公开(公告)号：US20180174822A1

公开(公告)日：2018-06-21

申请号：US15656305

申请日：2017-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjo TAK ,  Sammook KANG ,  Mihyun KIM ,  Junyoun KIM

IPC: H01L21/02

CPC classification number: H01L21/0254 ,  H01L21/02381 ,  H01L21/02458 ,  H01L21/02507 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/02664

Abstract: A method of fabricating a nitride semiconductor substrate including forming a buffer layer on a surface of a growth substrate, growing a first nitride semiconductor layer on the buffer layer, growing a second nitride semiconductor layer on the first nitride semiconductor layer, and removing the growth substrate may be provided. The forming a buffer layer may deform the surface of the growth substrate to have a convex shape. The forming a buffer layer and the growing a first nitride semiconductor layer may be performed within a first process chamber. The growing a second nitride semiconductor layer and the removing the growth substrate may be performed within a second process chamber.

公开(公告)号：US20200052428A1

公开(公告)日：2020-02-13

申请号：US16511331

申请日：2019-07-15

Applicant: Samsung Electronics Co., Ltd. ,  Hyupjinconnector Co., Ltd.

Inventor： Yonglak CHO ,  Jeongki PARK ,  Mihyun KIM ,  Jeongyong LEE ,  Choonggeun LEE ,  Dongjin CHUNG ,  Jangwon HUR ,  Jiwoo LEE

IPC: H01R13/24 ,  H05K1/18 ,  H01Q5/307 ,  H01Q1/24

Abstract: The disclosure includes a housing including a first plate, a second plate, and a side member surrounding a space between the first and second plates, a printed circuit board disposed in the space and including an opening, a first conductive structure disposed in the space, a second conductive structure disposed in the space, and a flexible conductive member located between the first and second conductive structures through the opening to construct an electrical path between the first and second conductive structures. The flexible conductive member may include a base, a first flexible portion having a first height from the base, protruding from the base toward the first plate, and in contact with the first conductive structure, and a second flexible portion having a second height from the base, protruding from the base toward the second plate, and in contact with the second conductive structure.

公开(公告)号：US20240021661A1

公开(公告)日：2024-01-18

申请号：US18218664

申请日：2023-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye YEON ,  Hankyu SEONG ,  Suhyun JO ,  Sammook KANG ,  Mihyun KIM ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L27/156 ,  H01L33/382 ,  H01L33/502

Abstract: A display apparatus, including a circuit substrate including driver circuits and first bonding electrodes, and a pixel array on the circuit substrate and including a plurality of pixels each including first to third sub-pixels, and second bonding electrodes bonded to the first bonding electrodes, the pixel array further including, a plurality of first LED cells corresponding to the first and third sub-pixels, respectively, and each including a first conductivity-type semiconductor layer, a first active layer, and a second conductivity-type semiconductor layer, a plurality of second LED cells corresponding to the second sub-pixels, respectively, and each including the first conductivity-type semiconductor layer, a second active layer, and the second conductivity-type semiconductor layer, a first electrode extending to cover upper surfaces of the plurality of first and second LED cells and connected to the first conductivity-type semiconductor layers in common.