Abstract:
An antenna is provided and includes a radiator assembly extending along a first plane, a patterned ferrite layer extending along a second plane and a band stop frequency selective surface (FSS) extending along a third plane. The third plane of the band stop FSS is axially interposed between the first plane of the radiator assembly and the second plane of the patterned ferrite layer.
Abstract:
An array antenna includes a modular, multi-layer, multi-balun board structure for use in feeding a dual polarization radiating element. In some embodiments, contacts on a multi-balun board structure may be directly conductively coupled to corresponding feed points of a dual polarization radiating element during antenna assembly. The multi-balun board structure may be inserted into an opening within an aperture board of an array antenna before the contacts are secured to the feed points. Dual balun board structures may be provided for some or all of the radiating elements on the aperture board.
Abstract:
An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.
Abstract:
A low loss and low packaged volume coaxial RF cable according to embodiments is configured to conduct electrical signals, such as RF energy signals. The coaxial RF cable includes a three-layer structure that includes a non-conductive composite braid disposed between a first conductive composite braid and a second conductive composite braid. The coaxial cable is a ultra-flexible, compressible conductor configured to be folded multiple times within a low volume area without damage.
Abstract:
A low loss and low packaged volume coaxial RF cable according to embodiments is configured to conduct electrical signals, such as RF energy signals. The coaxial RF cable includes a three-layer structure that includes a non-conductive composite braid disposed between a first conductive composite braid and a second conductive composite braid. The coaxial cable is a ultra-flexible, compressible conductor configured to be folded multiple times within a low volume area without damage.
Abstract:
An antenna is provided and includes a radiator assembly extending along a first plane, a patterned ferrite layer extending along a second plane and a band stop frequency selective surface (FSS) extending along a third plane. The third plane of the band stop FSS is axially interposed between the first plane of the radiator assembly and the second plane of the patterned ferrite layer.
Abstract:
Wideband balun having good performance characteristics for use in feeding differential antenna elements in array antennas, balanced amplifier circuits and other applications is described. Also described is a common mode isolation circuit suitable for integration with the balun.
Abstract:
Wideband balun having good performance characteristics for use in feeding differential antenna elements in array antennas, balanced amplifier circuits and other applications is described. Also described is a common mode isolation circuit suitable for integration with the balun.
Abstract:
An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.
Abstract:
An array antenna includes a modular, multi-layer, multi-balun board structure for use in feeding a dual polarization radiating element. In some embodiments, contacts on a multi-balun board structure may be directly conductively coupled to corresponding feed points of a dual polarization radiating element during antenna assembly. The multi-balun board structure may be inserted into an opening within an aperture board of an array antenna before the contacts are secured to the feed points. Dual balun board structures may be provided for some or all of the radiating elements on the aperture board.