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    Expanding thermal device and system for effecting heat transfer within electronics assemblies
    2.
    发明授权
    Expanding thermal device and system for effecting heat transfer within electronics assemblies 有权

    公开(公告)号：US10292255B2

    公开(公告)日：2019-05-14

    申请号：US15158399

    申请日：2016-05-18

    Applicant: Raytheon Company

    Inventor： Brian W. Johansen ,  Justin Kasemodel ,  James M. Elliott

    IPC: H05K1/02 ,  H01L23/427 ,  H01L23/433 ,  H05K1/18 ,  H05K3/34

    Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

    Expanding thermal device and system for effecting heat transfer within electronics assemblies
    5.
    发明授权
    Expanding thermal device and system for effecting heat transfer within electronics assemblies 有权

    公开(公告)号：US10887978B2

    公开(公告)日：2021-01-05

    申请号：US16399754

    申请日：2019-04-30

    Applicant: Raytheon Company

    Inventor： Brian W. Johansen ,  Justin Kasemodel ,  James M. Elliott

    IPC: H05K7/20 ,  H05K1/02 ,  H01L23/427 ,  H01L23/433 ,  H05K1/18 ,  H05K3/34

    Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

    Tapered slot antenna including power-combining feeds
    7.
    发明授权
    Tapered slot antenna including power-combining feeds 有权

    公开(公告)号：US10749262B2

    公开(公告)日：2020-08-18

    申请号：US15896668

    申请日：2018-02-14

    Applicant: Raytheon Company

    Inventor： Daniel T. McGrath ,  Brian W. Johansen ,  Michael C. Streitwieser

    IPC: H01Q13/08 ,  H01Q21/06 ,  H01Q1/50

    Abstract: An antenna transmission system includes a dual-feedline tapered slot antenna configured to generate a radiated output signal in response to a radio frequency (RF) signal. A power divider is configured to split a source RF signal into a plurality of RF feed signals. A plurality of transmitting amplifiers convert the plurality RF feed signals into a plurality of amplified RF feed signals; and a plurality of feedlines deliver the plurality of amplified RF feed signals to the dual-feedline tapered slot antenna. The dual-feedline tapered slot antenna generates the radiated output signal in response to the plurality of amplified RF feed signals.

    Expanding Thermal Device and System for Effecting Heat Transfer within Electronics Assemblies
    8.
    发明申请
    Expanding Thermal Device and System for Effecting Heat Transfer within Electronics Assemblies 审中-公开

    公开(公告)号：US20190261502A1

    公开(公告)日：2019-08-22

    申请号：US16399754

    申请日：2019-04-30

    Applicant: Raytheon Company

    Inventor： Brian W. Johansen ,  Justin Kasemodel ,  James M. Elliott

    IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01L23/433 ,  H01L23/427

    Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers.A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

    TAPERED SLOT ANTENNA INCLUDING POWER-COMBINING FEEDS
    9.
    发明申请
    TAPERED SLOT ANTENNA INCLUDING POWER-COMBINING FEEDS 审中-公开

    公开(公告)号：US20190252787A1

    公开(公告)日：2019-08-15

    申请号：US15896668

    申请日：2018-02-14

    Applicant: Raytheon Company

    Inventor： Daniel T. McGrath ,  Brian W. Johansen ,  Michael C. Streitwieser

    IPC: H01Q13/08 ,  H01Q13/18 ,  H01Q1/38 ,  H01Q21/06

    Abstract: An antenna transmission system includes a dual-feedline tapered slot antenna configured to generate a radiated output signal in response to a radio frequency (RF) signal. A power divider is configured to split a source RF signal into a plurality of RF feed signals. A plurality of transmitting amplifiers convert the plurality RF feed signals into a plurality of amplified RF feed signals; and a plurality of feedlines deliver the plurality of amplified RF feed signals to the dual-feedline tapered slot antenna. The dual-feedline tapered slot antenna generates the radiated output signal in response to the plurality of amplified RF feed signals.

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