公开(公告)号：US20180174822A1

公开(公告)日：2018-06-21

申请号：US15656305

申请日：2017-07-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjo TAK ,  Sammook KANG ,  Mihyun KIM ,  Junyoun KIM

IPC: H01L21/02

CPC classification number: H01L21/0254 ,  H01L21/02381 ,  H01L21/02458 ,  H01L21/02507 ,  H01L21/0262 ,  H01L21/02639 ,  H01L21/02664

Abstract: A method of fabricating a nitride semiconductor substrate including forming a buffer layer on a surface of a growth substrate, growing a first nitride semiconductor layer on the buffer layer, growing a second nitride semiconductor layer on the first nitride semiconductor layer, and removing the growth substrate may be provided. The forming a buffer layer may deform the surface of the growth substrate to have a convex shape. The forming a buffer layer and the growing a first nitride semiconductor layer may be performed within a first process chamber. The growing a second nitride semiconductor layer and the removing the growth substrate may be performed within a second process chamber.

公开(公告)号：US20240021661A1

公开(公告)日：2024-01-18

申请号：US18218664

申请日：2023-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye YEON ,  Hankyu SEONG ,  Suhyun JO ,  Sammook KANG ,  Mihyun KIM ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L27/156 ,  H01L33/382 ,  H01L33/502

Abstract: A display apparatus, including a circuit substrate including driver circuits and first bonding electrodes, and a pixel array on the circuit substrate and including a plurality of pixels each including first to third sub-pixels, and second bonding electrodes bonded to the first bonding electrodes, the pixel array further including, a plurality of first LED cells corresponding to the first and third sub-pixels, respectively, and each including a first conductivity-type semiconductor layer, a first active layer, and a second conductivity-type semiconductor layer, a plurality of second LED cells corresponding to the second sub-pixels, respectively, and each including the first conductivity-type semiconductor layer, a second active layer, and the second conductivity-type semiconductor layer, a first electrode extending to cover upper surfaces of the plurality of first and second LED cells and connected to the first conductivity-type semiconductor layers in common.

公开(公告)号：US20210013236A1

公开(公告)日：2021-01-14

申请号：US16752187

申请日：2020-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tan SAKONG ,  Sammook KANG

IPC: H01L27/12 ,  H01L27/15 ,  H01L33/50 ,  H01L33/54 ,  H01L33/38

Abstract: A light emitting device package includes: a plurality of light emitting structures, each having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer; a common first electrode extended in parallel with first and second surfaces of the plurality of light emitting structures at a level different from levels of the first and second surfaces while connecting respective first conductivity-type semiconductor layers of the plurality of light emitting structures; a plurality of second electrodes connected to respective second conductivity-type semiconductor layers of the plurality of light emitting structures; a plurality of wavelength converters; and a molded portion having a partition wall structure separating the plurality of wavelength converters from each other, and including a material having a modulus lower than a modulus of the plurality of light emitting structures.