolymer, and (3) optionally, a co-agent in an amount of at least about 0.05 wt% based upon the weight of the copolymer.

摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料，所述聚合物材料包含（1）乙烯互聚物，其包含 总聚合物密度不大于0.905g / cm3; 总不饱和度不超过125 / 100,000个碳; 和; 最多3条长支链/ 1000个碳; 乙烯基-3含量小于5 / 100,000碳; 和总数（1000 / Mn）的乙烯基/ 1000个碳的总数，其中通过凝胶渗透色谱（145℃）和1 H-NMR（125°）测量乙烯基-3含量和乙烯基测量值 （3）任选的自由基引发剂或光引发剂，其量为至少约0.05重量％，基于共聚物的重量，和（3）任选地， 基于共聚物的重量，至少约0.05重量％的量的助剂。

公开(公告)号：US20130167926A1

公开(公告)日：2013-07-04

申请号：US13821272

申请日：2011-09-02

申请人： Debra H. Niemann ,  John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu

发明人： Debra H. Niemann ,  John A. Naumovitz ,  Rajen M. Patel ,  Shaofu Wu

IPC分类号： H01L31/048

CPC分类号： H01L31/0481 ,  B32B17/10018 ,  B32B17/10036 ,  B32B17/1055 ,  B32B2457/12 ,  Y02E10/50

摘要： An electronic device module such as a solar cell is described. The electronic device module is made using a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising a tapered block copolymer comprising an A block, and a B block.

摘要翻译： 描述了诸如太阳能电池的电子设备模块。 电子器件模块使用与电子器件的至少一个表面紧密接触的聚合物材料制成，聚合物材料包含包含A嵌段和B嵌段的渐缩嵌段共聚物。

公开(公告)号：US20140124031A1

公开(公告)日：2014-05-08

申请号：US14131103

申请日：2012-07-03

申请人： Xuming Chen ,  Pak-Wing S. Chum ,  Kevin E. Howard ,  Leonardo C. Lopez ,  William C. Sumner ,  Shaofu Wu

发明人： Xuming Chen ,  Pak-Wing S. Chum ,  Kevin E. Howard ,  Leonardo C. Lopez ,  William C. Sumner ,  Shaofu Wu

IPC分类号： H01L31/048

CPC分类号： H01L31/0481 ,  C08K5/005 ,  H01L31/048 ,  Y02E10/50 ,  C08L27/18

摘要： The fluoropolymer compositions of the present invention generally incorporate ingredients comprising one or more fluoropolymers, an ultraviolet light protection component (hereinafter UV protection component), and optionally one or more additional ingredients if desired. The UV protection component includes a combination of at least one hindered tertiary amine (HTA) compound having a certain structure and a weight average molecular weight of at least 1000. This tertiary amine is used in combination with at least one organic, UV light absorbing compound (UVLA compound) having a weight average molecular weight greater than 500. When the HTA compound and the UVLA compound are selected according to principles of the present invention, the UV protection component provides fluoropolymer compositions with significantly improved weatherability characteristics for protecting underlying materials, features, structures, components, and/or the like. In particular, fluoropolymer compositions incorporating the UV protection component of the present invention have unexpectedly improved ability to resist blackening, coloration, or other de gradation that may be caused by UV exposure. As a consequence, devices protected by these compositions would be expected to have dramatically improved service life. The compositions have a wide range of uses but are particularly useful for forming protective layers in optoelectronic devices.

摘要翻译： 本发明的含氟聚合物组合物通常包含含有一种或多种含氟聚合物的组分，紫外线防护组分（以下称为UV保护组分），以及任选的一种或多种另外的组分。 UV保护组分包括至少一种具有一定结构和重均分子量至少为1000的受阻叔胺（HTA）化合物的组合。该叔胺与至少一种有机的UV光吸收化合物 （UVLA化合物）。当根据本发明的原理选择HTA化合物和UVLA化合物时，UV保护组分提供具有显着改善的耐候性特征的含氟聚合物组合物，用于保护下面的材料，特征 ，结构，部件和/或类似物。 特别地，结合本发明的紫外线防护组分的含氟聚合物组合物意外地改善了抗紫外线曝光引起的黑化，着色或其它脱色的能力。 因此，预期受这些组合物保护的装置将有显着改善的使用寿命。 该组合物具有广泛的用途，但特别适用于在光电器件中形成保护层。