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    Electronic device module comprising polyolefin copolymer
    6.
    发明授权
    Electronic device module comprising polyolefin copolymer 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号：US08581094B2

    公开(公告)日：2013-11-12

    申请号：US11857208

    申请日：2007-09-18

    申请人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

    发明人： Rajen M. Patel ,  Shaofu Wu ,  Mark T. Bernius ,  Mohamed Esseghir ,  Robert L. McGee ,  Michael H. Mazor ,  John Naumovitz

    IPC分类号： H02N6/00 ,  H01L31/042 ,  H01L31/00

    CPC分类号： H01L31/0481 ,  B32B17/10018 ,  B32B17/10678 ,  B32B2457/12 ,  C08L51/06 ,  H01L31/18 ,  Y02E10/50 ,  C08L2666/02 ,  C08L2666/04

    摘要： An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an α-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/α-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    摘要翻译： 一种电子设备模块，包括：A.至少一个电子设备，例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合材料，所述聚合材料包含（1）聚烯烃共聚物， （a）小于约0.90g / cc的密度，（b）通过ASTM D-882-02测量的小于约150兆帕（mPa）的2％割线模量中的至少一个），（c） 熔点低于约95℃，（d）基于聚合物重量，至少约15-小于约50重量％的α-烯烃含量，（e）小于约-35℃的Tg， 和（f）至少约50的SCBDI，（2）任选的自由基引发剂，例如过氧化物或偶氮化合物，或光引发剂，例如二苯甲酮，和（3）任选的助剂。 通常，聚烯烃共聚物是乙烯/α-烯烃共聚物。 任选地，聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂，并且共聚物可保持未交联或交联。

    STRUCTURAL INSULATION SHEATHING
    9.
    发明申请
    STRUCTURAL INSULATION SHEATHING 审中-公开
    结构绝缘护理

    公开(公告)号：US20090113831A1

    公开(公告)日：2009-05-07

    申请号：US12296066

    申请日：2007-04-30

    申请人： Dean P. DeWildt ,  Michael H. Mazor

    发明人： Dean P. DeWildt ,  Michael H. Mazor

    IPC分类号： E04B2/00 ,  E04B2/02

    CPC分类号： E04C2/296 ,  B32B5/20 ,  B32B15/20 ,  B32B27/36 ,  B32B27/40 ,  B32B29/00

    摘要： Structural insulation sheathing (SIS), preferably in the form of a panel, comprises a structural member and an insulation member. The structural member and insulation members are in intimate, planar contact with one another, and the SIS structure meets both the structural (that is, AC 269) and insulation (R>2) requirements for the North American residential market. The structural 23 member of the SIS structure is multi-layer laminated paperboard. The insulation member of the SIS is a foamed sheet of a thermoplastic material such as polyisocyanurate.

    摘要翻译： 结构绝缘护套（SIS），优选为面板的形式，包括结构构件和绝缘构件。 结构构件和绝缘构件彼此紧密，平面地接触，并且SIS结构满足北美住宅市场的结构（即AC 269）和绝缘（R> 2）要求。 SIS结构的结构23构件是多层层压纸板。 SIS的绝缘构件是诸如聚异氰脲酸酯的热塑性材料的发泡片材。