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    ELECTRONIC APPARATUS, METHOD FOR MANUFACTURING LED MODULE AND COMPUTER-READABLE RECORDING MEDIUM
    2.
    发明申请
    ELECTRONIC APPARATUS, METHOD FOR MANUFACTURING LED MODULE AND COMPUTER-READABLE RECORDING MEDIUM 审中-公开

    公开(公告)号：US20200020740A1

    公开(公告)日：2020-01-16

    申请号：US16426846

    申请日：2019-05-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Doyoung KWAG ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

    IPC: H01L27/15 ,  H01L33/00 ,  G01N21/95 ,  H01L21/66

    Abstract: An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.

    DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
    3.
    发明公开
    DISPLAY MODULE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240313183A1

    公开(公告)日：2024-09-19

    申请号：US18663886

    申请日：2024-05-14

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk LEE ,  Seungryong HAN

    IPC: H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L33/42

    CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/0093 ,  H01L33/42

    Abstract: A display module is provided and includes an inorganic light emitting device; a first electrode at a first side of the inorganic light emitting device; a second electrode at a second side of the inorganic light emitting device, opposite to the first side; a first film layer including first conductive particles, the first film layer being between the first substrate and the inorganic light emitting device; and a second film layer including second conductive particles, the second film layer being between the second substrate and the inorganic light emitting device, wherein the first film layer is configured to connect the first electrode and the inorganic light emitting device through at least one of the first conductive particles, and wherein the second film layer is configured to connect the second electrode and the inorganic light emitting device through at least one of the second conductive particles.

    DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210358896A1

    公开(公告)日：2021-11-18

    申请号：US17244471

    申请日：2021-04-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Dongyeob LEE

    IPC: H01L25/16 ,  H01L23/00

    Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.

    LED TRANSFER DEVICE COMPRISING MASK AND LED TRANSFERRING METHOD USING THE SAME
    6.
    发明申请
    LED TRANSFER DEVICE COMPRISING MASK AND LED TRANSFERRING METHOD USING THE SAME 审中-公开

    公开(公告)号：US20200243358A1

    公开(公告)日：2020-07-30

    申请号：US16731468

    申请日：2019-12-31

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Doyoung KWAG ,  Eunhye KIM ,  Sangmoo PARK ,  Minsub OH ,  Yoonsuk LEE

    IPC: H01L21/67 ,  H01L33/62 ,  H01L25/075 ,  H01L21/683

    Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.

    MICRO LED ELEMENT AND MICRO LED DISPLAY MODULE HAVING THE SAME
    8.
    发明申请
    MICRO LED ELEMENT AND MICRO LED DISPLAY MODULE HAVING THE SAME 有权

    公开(公告)号：US20210050498A1

    公开(公告)日：2021-02-18

    申请号：US16926161

    申请日：2020-07-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk LEE ,  Eunhye KIM ,  Dongyeob LEE ,  Sangmoo PARK

    IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00

    Abstract: A light emitting diode (LED) element is provided. The LED element includes: an active layer configured to generate light; a first semiconductor layer disposed on a first surface of the active layer and doped with an n-type dopant; a second semiconductor layer disposed on a second surface of the active layer opposite to the first surface, the second semiconductor layer being doped with a p-type dopant; a first electrode pad and a second electrode pad electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, the first electrode pad comprising a first contact surface and the second electrode pad comprising a second contact surface; and a conductive filler disposed on at least one contact surface from among the first contact surface and the second contact surface to increase a contact area of the at least one contact surface.

    MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFERRING METHOD USING THE SAME
    10.
    发明申请
    MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFERRING METHOD USING THE SAME 审中-公开

    公开(公告)号：US20200313035A1

    公开(公告)日：2020-10-01

    申请号：US16832884

    申请日：2020-03-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yoonsuk LEE ,  Sangmoo PARK ,  Doyoung KWAG ,  Byungchul KIM ,  Eunhye KIM ,  Minsub OH ,  Dongyeob LEE

    IPC: H01L33/00 ,  H01L33/62

    Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

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