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公开(公告)号：US20210076505A1
公开(公告)日：2021-03-11
申请号：US17011447
申请日：2020-09-03
Applicant: Raytheon Company
Inventor： Justin A. Kasemodel , Justin E. Stroup , Allen L. Kelly , Amanda M. Couch , Randy L. Smith
Abstract: An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.
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公开(公告)号：US20250112380A1
公开(公告)日：2025-04-03
申请号：US18477594
申请日：2023-09-29
Applicant: Raytheon Company
Inventor： Robert S. Isom , Randy L. Smith , Kelsey Joe Viani-Wittwer , Paul Raymond Winniford
Abstract: A wideband antenna array includes a wide angle impedance matching (waim) board, a manifold board including multiple tower receiving features and at least one conductive tower extending outward from the manifold board and received in a corresponding tower receiving feature. Each of the at least one conductive towers including at least one metalized component. The metalized component forms a circuit connecting the manifold board to the waim board. The waim board is adhered to a first end of the at least one conductive tower opposite the manifold board.
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公开(公告)号：US12108542B2
公开(公告)日：2024-10-01
申请号：US17011447
申请日：2020-09-03
Applicant: Raytheon Company
Inventor： Justin A. Kasemodel , Justin E. Stroup , Allen L. Kelly , Amanda M. Couch , Randy L. Smith
CPC classification number: H05K3/3494 , B23K1/0016 , B23K37/0426 , B23K2101/42 , H05K1/0206 , H05K1/113 , H05K3/3436 , H05K2203/0195 , H05K2203/1121
Abstract: An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.
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