公开(公告)号：US11984536B2

公开(公告)日：2024-05-14

申请号：US17308345

申请日：2021-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehun Kim ,  Yongmin Kim ,  Sungwon Ko ,  Bokyoung Kim ,  Jinhwan Kim ,  Wongoo Hur

IPC: H01L33/38 ,  H01L33/46 ,  H01L33/62 ,  H01L33/32 ,  H01L33/42

CPC classification number: H01L33/382 ,  H01L33/46 ,  H01L33/62 ,  H01L33/32 ,  H01L33/42

Abstract: A semiconductor light emitting device includes a first electrode layer, a light emitting structure on the first electrode layer, a transparent electrode layer between the first electrode layer and the light emitting structure, an interlayer insulating layer between the transparent electrode layer and the first electrode layer, and having first and second openings, a second electrode layer between the first electrode layer and the interlayer insulating layer, and connected to the transparent electrode layer, and an electrode pad contacting the second electrode layer, each of the first openings and at least one of the second openings define one group to have at least first and second groups, the first group being closer to the electrode pad than the second group is, and a distance between the first and second openings in the first group being greater than a distance between the first and second openings in the second group.

公开(公告)号：US11888091B2

公开(公告)日：2024-01-30

申请号：US17135686

申请日：2020-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehun Kim ,  Sungwon Ko ,  Bokyoung Kim ,  Jinhwan Kim ,  Wongoo Hur

IPC: H01L33/38 ,  H01L33/56 ,  H01L33/64 ,  H01L33/40

CPC classification number: H01L33/38 ,  H01L33/405 ,  H01L33/56 ,  H01L33/644

Abstract: A semiconductor light emitting device includes a substrate structure, first and second regions and a main region; a light emitting structure, first and second electrode layers, an interlayer insulating layer, and a pad electrode layer. The light emitting structure is provided on the third region. The first electrode layer is provided between the substrate structure and the light emitting structure, and has a first electrode extension that extends into the first region. The second electrode layer is provided between the first electrode layer and the light emitting structure, and has a second electrode extension that extends into the second region. The interlayer insulating layer is provided between the first and second electrode layers, and has an opening exposing a portion of the first electrode extension. The pad electrode layer is provided on the interlayer insulating layer, and is connected to the portion of the first electrode extension through the opening.

公开(公告)号：US20210367108A1

公开(公告)日：2021-11-25

申请号：US17135686

申请日：2020-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehun Kim ,  Sungwon Ko ,  Bokyoung Kim ,  Jinhwan Kim ,  Wongoo Hur

IPC: H01L33/38 ,  H01L33/40 ,  H01L33/64 ,  H01L33/56

Abstract: A semiconductor light emitting device includes a substrate structure, first and second regions and a main region; a light emitting structure, first and second electrode layers, an interlayer insulating layer, and a pad electrode layer. The light emitting structure is provided on the third region. The first electrode layer is provided between the substrate structure and the light emitting structure, and has a first electrode extension that extends into the first region. The second electrode layer is provided between the first electrode layer and the light emitting structure, and has a second electrode extension that extends into the second region. The interlayer insulating layer is provided between the first and second electrode layers, and has an opening exposing a portion of the first electrode extension. The pad electrode layer is provided on the interlayer insulating layer, and is connected to the portion of the first electrode extension through the opening.

公开(公告)号：US20240073993A1

公开(公告)日：2024-02-29

申请号：US18216121

申请日：2023-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongil HAHM ,  Jinhwan Kim ,  Hyunsoo Kim

IPC: H04W76/30 ,  H04W8/00 ,  H04W76/19

CPC classification number: H04W76/30 ,  H04W8/005 ,  H04W76/19

Abstract: An electronic apparatus includes at least one communication interface; and at least one processor operatively coupled with the at least one communication interface and configured to control the electronic apparatus, wherein the processor may be further configured to: based on a release of a communication connection with a first access point, control the at least one communication interface to perform scanning for rejoining with the first access point, and based on reception of a signal including identification information of the electronic apparatus from a user terminal device through the at least one communication interface, control the at least one communication interface to operate as a second access point.