公开(公告)号：US12108542B2

公开(公告)日：2024-10-01

申请号：US17011447

申请日：2020-09-03

Applicant: Raytheon Company

Inventor： Justin A. Kasemodel ,  Justin E. Stroup ,  Allen L. Kelly ,  Amanda M. Couch ,  Randy L. Smith

IPC: H05K3/34 ,  B23K1/00 ,  B23K37/04 ,  B23K101/42 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K37/0426 ,  B23K2101/42 ,  H05K1/0206 ,  H05K1/113 ,  H05K3/3436 ,  H05K2203/0195 ,  H05K2203/1121

Abstract: An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

公开(公告)号：US20210076505A1

公开(公告)日：2021-03-11

申请号：US17011447

申请日：2020-09-03

Applicant: Raytheon Company

Inventor： Justin A. Kasemodel ,  Justin E. Stroup ,  Allen L. Kelly ,  Amanda M. Couch ,  Randy L. Smith

IPC: H05K3/34 ,  B23K1/00 ,  B23K37/04

Abstract: An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.