公开(公告)号：US20230230770A1

公开(公告)日：2023-07-20

申请号：US17901051

申请日：2022-09-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： So Jung AN ,  Hyung Jong CHOI ,  Yoo Jeong LEE ,  Chung Yeol LEE ,  Kwang Yeun WON ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Jong Ho LEE

IPC: H01G4/232 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/30

Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.

公开(公告)号：US20230215646A1

公开(公告)日：2023-07-06

申请号：US17948499

申请日：2022-09-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Yeun WON ,  Jong Ho LEE ,  Yoo Jeong LEE ,  Hyung Jong CHOI ,  Chung Yeol LEE ,  So Jung AN ,  Woo Kyung SUNG ,  Myung Jun PARK

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/224

CPC classification number: H01G4/248 ,  H01G4/30 ,  H01G4/224

Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.

公开(公告)号：US20230238182A1

公开(公告)日：2023-07-27

申请号：US17943606

申请日：2022-09-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jong CHOI ,  Yoo Jeong LEE ,  Chung Yeol LEE ,  Kwang Yeun WON ,  So Jung AN ,  Kang Ha LEE ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Jong Ho LEE

IPC: H01G4/224 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232

CPC classification number: H01G4/224 ,  H01G4/30 ,  H01G4/248 ,  H01G4/2325

Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.

公开(公告)号：US20230223195A1

公开(公告)日：2023-07-13

申请号：US17972722

申请日：2022-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jong CHOI ,  Yoo Jeong LEE ,  Chung Yeol LEE ,  Kwang Yeun WON ,  So Jung AN ,  Kang Ha LEE ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Jong Ho LEE

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/012

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H01G4/012

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.

公开(公告)号：US20240203646A1

公开(公告)日：2024-06-20

申请号：US18382204

申请日：2023-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Won PARK ,  Hyung Jong CHOI ,  So Jung AN ,  Yoo Jeong LEE ,  Kwang Yeun WON ,  Woo Kyung SUNG ,  Byung Jun JEON ,  Chul Seung LEE

IPC: H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.

公开(公告)号：US20230162920A1

公开(公告)日：2023-05-25

申请号：US17961490

申请日：2022-10-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jong CHOI ,  Yoo Jeong LEE ,  Chung Yeol LEE ,  Kwang Yeun WON ,  So Jung AN ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Jong Ho LEE

IPC: H01G4/232 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction.

公开(公告)号：US20240312718A1

公开(公告)日：2024-09-19

申请号：US18583094

申请日：2024-02-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： So Jung AN ,  Hyung Jong CHOI ,  Jung Won PARK ,  Yoo Jeong LEE ,  Kwang Yeun WON ,  Woo Kyung SUNG ,  Byung Jun JEON ,  Chul Seung LEE

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/2325

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.

公开(公告)号：US20240222030A1

公开(公告)日：2024-07-04

申请号：US18372870

申请日：2023-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yoo Jeong LEE ,  Kwang Yeun WON ,  Hyung Jong CHOI ,  So Jung AN ,  Jung Won PARK ,  Woo Kyung SUNG ,  Byung Jun JEON ,  Chul Seung LEE

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.

公开(公告)号：US20230260708A1

公开(公告)日：2023-08-17

申请号：US18085037

申请日：2022-12-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： So Jung AN ,  Yoo Jeong LEE ,  Hyung Jong CHOI ,  Chung Yeol LEE ,  Kwang Yeun WON ,  Woo Kyung SUNG ,  Myung Jun PARK ,  Jong Ho LEE

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/224 ,  H01G4/232 ,  H01G4/008

CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/224 ,  H01G4/2325 ,  H01G4/008

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.

公开(公告)号：US20220076894A1

公开(公告)日：2022-03-10

申请号：US17529889

申请日：2021-11-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Yeol LEE ,  Ji Hong JO ,  Yoo Jeong LEE ,  Myung Jun PARK ,  Jong Ho LEE ,  Hye Young CHOI ,  Jae Hyun LEE ,  Hyun Hee GU

IPC: H01G4/30 ,  H01G4/012 ,  H01G2/02 ,  H01G4/12 ,  H01G4/008

Abstract: A capacitor component includes a body including a dielectric layer, a first electrode and a second internal electrode, laminated in a first direction, opposing each other, and a first cover portion and a second cover portion, disposed on outermost surfaces of the first and second internal electrodes, each having a thickness of 25 μm or less, a first electrode layer and a second electrode layer, respectively disposed on both external surfaces of the body in a second direction perpendicular to the first direction and respectively, and plating layers, respectively disposed on the first and second electrode layers. A metal oxide is disposed on a boundary between the first electrode layer and the plating layer and a boundary between the second electrode layer and the plating layer.